531129-2 TE Connectivity
Виробник: TE ConnectivityConn Board to Board RCP 10 POS 1.9mm Solder Lug ST Top Entry Panel Mount Package
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Відгуки про товар
Написати відгук
Технічний опис 531129-2 TE Connectivity
Description: CONN RCPT 10POS 0.075 GOLD PCB, Packaging: Bulk, Features: Mating Guide, Connector Type: Receptacle, Mounting Type: Through Hole, Number of Positions: 10, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder Eyelet, Insulation Color: Blue, Pitch - Mating: 0.075" (1.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Post: Tin-Lead, Part Status: Active, Contact Length - Post: 0.200" (5.08mm), Insulation Height: 0.400" (10.16mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Інші пропозиції 531129-2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
531129-2 | Виробник : TE Connectivity |
Conn Board to Board RCP 10 POS 1.9mm Solder Lug ST Top Entry Panel Mount Package |
товару немає в наявності |
|
| 531129-2 | Виробник : TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 10POS 0.075 GOLD PCB Packaging: Bulk Features: Mating Guide Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 10 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Eyelet Insulation Color: Blue Pitch - Mating: 0.075" (1.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.200" (5.08mm) Insulation Height: 0.400" (10.16mm) Row Spacing - Mating: 0.125" (3.18mm) Number of Rows: 2 |
товару немає в наявності |
||
 |
531129-2 | Виробник : TE Connectivity / AMP |
Headers & Wire Housings 2 ROW BOX RECP 10 POS STAG |
товару немає в наявності |