4-1571551-5 TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 18POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Nickel
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
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Технічний опис 4-1571551-5 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 18POS GOLD, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube, Contact Material - Post: Nickel, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Finish - Post: Gold.
Інші пропозиції 4-1571551-5
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 4-1571551-5 | Виробник : TE Connectivity |
IC & Component Sockets SOLID FRAME PC 18 |
товару немає в наявності |