Продукція > TRENZ ELECTRONIC GMBH > Всі товари виробника TRENZ ELECTRONIC GMBH (608) > Сторінка 6 з 11
| Фото | Назва | Виробник | Інформація |
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TE0726-03IM | Trenz Electronic GmbH |
 Description: IC MODULE ZYNQBERRYPackaging: Bulk Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Flash Size: 16MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0726-03M | Trenz Electronic GmbH |
Description: IC MODULE 667MHZ 512MB Packaging: Bulk Connector Type: CSI, DSI Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Speed: 667MHz RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Co-Processor: Zynq-7000 (Z-7010) Flash Size: 16MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0726-03R | Trenz Electronic GmbH |
Description: IC MODULE 667MHZ 128MB Packaging: Bulk Connector Type: CSI, DSI Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Speed: 667MHz RAM Size: 128MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Co-Processor: Zynq-7000 (Z-7010) Flash Size: 16MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0726-03RJ | Trenz Electronic GmbH |
Description: IC MODULE ZYNQBERRY Packaging: Bulk Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) RAM Size: 128MB Operating Temperature: 0°C ~ 70°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Flash Size: 16MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
| TE0726-04-41C94-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQBERRY Packaging: Bulk Connector Type: RJ45 Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm) RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Flash Size: 16MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0726-04-41C98-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQBERRY Packaging: Bulk Connector Type: USB Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm) RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: MPU Core Co-Processor: Zynq™ XC7Z010-1CLG225C Flash Size: 16MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0726-04-41I94-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQBERRY Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0726-04-41I98-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQBERRY Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0727-02-41C34 | Trenz Electronic GmbH |
Description: ZYNQBERRYZERO MODULE WITH XILINX Packaging: Bulk Part Status: Active Connector Type: USB RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Flash Size: 16MB Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm) Core Processor: Zynq™ XC7Z010-1CLG225C |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0727-03-41C34 | Trenz Electronic GmbH |
Description: ZYNQBERRYZERO MODULE WITH XILINX Packaging: Bulk Connector Type: USB Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm) RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Flash Size: 16MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0727-04-41C34 | Trenz Electronic GmbH |
Description: ZYNQBERRYZERO MODULE WITH AMD ZY Packaging: Bulk Connector Type: 40 Pin Header Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm) RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Flash Size: 16MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0727-04-41C38 | Trenz Electronic GmbH |
Description: ZYNQBERRY MODULE ZYNQ Packaging: Box Connector Type: 40 Pin Header Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm) RAM Size: 512MB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Flash Size: 16MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0728-03-1Q | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 512MB Packaging: Bulk Connector Type: Samtec SEM Size / Dimension: 2.360" L x 2.360" W (60.00mm x 60.00mm) RAM Size: 512MB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 16MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0728-04-1Q | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 512MB Packaging: Bulk Connector Type: Samtec SEM Size / Dimension: 2.360" L x 2.360" W (60.00mm x 60.00mm) RAM Size: 512MB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 16MB Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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TE0729-02-02IF-S | Trenz Electronic GmbH |
Description: STARTER KIT XILINX ZYNQ MICROSOM Packaging: Bulk For Use With/Related Products: TE0729, XC7Z020 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: TE0729 Zynq-7000 AP SoC Carrier Starter Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0729-02-2IF | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 512MB Packaging: Bulk Connector Type: Samtec BTE Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0729-02-2IF-K | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 512MB Packaging: Bulk Connector Type: Samtec BTE Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
| TE0729-02-2IRA | Trenz Electronic GmbH | Description: IC MODULE CORTEX-A9 512MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-02-62I63FA | Trenz Electronic GmbH |
Description: IC SOC MODULE ZYNQ Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-02-62I63FAK | Trenz Electronic GmbH |
Description: IC SOC MODULE ZYNQ Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-02-62I63FAS | Trenz Electronic GmbH |
Description: STARTER KIT TE0729-02-62I63F Packaging: Bulk For Use With/Related Products: TE0729, XC7Z020 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: TE0729 Zynq-7000 AP SoC Carrier Starter Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0729-02-62I63MA | Trenz Electronic GmbH |
Description: IC SOC MODULE ZYNQ Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
| TE0729-02-62I63MAK | Trenz Electronic GmbH |
Description: IC SOC MODULE ZYNQ Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-02-62I63MAS | Trenz Electronic GmbH |
Description: STARTER KIT TE0729-02-62I63M Packaging: Bulk For Use With/Related Products: TE0729, XC7Z020 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: TE0729 Zynq-7000 AP SoC Carrier Starter Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-02-62I65FM | Trenz Electronic GmbH |
Description: IC SOC MODULE ZYNQ Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 32MB Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-03-62I63MA | Trenz Electronic GmbH |
Description: SOC MODULE WITH AMD ZYNQ 7020-2I Packaging: Bulk Connector Type: 2 x 120 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq™ XC7Z020-2CLG484I Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-03-62I63MAK | Trenz Electronic GmbH |
Description: SOC MODULE WITH AMD ZYNQ 7020-2I Packaging: Bulk Connector Type: 2 x 120 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq™ XC7Z020-2CLG484I Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0729-03-62I63MAS | Trenz Electronic GmbH |
Description: STARTER KIT WITH AMD ZYNQ 7020-2 Packaging: Bulk For Use With/Related Products: TE0729 Type: FPGA Contents: Board(s) Utilized IC / Part: TE0729 |
товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0741-02-070-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 70T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-02-070-2IF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 70T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-02-160-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 160T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-02-160-2IF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 160T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-02-325-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 325T 200MHZ 32MB Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Speed: 200MHz Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Kintex-7 325T Flash Size: 32MB Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-02-325-2IF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 325T 200MHZ 32MB Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Speed: 200MHz Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Kintex-7 325T Flash Size: 32MB Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-02-410-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 410T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-03-070-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 70T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-03-070-2IF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 70T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-03-160-2C1 | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 160T 200MHZ 32MB Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Speed: 200MHz Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Kintex-7 160T Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-03-160-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 160T 200MHZ 32MB Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Speed: 200MHz Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Kintex-7 160T Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
TE0741-03-160-2IF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 160T 200MHZ 32MB Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Speed: 200MHz Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Kintex-7 160T Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
TE0741-03-325-2IF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 325T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0741-03-410-2CF | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 410T 200MHZ 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
| TE0741-03-410-2IF | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I Flash Size: 32MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-A2C-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-A2I-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-B2C-1-AF | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-B2I-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-D2C-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-D2I-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-G2C-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-04-G2I-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I Flash Size: 32MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-05-A2C-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-05-A2I-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-05-B2C-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676C Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-05-B2C-1-AF | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-05-B2I-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
| TE0741-05-D2C-1-A | Trenz Electronic GmbH |
Description: MODULE FPGA KINTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
TE0741-05-D2I-1-A | Trenz Electronic GmbH |
Description: IC MOD KINTEX-7 325T 200MHZ 32MB Packaging: Bulk Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Speed: 25MHz Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I Flash Size: 32MB |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||
 |
TE0745-01-45-1C | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 1GB 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
TE0745-01-45-2I | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 1GB 32MB Packaging: Bulk Connector Type: Samtec UFPS Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7045) Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. |
| TE0726-03IM |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| TE0726-03M |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE 667MHZ 512MB
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Speed: 667MHz
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
Description: IC MODULE 667MHZ 512MB
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Speed: 667MHz
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| TE0726-03R |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE 667MHZ 128MB
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Speed: 667MHz
RAM Size: 128MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
Description: IC MODULE 667MHZ 128MB
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Speed: 667MHz
RAM Size: 128MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| TE0726-03RJ |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
RAM Size: 128MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
RAM Size: 128MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Flash Size: 16MB
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| TE0726-04-41C94-A |
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: RJ45
Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: RJ45
Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0726-04-41C98-A |
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: USB
Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MPU Core
Co-Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
Description: IC MODULE ZYNQBERRY
Packaging: Bulk
Connector Type: USB
Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MPU Core
Co-Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0727-02-41C34 |
Виробник: Trenz Electronic GmbH
Description: ZYNQBERRYZERO MODULE WITH XILINX
Packaging: Bulk
Part Status: Active
Connector Type: USB
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Flash Size: 16MB
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
Core Processor: Zynq™ XC7Z010-1CLG225C
Description: ZYNQBERRYZERO MODULE WITH XILINX
Packaging: Bulk
Part Status: Active
Connector Type: USB
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Flash Size: 16MB
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
Core Processor: Zynq™ XC7Z010-1CLG225C
товару немає в наявності
В кошику
од. на суму грн.
| TE0727-03-41C34 |
Виробник: Trenz Electronic GmbH
Description: ZYNQBERRYZERO MODULE WITH XILINX
Packaging: Bulk
Connector Type: USB
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
Description: ZYNQBERRYZERO MODULE WITH XILINX
Packaging: Bulk
Connector Type: USB
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0727-04-41C34 |
Виробник: Trenz Electronic GmbH
Description: ZYNQBERRYZERO MODULE WITH AMD ZY
Packaging: Bulk
Connector Type: 40 Pin Header
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
Description: ZYNQBERRYZERO MODULE WITH AMD ZY
Packaging: Bulk
Connector Type: 40 Pin Header
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0727-04-41C38 |
Виробник: Trenz Electronic GmbH
Description: ZYNQBERRY MODULE ZYNQ
Packaging: Box
Connector Type: 40 Pin Header
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
Description: ZYNQBERRY MODULE ZYNQ
Packaging: Box
Connector Type: 40 Pin Header
Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
RAM Size: 512MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Flash Size: 16MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0728-03-1Q |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec SEM
Size / Dimension: 2.360" L x 2.360" W (60.00mm x 60.00mm)
RAM Size: 512MB
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 16MB
Part Status: Active
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec SEM
Size / Dimension: 2.360" L x 2.360" W (60.00mm x 60.00mm)
RAM Size: 512MB
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 16MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0728-04-1Q |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec SEM
Size / Dimension: 2.360" L x 2.360" W (60.00mm x 60.00mm)
RAM Size: 512MB
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 16MB
Part Status: Active
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec SEM
Size / Dimension: 2.360" L x 2.360" W (60.00mm x 60.00mm)
RAM Size: 512MB
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 16MB
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 36913.60 грн |
| TE0729-02-02IF-S |
|
Виробник: Trenz Electronic GmbH
Description: STARTER KIT XILINX ZYNQ MICROSOM
Packaging: Bulk
For Use With/Related Products: TE0729, XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: TE0729 Zynq-7000 AP SoC Carrier Starter
Part Status: Discontinued at Digi-Key
Description: STARTER KIT XILINX ZYNQ MICROSOM
Packaging: Bulk
For Use With/Related Products: TE0729, XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: TE0729 Zynq-7000 AP SoC Carrier Starter
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec BTE
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec BTE
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-2IF-K |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec BTE
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Description: IC MODULE CORTEX-A9 512MB
Packaging: Bulk
Connector Type: Samtec BTE
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-2IRA |
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 512MB
Description: IC MODULE CORTEX-A9 512MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I63FA |
|
Виробник: Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I63FAK |
|
Виробник: Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I63FAS |
|
Виробник: Trenz Electronic GmbH
Description: STARTER KIT TE0729-02-62I63F
Packaging: Bulk
For Use With/Related Products: TE0729, XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: TE0729 Zynq-7000 AP SoC Carrier Starter
Part Status: Discontinued at Digi-Key
Description: STARTER KIT TE0729-02-62I63F
Packaging: Bulk
For Use With/Related Products: TE0729, XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: TE0729 Zynq-7000 AP SoC Carrier Starter
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I63MA |
|
Виробник: Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Active
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I63MAK |
|
Виробник: Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Active
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I63MAS |
|
Виробник: Trenz Electronic GmbH
Description: STARTER KIT TE0729-02-62I63M
Packaging: Bulk
For Use With/Related Products: TE0729, XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: TE0729 Zynq-7000 AP SoC Carrier Starter
Part Status: Discontinued at Digi-Key
Description: STARTER KIT TE0729-02-62I63M
Packaging: Bulk
For Use With/Related Products: TE0729, XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: TE0729 Zynq-7000 AP SoC Carrier Starter
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-02-62I65FM |
Виробник: Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
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В кошику
од. на суму грн.
| TE0729-03-62I63MA |
Виробник: Trenz Electronic GmbH
Description: SOC MODULE WITH AMD ZYNQ 7020-2I
Packaging: Bulk
Connector Type: 2 x 120 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq™ XC7Z020-2CLG484I
Flash Size: 32MB
Description: SOC MODULE WITH AMD ZYNQ 7020-2I
Packaging: Bulk
Connector Type: 2 x 120 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq™ XC7Z020-2CLG484I
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-03-62I63MAK |
Виробник: Trenz Electronic GmbH
Description: SOC MODULE WITH AMD ZYNQ 7020-2I
Packaging: Bulk
Connector Type: 2 x 120 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq™ XC7Z020-2CLG484I
Flash Size: 32MB
Description: SOC MODULE WITH AMD ZYNQ 7020-2I
Packaging: Bulk
Connector Type: 2 x 120 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq™ XC7Z020-2CLG484I
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0729-03-62I63MAS |
Виробник: Trenz Electronic GmbH
Description: STARTER KIT WITH AMD ZYNQ 7020-2
Packaging: Bulk
For Use With/Related Products: TE0729
Type: FPGA
Contents: Board(s)
Utilized IC / Part: TE0729
Description: STARTER KIT WITH AMD ZYNQ 7020-2
Packaging: Bulk
For Use With/Related Products: TE0729
Type: FPGA
Contents: Board(s)
Utilized IC / Part: TE0729
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В кошику
од. на суму грн.
| TE0741-02-070-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
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В кошику
од. на суму грн.
| TE0741-02-070-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
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В кошику
од. на суму грн.
| TE0741-02-160-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-02-160-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
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В кошику
од. на суму грн.
| TE0741-02-325-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 325T
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 325T
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-02-325-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 325T
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 325T
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-02-410-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 410T 200MHZ 32MB
Description: IC MOD KINTEX-7 410T 200MHZ 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-070-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-070-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
Description: IC MOD KINTEX-7 70T 200MHZ 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-160-2C1 |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 160T
Flash Size: 32MB
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 160T
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-160-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 160T
Flash Size: 32MB
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 160T
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-160-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 160T
Flash Size: 32MB
Description: IC MOD KINTEX-7 160T 200MHZ 32MB
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 200MHz
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex-7 160T
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-325-2IF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-410-2CF |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 410T 200MHZ 32MB
Description: IC MOD KINTEX-7 410T 200MHZ 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-03-410-2IF |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Flash Size: 32MB
Part Status: Obsolete
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Flash Size: 32MB
Part Status: Obsolete
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В кошику
од. на суму грн.
| TE0741-04-A2C-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-A2I-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-B2C-1-AF |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-B2I-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-D2C-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-D2I-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-G2C-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-04-G2I-1-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Flash Size: 32MB
Part Status: Active
Description: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Flash Size: 32MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-A2C-1-A |
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C
Flash Size: 32MB
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-A2I-1-A |
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
Flash Size: 32MB
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-B2C-1-A |
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
Flash Size: 32MB
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-B2C-1-AF |
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Flash Size: 32MB
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-B2I-1-A |
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Flash Size: 32MB
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-D2C-1-A |
Виробник: Trenz Electronic GmbH
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
Flash Size: 32MB
Description: MODULE FPGA KINTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0741-05-D2I-1-A |
Виробник: Trenz Electronic GmbH
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
Flash Size: 32MB
Description: IC MOD KINTEX-7 325T 200MHZ 32MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
Flash Size: 32MB
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 82240.07 грн |
| TE0745-01-45-1C |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 1GB 32MB
Description: IC MODULE CORTEX-A9 1GB 32MB
товару немає в наявності
В кошику
од. на суму грн.
| TE0745-01-45-2I |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 1GB 32MB
Packaging: Bulk
Connector Type: Samtec UFPS
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7045)
Flash Size: 32MB
Description: IC MODULE CORTEX-A9 1GB 32MB
Packaging: Bulk
Connector Type: Samtec UFPS
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7045)
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.