Технічний опис 822114-3 AMP
Description: CONN SOCKET PQFP 144POS TIN-LEAD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: QFP, Number of Positions or Pins (Grid): 144 (4 x 36), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції 822114-3
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
822114-3 | TE Connectivity AMP Connectors |
 Description: CONN SOCKET PQFP 144POS TIN-LEADFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: QFP Number of Positions or Pins (Grid): 144 (4 x 36) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. |
| 822114-3 | TE Connectivity / AMP |
IC & Component Sockets MICRO-PITCH METRIC 504 |
товару немає в наявності |
В кошику од. на суму грн. |
| 822114-3 |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN SOCKET PQFP 144POS TIN-LEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: QFP
Number of Positions or Pins (Grid): 144 (4 x 36)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PQFP 144POS TIN-LEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: QFP
Number of Positions or Pins (Grid): 144 (4 x 36)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 822114-3 |
|
Виробник: TE Connectivity / AMP
IC & Component Sockets MICRO-PITCH METRIC 504
IC & Component Sockets MICRO-PITCH METRIC 504
товару немає в наявності
В кошику
од. на суму грн.