5-104894-3 TE Connectivity

Description: CONN HEADER SMD R/A 30POS 1.27MM, Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.213" (5.40mm), Contact Shape: Circular, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Brass, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -65°C ~ 105°C, Style: Board to Board, Number of Rows: 2, Number of Positions: 30, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 0.5A per Contact, Connector Type: Header, Features: Board Lock, Solder Retention, Packaging: Tube.