5-104655-3 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 5-104655-3 - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366990
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbindertyp: PCB-Stiftleiste
Produktpalette: AMPMODU 50/50 Grid Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: To Be Advised
| Кількість | Ціна |
|---|---|
| 33+ | 288.98 грн |
| 99+ | 257.41 грн |
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Технічний опис 5-104655-3 TE CONNECTIVITY / PARTNER STOCK
Description: CONN HEADER SMD 20POS 1.27MM, Features: Board Lock, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 0.5A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board, Operating Temperature: -65°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Circular, Insulation Height: 0.226" (5.74mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Інші пропозиції 5-104655-3 за ціною від 212.49 грн до 518.07 грн
| Фото | Назва | Виробник | Інформація |
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5-104655-3 | Виробник : TE Connectivity AMP Connectors |
Description: CONN HEADER SMD 20POS 1.27MM Features: Board Lock Packaging: Tube Connector Type: Header Current Rating (Amps): 0.5A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board Operating Temperature: -65°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Circular Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
на замовлення 5797 шт: термін постачання 21-31 дні (днів) |
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5-104655-3 | Виробник : TE Connectivity |
Headers & Wire Housings 20 POS SMT HDR VERT DUAL ROW |
на замовлення 323 шт: термін постачання 21-30 дні (днів) |
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5-104655-3 | Виробник : TE CONNECTIVITY - AMP |
Description: TE CONNECTIVITY - AMP - 5-104655-3 - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: AMPMODU 50/50 Grid productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (04-Feb-2026) |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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