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ICO-246-S8-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-286-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 28POS TIN
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ICO-286-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
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ICO-326-S8A-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-326-S8-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-406-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 40POS TIN
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ICO-406-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 40POS TIN
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ICO-426-S8A-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 42POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-426-S8-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 42POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-486-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
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ICO-486-S8-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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923719 3M 3mtm-test-clips-accessories.pdf Description: TEST CLIP 32POS DIP NAIL-HEAD
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100-006-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 6POS GOLD
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100-008-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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100-008-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-010-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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100-014-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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100-014-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-016-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-016-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-000 3M Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-001 3M Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-020-000 3M Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-020-001 3M Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-022-000 3M Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-024-000 3M Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-024-001 3M Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-028-000 3M Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-028-001 3M Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-032-000 3M Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-032-001 3M Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-040-000 3M Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-040-001 3M Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-042-000 3M Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-048-000 3M Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-00-0602J 203-6585-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-50-0602J 203-6585-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
203-6970-00-0602J 203-6970-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
1+769.49 грн
10+571.19 грн
100+472.24 грн
В кошику  од. на суму  грн.
203-6970-50-0602J 203-6970-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 313 шт:
термін постачання 21-31 дні (днів)
1+705.17 грн
10+521.56 грн
100+429.55 грн
В кошику  од. на суму  грн.
204-6585-00-0602J 204-6585-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
204-6585-50-0602J 204-6585-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+978.13 грн
10+732.07 грн
В кошику  од. на суму  грн.
204-6970-00-0602J 204-6970-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
1+824.39 грн
10+615.30 грн
100+511.14 грн
В кошику  од. на суму  грн.
204-6970-50-0602J 204-6970-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 156 шт:
термін постачання 21-31 дні (днів)
1+822.82 грн
10+612.96 грн
100+508.34 грн
В кошику  од. на суму  грн.
203-2737-55-1102 203-2737-55-1102 3M 3mtm-discrete-power-in-line-sockets-ts0458.pdf Description: CONN TRANSIST TO-3/TO-66 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
SBR-ST-29-P-ML SBR-ST-29-P-ML 3M 3mtm-serial-attached-scsi-sas-connector-sbr-series-ts-2176.pdf Description: CONN SOCKET SAS 29POS VERT
товару немає в наявності
В кошику  од. на суму  грн.
SBR-EV-29-P-ML SBR-EV-29-P-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2177.pdf Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
1+428.28 грн
10+336.28 грн
25+309.96 грн
40+279.02 грн
80+262.37 грн
В кошику  од. на суму  грн.
SBH-ST-29-SA-ML SBH-ST-29-SA-ML 3M 3mtm-serial-attached-scsisas-conn-sbh-series-ts-2179.pdf Description: CONN PLUG SAS 29POS STRADDLE MNT
товару немає в наявності
В кошику  од. на суму  грн.
SBH-ST-29-SM-ML SBH-ST-29-SM-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbh-series-cd-2178.pdf Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 936 шт:
термін постачання 21-31 дні (днів)
1+432.20 грн
10+377.74 грн
25+357.76 грн
40+327.93 грн
80+312.31 грн
230+273.27 грн
440+261.11 грн
В кошику  од. на суму  грн.
SBR-RA-29-S-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2180.pdf Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
В кошику  од. на суму  грн.
4808-3000-CP 4808-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 11920 шт:
термін постачання 21-31 дні (днів)
8+40.79 грн
10+33.61 грн
25+31.48 грн
50+28.14 грн
100+26.79 грн
250+25.11 грн
500+23.52 грн
1000+22.40 грн
2500+21.00 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4814-3000-CP 4814-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2454 шт:
термін постачання 21-31 дні (днів)
8+40.79 грн
10+33.16 грн
28+30.86 грн
56+27.57 грн
112+26.25 грн
252+24.79 грн
504+23.22 грн
1008+22.11 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4816-3000-CP 4816-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4021 шт:
термін постачання 21-31 дні (днів)
8+40.79 грн
10+33.61 грн
25+31.48 грн
50+28.14 грн
100+26.79 грн
250+25.11 грн
500+23.52 грн
1000+22.40 грн
2500+21.00 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4818-3000-CP 4818-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8363 шт:
термін постачання 21-31 дні (днів)
7+47.85 грн
22+37.08 грн
44+35.31 грн
66+32.20 грн
110+31.05 грн
264+29.19 грн
506+27.42 грн
1012+26.11 грн
2508+24.49 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
4820-3000-CP 4820-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8365 шт:
термін постачання 21-31 дні (днів)
7+50.20 грн
20+38.75 грн
40+36.88 грн
60+33.64 грн
100+32.44 грн
260+30.33 грн
500+28.48 грн
1000+27.12 грн
2500+25.42 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
4824-3000-CP 4824-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1489 шт:
термін постачання 21-31 дні (днів)
6+61.18 грн
16+48.53 грн
32+46.22 грн
64+41.29 грн
112+39.69 грн
256+37.44 грн
512+35.07 грн
1008+33.43 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
4824-6000-CP 4824-6000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 722 шт:
термін постачання 21-31 дні (днів)
6+61.97 грн
16+48.72 грн
32+46.38 грн
64+41.45 грн
112+39.83 грн
256+37.58 грн
512+35.19 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
4828-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
4828-6000-CP 4828-6000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2018 шт:
термін постачання 21-31 дні (днів)
5+65.89 грн
14+52.66 грн
28+50.09 грн
56+44.77 грн
112+42.63 грн
252+40.26 грн
504+37.70 грн
1008+35.90 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
4832-6000-CP 4832-6000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1271 шт:
термін постачання 21-31 дні (днів)
5+66.67 грн
12+53.76 грн
36+49.77 грн
60+45.05 грн
108+43.21 грн
252+40.70 грн
504+38.12 грн
1008+36.30 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
4840-6000-CP 4840-6000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3092 шт:
термін постачання 21-31 дні (днів)
5+73.73 грн
10+60.43 грн
30+55.90 грн
50+50.61 грн
100+48.19 грн
250+45.17 грн
500+42.30 грн
1000+40.28 грн
2500+37.76 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
ICO-246-S8-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-286-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
ICO-286-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
ICO-326-S8A-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
ICO-326-S8-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
ICO-406-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
ICO-406-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
ICO-426-S8A-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-426-S8-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-486-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
ICO-486-S8-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
923719 3mtm-test-clips-accessories.pdf
Виробник: 3M
Description: TEST CLIP 32POS DIP NAIL-HEAD
товару немає в наявності
В кошику  од. на суму  грн.
100-006-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 6POS GOLD
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В кошику  од. на суму  грн.
100-008-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
100-008-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-010-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 10POS GOLD
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В кошику  од. на суму  грн.
100-014-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
100-014-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-016-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-016-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-000
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-018-001
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-020-000
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-020-001
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-022-000
Виробник: 3M
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-024-000
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-024-001
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-028-000
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-028-001
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-032-000
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-032-001
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-040-000
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-040-001
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-042-000
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-048-000
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6585-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6585-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
203-6970-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6970-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+769.49 грн
10+571.19 грн
100+472.24 грн
В кошику  од. на суму  грн.
203-6970-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6970-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 313 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+705.17 грн
10+521.56 грн
100+429.55 грн
В кошику  од. на суму  грн.
204-6585-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6585-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
204-6585-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6585-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+978.13 грн
10+732.07 грн
В кошику  од. на суму  грн.
204-6970-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6970-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+824.39 грн
10+615.30 грн
100+511.14 грн
В кошику  од. на суму  грн.
204-6970-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6970-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 156 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+822.82 грн
10+612.96 грн
100+508.34 грн
В кошику  од. на суму  грн.
203-2737-55-1102 3mtm-discrete-power-in-line-sockets-ts0458.pdf
203-2737-55-1102
Виробник: 3M
Description: CONN TRANSIST TO-3/TO-66 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
SBR-ST-29-P-ML 3mtm-serial-attached-scsi-sas-connector-sbr-series-ts-2176.pdf
SBR-ST-29-P-ML
Виробник: 3M
Description: CONN SOCKET SAS 29POS VERT
товару немає в наявності
В кошику  од. на суму  грн.
SBR-EV-29-P-ML 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2177.pdf
SBR-EV-29-P-ML
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+428.28 грн
10+336.28 грн
25+309.96 грн
40+279.02 грн
80+262.37 грн
В кошику  од. на суму  грн.
SBH-ST-29-SA-ML 3mtm-serial-attached-scsisas-conn-sbh-series-ts-2179.pdf
SBH-ST-29-SA-ML
Виробник: 3M
Description: CONN PLUG SAS 29POS STRADDLE MNT
товару немає в наявності
В кошику  од. на суму  грн.
SBH-ST-29-SM-ML 3mtm-serial-attached-scsi-sas-conn-sbh-series-cd-2178.pdf
SBH-ST-29-SM-ML
Виробник: 3M
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 936 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+432.20 грн
10+377.74 грн
25+357.76 грн
40+327.93 грн
80+312.31 грн
230+273.27 грн
440+261.11 грн
В кошику  од. на суму  грн.
SBR-RA-29-S-ML 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2180.pdf
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
В кошику  од. на суму  грн.
4808-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4808-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 11920 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+40.79 грн
10+33.61 грн
25+31.48 грн
50+28.14 грн
100+26.79 грн
250+25.11 грн
500+23.52 грн
1000+22.40 грн
2500+21.00 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4814-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4814-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2454 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+40.79 грн
10+33.16 грн
28+30.86 грн
56+27.57 грн
112+26.25 грн
252+24.79 грн
504+23.22 грн
1008+22.11 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4816-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4816-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4021 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+40.79 грн
10+33.61 грн
25+31.48 грн
50+28.14 грн
100+26.79 грн
250+25.11 грн
500+23.52 грн
1000+22.40 грн
2500+21.00 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4818-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4818-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8363 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+47.85 грн
22+37.08 грн
44+35.31 грн
66+32.20 грн
110+31.05 грн
264+29.19 грн
506+27.42 грн
1012+26.11 грн
2508+24.49 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
4820-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4820-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8365 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+50.20 грн
20+38.75 грн
40+36.88 грн
60+33.64 грн
100+32.44 грн
260+30.33 грн
500+28.48 грн
1000+27.12 грн
2500+25.42 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
4824-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4824-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1489 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.18 грн
16+48.53 грн
32+46.22 грн
64+41.29 грн
112+39.69 грн
256+37.44 грн
512+35.07 грн
1008+33.43 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
4824-6000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4824-6000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 722 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.97 грн
16+48.72 грн
32+46.38 грн
64+41.45 грн
112+39.83 грн
256+37.58 грн
512+35.19 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
4828-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
4828-6000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4828-6000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2018 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+65.89 грн
14+52.66 грн
28+50.09 грн
56+44.77 грн
112+42.63 грн
252+40.26 грн
504+37.70 грн
1008+35.90 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
4832-6000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4832-6000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1271 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+66.67 грн
12+53.76 грн
36+49.77 грн
60+45.05 грн
108+43.21 грн
252+40.70 грн
504+38.12 грн
1008+36.30 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
4840-6000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4840-6000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3092 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+73.73 грн
10+60.43 грн
30+55.90 грн
50+50.61 грн
100+48.19 грн
250+45.17 грн
500+42.30 грн
1000+40.28 грн
2500+37.76 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
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