528-AG12D-ES-LF TE Connectivity
| Кількість | Ціна без ПДВ |
|---|---|
| 37+ | 383.76 грн |
| 85+ | 377.16 грн |
| 200+ | 369.62 грн |
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Технічний опис 528-AG12D-ES-LF TE Connectivity
Description: CONN IC DIP SOCKET 28POS TIN, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube, Contact Material - Post: Nickel, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Інші пропозиції 528-AG12D-ES-LF
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 528-AG12D-ES-LF | TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 28POS TINContact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Tube Contact Material - Post: Nickel Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |
 |
528-AG12D-ES-LF | TE Connectivity |
IC & Component Sockets 528-AG12D-ES-LF 500 DIP,SN/SN |
товару немає в наявності |
В кошику од. на суму грн. |
| 528-AG12D-ES-LF |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS TIN
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Nickel
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 28POS TIN
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Nickel
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 528-AG12D-ES-LF |
|
Виробник: TE Connectivity
IC & Component Sockets 528-AG12D-ES-LF 500 DIP,SN/SN
IC & Component Sockets 528-AG12D-ES-LF 500 DIP,SN/SN
товару немає в наявності
В кошику
од. на суму грн.