4-1571551-9 TE Connectivity
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 431.21 грн |
| 10+ | 423.91 грн |
| 25+ | 414.91 грн |
| 50+ | 376.97 грн |
| 100+ | 330.74 грн |
| 250+ | 298.40 грн |
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Технічний опис 4-1571551-9 TE Connectivity
Description: CONN IC DIP SOCKET 28POS GOLD, Contact Material - Post: Nickel, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.
Інші пропозиції 4-1571551-9
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
|
4-1571551-9 | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 28POS GOLDContact Material - Post: Nickel Contact Finish Thickness - Post: 25.0µin (0.63µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 425 шт В кошику од. на суму грн. |
| 4-1571551-9 |
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Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Nickel
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Nickel
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 425 шт
В кошику
од. на суму грн.



