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Технічний опис 824-AG31D-ESL-LF TE Connectivity
Description: CONN IC DIP SOCKET 24POS GOLD, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Material - Post: Copper, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH.
Інші пропозиції 824-AG31D-ESL-LF
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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824-AG31D-ESL-LF | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 24POS GOLDContact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Copper Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH |
товару немає в наявності |