| Кількість | Ціна |
|---|---|
| 1+ | 1259.91 грн |
| 10+ | 901.39 грн |
| 20+ | 682.79 грн |
| 60+ | 682.09 грн |
| 100+ | 670.25 грн |
| 500+ | 661.89 грн |
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Технічний опис 824-AG31D TE Connectivity
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Material - Post: Copper Alloy.
Інші пропозиції 824-AG31D
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
824-AG31D | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Material - Post: Copper Alloy |
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