BM10NB(0.8)-10DS-0.4V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
| Кількість | Ціна |
|---|---|
| 8+ | 43.24 грн |
| 10+ | 35.13 грн |
| 25+ | 32.98 грн |
| 50+ | 29.46 грн |
| 100+ | 28.05 грн |
| 250+ | 26.29 грн |
| 500+ | 24.62 грн |
| 1000+ | 23.45 грн |
| 2500+ | 21.98 грн |
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Технічний опис BM10NB(0.8)-10DS-0.4V(51) Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Інші пропозиції BM10NB(0.8)-10DS-0.4V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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BM10NB(0.8)-10DS-0.4V(51 | Виробник : Hirose |
Conn Board to Board RCP 10 POS 0.4mm Solder ST SMD T/R |
товару немає в наявності |
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BM10NB(0.8)-10DS-0.4V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
товару немає в наявності |
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BM10NB(0.8)-10DS-0.4V(51) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.8 HGHT |
товару немає в наявності |