828-AG11D-ESL-LF TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP ConnectorsDescription: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Copper
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Технічний опис 828-AG11D-ESL-LF TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Copper.
Інші пропозиції 828-AG11D-ESL-LF
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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828-AG11D-ESL-LF | Виробник : TE Connectivity |
IC & Component Sockets DIP .6CL 28P S&R OFRM AU/SN |
товару немає в наявності |