DF9-25S-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 25POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
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Технічний опис DF9-25S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 25POS SMD TIN, Number of Rows: 2, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 25, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Receptacle, Outer Shroud Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції DF9-25S-1V(32) за ціною від 55.69 грн до 108.35 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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DF9-25S-1V(32) | Hirose Electric Co Ltd |
Description: CONN RCPT 25POS SMD TINContact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 25 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Receptacle, Outer Shroud Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Number of Rows: 2 Mated Stacking Heights: 4.3mm |
на замовлення 1127 шт: термін постачання 21-31 дні (днів) |
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DF9-25S-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 25P TIN PLATING |
на замовлення 1596 шт: термін постачання 21-30 дні (днів) |
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| DF9-25S-1V(32) |
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Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 25POS SMD TIN
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Description: CONN RCPT 25POS SMD TIN
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Receptacle, Outer Shroud Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Mated Stacking Heights: 4.3mm
на замовлення 1127 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4+ | 97.41 грн |
| 10+ | 79.50 грн |
| 25+ | 74.53 грн |
| 50+ | 66.62 грн |
| 100+ | 63.43 грн |
| 250+ | 59.45 грн |
| 500+ | 55.69 грн |
| DF9-25S-1V(32) |
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Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 25P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 25P TIN PLATING
на замовлення 1596 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 4+ | 108.35 грн |
| 10+ | 91.54 грн |
| 25+ | 70.53 грн |
| 100+ | 67.87 грн |
| 250+ | 66.06 грн |
| 500+ | 61.87 грн |
| 1000+ | 59.00 грн |



