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Технічний опис DILB18P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 18POS TINLEAD, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції DILB18P-223TLF за ціною від 23.28 грн до 45.99 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DILB18P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 18POS TINLEADPart Status: Active Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 9283 шт: термін постачання 21-31 дні (днів) |
|
| DILB18P-223TLF |
|
Виробник: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 18POS TINLEAD
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS TINLEAD
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 9283 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 7+ | 45.99 грн |
| 10+ | 37.26 грн |
| 26+ | 34.83 грн |
| 52+ | 31.13 грн |
| 104+ | 29.64 грн |
| 260+ | 27.78 грн |
| 520+ | 26.02 грн |
| 1014+ | 24.82 грн |
| 2522+ | 23.28 грн |