Технічний опис 506-AG12D-LF TE Connectivity
Description: CONN IC DIP SOCKET 6POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 6 (2 x 3), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.
Інші пропозиції 506-AG12D-LF
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
| 506-AG12D-LF | TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 6POS TINContact Material - Post: Beryllium Copper Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 12800 шт В кошику од. на суму грн. | |
 |
506-AG12D-LF | TE Connectivity / AMP |
IC & Component Sockets DIP .3CL 06P S/M CFRM SN/SN |
товару немає в наявності |
В кошику од. на суму грн. |
| 506-AG12D-LF |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 6POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 6POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 12800 шт
В кошику
од. на суму грн.
| 506-AG12D-LF |
|
Виробник: TE Connectivity / AMP
IC & Component Sockets DIP .3CL 06P S/M CFRM SN/SN
IC & Component Sockets DIP .3CL 06P S/M CFRM SN/SN
товару немає в наявності
В кошику
од. на суму грн.