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4-1571552-9

4-1571552-9 TE Connectivity

DDEController?Action=srchrtrv&DocNm=1571552&DocType=Customer+Drawing&DocLang=English Виробник: TE Connectivity
IC & Component Sockets PC MOUNT 28 PIN
на замовлення 1396 шт:
термін постачання 21-30 дні (днів)
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Технічний опис 4-1571552-9 TE Connectivity

Description: CONN IC DIP SOCKET 28POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Copper, Part Status: Obsolete.

Інші пропозиції 4-1571552-9

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4-1571552-9 4-1571552-9 Виробник : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571552&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Copper
Part Status: Obsolete
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