Технічний опис 808-AG11D-ESL-LF TE Connectivity
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Copper.
Інші пропозиції 808-AG11D-ESL-LF
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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808-AG11D-ESL-LF | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Copper |
товару немає в наявності |
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808-AG11D-ESL-LF | Виробник : TE Connectivity |
IC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN |
товару немає в наявності |