| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||||
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| 100-032-001 | 3M |
Description: CONN IC DIP SOCKET 32POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-040-000 | 3M |
Description: CONN IC DIP SOCKET 40POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-040-001 | 3M |
Description: CONN IC DIP SOCKET 40POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-042-000 | 3M |
Description: CONN IC DIP SOCKET 42POS GOLD Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 42 (2 x 21) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-048-000 | 3M |
Description: CONN IC DIP SOCKET 48POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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203-6585-00-0602J | 3M |
Description: SOCKET LASER DIODE 3POSAccessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||||
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203-6585-50-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPart Status: Active Accessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||||
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203-6970-00-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket |
на замовлення 103 шт: термін постачання 21-31 дні (днів) |
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203-6970-50-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
на замовлення 197 шт: термін постачання 21-31 дні (днів) |
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204-6585-00-0602J | 3M |
Description: SOCKET LASER DIODE 4POSAccessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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204-6585-50-0602J | 3M |
Description: SOCKET LASER DIODE 4POSAccessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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204-6970-00-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
на замовлення 184 шт: термін постачання 21-31 дні (днів) |
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204-6970-50-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
на замовлення 136 шт: термін постачання 21-31 дні (днів) |
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203-2737-55-1102 | 3M |
Description: CONN TRANSIST TO-3/TO-66 3POSPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: Transistor, TO-3 and TO-66 Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 3 (Rectangular) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.234" (5.94mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
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SBR-ST-29-P-ML | 3M |
Description: CONN SOCKET SAS 29POS VERT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SBR-EV-29-P-ML | 3M |
Description: CONN SAS RCPT 29POS SLD PCBPackaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
на замовлення 150 шт: термін постачання 21-31 дні (днів) |
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SBH-ST-29-SA-ML | 3M |
Description: CONN PLUG SAS 29POS STRADDLE MNT |
товару немає в наявності |
Мінімальне замовлення: 5400 шт В кошику од. на суму грн. | ||||||||||||||||||
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SBH-ST-29-SM-ML | 3M |
Description: CONN SAS PLUG 29POS SLD SMDFeatures: Flange Packaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 29 Termination: Solder Connector Style: Plug Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
на замовлення 936 шт: термін постачання 21-31 дні (днів) |
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| SBR-RA-29-S-ML | 3M |
Description: CONN SAS RCPT 29POS SLD R/APackaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole, Right Angle Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) |
товару немає в наявності |
Мінімальне замовлення: 5250 шт В кошику од. на суму грн. | |||||||||||||||||||
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4808-3000-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 11249 шт: термін постачання 21-31 дні (днів) |
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4814-3000-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 11728 шт: термін постачання 21-31 дні (днів) |
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4816-3000-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1975 шт: термін постачання 21-31 дні (днів) |
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4818-3000-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7880 шт: термін постачання 21-31 дні (днів) |
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4820-3000-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7705 шт: термін постачання 21-31 дні (днів) |
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4824-3000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1211 шт: термін постачання 21-31 дні (днів) |
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4824-6000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -25°C ~ 85°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 4177 шт: термін постачання 21-31 дні (днів) |
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| 4828-3000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINPart Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -25°C ~ 85°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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4828-6000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1624 шт: термін постачання 21-31 дні (днів) |
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4832-6000-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2300 шт: термін постачання 21-31 дні (днів) |
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4840-6000-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2378 шт: термін постачання 21-31 дні (днів) |
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4848-6000-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1401 шт: термін постачання 21-31 дні (днів) |
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4808-3004-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 22033 шт: термін постачання 21-31 дні (днів) |
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4814-3004-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 4376 шт: термін постачання 21-31 дні (днів) |
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4816-3004-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 4952 шт: термін постачання 21-31 дні (днів) |
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4818-3004-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 6002 шт: термін постачання 21-31 дні (днів) |
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4820-3004-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 8411 шт: термін постачання 21-31 дні (днів) |
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4824-3004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TIN |
товару немає в наявності |
Мінімальне замовлення: 6400 шт В кошику од. на суму грн. | ||||||||||||||||||
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4824-6004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2938 шт: термін постачання 21-31 дні (днів) |
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4828-3004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 6898 шт: термін постачання 21-31 дні (днів) |
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4828-6004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2150 шт: термін постачання 21-31 дні (днів) |
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4832-6004-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2880 шт: термін постачання 21-31 дні (днів) |
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4840-6004-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1785 шт: термін постачання 21-31 дні (днів) |
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4848-6004-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1582 шт: термін постачання 21-31 дні (днів) |
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D7E50-7316-02 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-INPart Status: Active Insertion, Removal Method: Push In, Push Out Ejector Side: Right Card Type: CompactFlash® - Type I Mounting Type: Snap-In Connector Type: Ejector Packaging: Bulk |
на замовлення 650 шт: термін постачання 21-31 дні (днів) |
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D7E50-8316-03 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-INPackaging: Bulk Connector Type: Ejector Mounting Type: Snap-In Card Type: CompactFlash® - Type I Ejector Side: Right Insertion, Removal Method: Push In, Push Out Part Status: Active |
на замовлення 691 шт: термін постачання 21-31 дні (днів) |
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3418-0000 | 3M |
Description: CONN IDC 40POS 26-28AWG VERTNumber of Rows: 4 Cable Pitch: 0.050" (1.27mm) Cable Termination: IDC Contact Finish Thickness: 10.0µin (0.25µm) Row Spacing: 0.100" (2.54mm) Number of Positions: 40 Wire Gauge: 26-28 AWG, Stranded or Solid Mounting Type: Through Hole Color: Gray Contact Finish: Gold Connector Type: Ribbon Cable Features: Feed Through Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
3426-0000 | 3M |
Description: CONN IDC 50POS 26-28AWG VERTNumber of Rows: 4 Cable Pitch: 0.050" (1.27mm) Cable Termination: IDC Contact Finish Thickness: 10.0µin (0.25µm) Row Spacing: 0.100" (2.54mm) Number of Positions: 50 Wire Gauge: 26-28 AWG, Stranded or Solid Mounting Type: Through Hole Color: Gray Contact Finish: Gold Connector Type: Ribbon Cable Features: Feed Through Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
3434-0000 | 3M |
Description: CONN IDC 26POS 26-28AWG VERTNumber of Rows: 4 Cable Pitch: 0.050" (1.27mm) Cable Termination: IDC Contact Finish Thickness: 10.0µin (0.25µm) Row Spacing: 0.100" (2.54mm) Number of Positions: 26 Wire Gauge: 26-28 AWG, Stranded or Solid Mounting Type: Through Hole Color: Gray Contact Finish: Gold Connector Type: Ribbon Cable Features: Feed Through Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| MP2-H024-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 24POS PCBPart Status: Obsolete Contact Finish Thickness: 30.0µin (0.76µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Press-Fit Number of Positions Loaded: All Number of Rows: 4 Pitch: 0.079" (2.00mm) Number of Positions: 24 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 1008 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H030-51P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCBContact Finish Thickness: 30.0µin (0.76µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Press-Fit Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 30 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H030-54P1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCBTermination: Press-Fit Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 30 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box Part Status: Obsolete Contact Finish Thickness: 3.00µin (0.076µm) Connector Style: Futurebus+® Connector Usage: Backplane |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H048-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 48POS PCB |
товару немає в наявності |
Мінімальне замовлення: 1008 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H048-41S3-S-TG | 3M |
Description: CONN HEADER FUTUREBUS+ 48POS PCBContact Finish Thickness: 10.0µin (0.25µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Solder Number of Positions Loaded: All Number of Rows: 4 Pitch: 0.079" (2.00mm) Number of Positions: 48 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box |
товару немає в наявності |
Мінімальне замовлення: 1008 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H060-51P5-S-R30 | 3M |
Description: CONN HEADER FUTUREBUS+ 60POS PCBContact Finish Thickness: 3.00µin (0.076µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Press-Fit Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 60 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 546 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H060-54S1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 60POS PCBPart Status: Obsolete Contact Finish Thickness: 3.00µin (0.076µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Solder Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 60 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H090-51P1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 90POS PCBPart Status: Obsolete Contact Finish Thickness: 3.00µin (0.076µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Press-Fit Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 90 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box |
товару немає в наявності |
Мінімальне замовлення: 280 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H090-51S1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 90POS PCBContact Finish Thickness: 30.0µin (0.76µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Solder Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 90 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box |
товару немає в наявності |
Мінімальне замовлення: 560 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H090-54S2-S-TG30 | 3M |
Description: CONN HEADER 2-FB 90POS 5ROW |
товару немає в наявності |
Мінімальне замовлення: 560 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H096-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 96POS PCB |
товару немає в наявності |
Мінімальне замовлення: 480 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H120-41S1-S-TG30 | 3M |
Description: CONN HDR FUTUREBUS+ 120POS PCBContact Finish Thickness: 30.0µin (0.76µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Solder Number of Positions Loaded: All Number of Rows: 4 Pitch: 0.079" (2.00mm) Number of Positions: 120 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. |
| 100-032-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-040-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-040-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-042-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Description: CONN IC DIP SOCKET 42POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-048-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 48POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 203-6585-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 3POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 203-6585-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Part Status: Active
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 3POS
Part Status: Active
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 203-6970-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 103 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 826.50 грн |
| 10+ | 614.67 грн |
| 100+ | 509.26 грн |
| 203-6970-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 197 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 772.82 грн |
| 10+ | 573.31 грн |
| 100+ | 473.61 грн |
| 204-6585-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1012.80 грн |
| 10+ | 761.07 грн |
| 204-6585-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 984.38 грн |
| 10+ | 736.75 грн |
| 204-6970-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 184 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 920.44 грн |
| 10+ | 688.70 грн |
| 100+ | 573.34 грн |
| 204-6970-50-0602J |
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Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 136 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 885.70 грн |
| 10+ | 661.26 грн |
| 100+ | 549.55 грн |
| 203-2737-55-1102 |
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Виробник: 3M
Description: CONN TRANSIST TO-3/TO-66 3POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN TRANSIST TO-3/TO-66 3POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 114 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3740.16 грн |
| 10+ | 3061.32 грн |
| 30+ | 2833.12 грн |
| 50+ | 2564.72 грн |
| 100+ | 2442.44 грн |
| SBR-ST-29-P-ML |
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Виробник: 3M
Description: CONN SOCKET SAS 29POS VERT
Description: CONN SOCKET SAS 29POS VERT
товару немає в наявності
В кошику
од. на суму грн.
| SBR-EV-29-P-ML |
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Виробник: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 431.01 грн |
| 10+ | 338.42 грн |
| 25+ | 311.94 грн |
| 40+ | 280.80 грн |
| 80+ | 264.05 грн |
| SBH-ST-29-SA-ML |
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Виробник: 3M
Description: CONN PLUG SAS 29POS STRADDLE MNT
Description: CONN PLUG SAS 29POS STRADDLE MNT
товару немає в наявності
Мінімальне замовлення: 5400 шт
В кошику
од. на суму грн.
| SBH-ST-29-SM-ML |
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Виробник: 3M
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 936 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 434.96 грн |
| 10+ | 380.16 грн |
| 25+ | 360.04 грн |
| 40+ | 330.03 грн |
| 80+ | 314.31 грн |
| 230+ | 275.02 грн |
| 440+ | 262.78 грн |
| SBR-RA-29-S-ML |
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Виробник: 3M
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
Мінімальне замовлення: 5250 шт
В кошику
од. на суму грн.
| 4808-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 11249 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 63.15 грн |
| 10+ | 52.22 грн |
| 25+ | 48.89 грн |
| 50+ | 43.69 грн |
| 100+ | 41.60 грн |
| 250+ | 39.00 грн |
| 500+ | 36.52 грн |
| 1000+ | 34.78 грн |
| 2500+ | 32.60 грн |
| 4814-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 11728 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 68.68 грн |
| 10+ | 56.33 грн |
| 28+ | 52.34 грн |
| 56+ | 46.78 грн |
| 112+ | 44.54 грн |
| 252+ | 42.06 грн |
| 504+ | 39.39 грн |
| 1008+ | 37.51 грн |
| 2520+ | 35.16 грн |
| 4816-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1975 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 73.41 грн |
| 10+ | 60.05 грн |
| 25+ | 56.31 грн |
| 50+ | 50.32 грн |
| 100+ | 47.92 грн |
| 250+ | 44.91 грн |
| 500+ | 42.07 грн |
| 1000+ | 40.06 грн |
| 4818-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7880 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 101.04 грн |
| 22+ | 78.05 грн |
| 44+ | 74.34 грн |
| 66+ | 67.78 грн |
| 110+ | 65.38 грн |
| 264+ | 61.46 грн |
| 506+ | 57.74 грн |
| 1012+ | 54.99 грн |
| 2508+ | 51.58 грн |
| 4820-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7705 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 79.73 грн |
| 20+ | 61.80 грн |
| 40+ | 58.82 грн |
| 60+ | 53.65 грн |
| 100+ | 51.74 грн |
| 260+ | 48.37 грн |
| 500+ | 45.43 грн |
| 1000+ | 43.26 грн |
| 2500+ | 40.55 грн |
| 4824-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1211 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 66.31 грн |
| 16+ | 52.36 грн |
| 32+ | 49.84 грн |
| 64+ | 44.53 грн |
| 112+ | 42.81 грн |
| 256+ | 40.38 грн |
| 512+ | 37.82 грн |
| 1008+ | 36.05 грн |
| 4824-6000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 4177 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 66.31 грн |
| 16+ | 52.36 грн |
| 32+ | 49.84 грн |
| 64+ | 44.53 грн |
| 112+ | 42.81 грн |
| 256+ | 40.38 грн |
| 512+ | 37.82 грн |
| 1008+ | 36.05 грн |
| 2512+ | 33.80 грн |
| 4828-3000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| 4828-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1624 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 125.51 грн |
| 14+ | 100.07 грн |
| 28+ | 95.32 грн |
| 56+ | 85.16 грн |
| 112+ | 81.09 грн |
| 252+ | 76.58 грн |
| 504+ | 71.72 грн |
| 1008+ | 68.30 грн |
| 4832-6000-CP |
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Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2300 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 71.84 грн |
| 12+ | 58.09 грн |
| 36+ | 53.74 грн |
| 60+ | 48.65 грн |
| 108+ | 46.68 грн |
| 252+ | 43.96 грн |
| 504+ | 41.18 грн |
| 1008+ | 39.21 грн |
| 4840-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2378 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 132.62 грн |
| 10+ | 108.70 грн |
| 30+ | 100.54 грн |
| 50+ | 91.01 грн |
| 100+ | 86.65 грн |
| 250+ | 81.23 грн |
| 500+ | 76.08 грн |
| 1000+ | 72.45 грн |
| 4848-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1401 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 160.25 грн |
| 16+ | 126.61 грн |
| 32+ | 120.58 грн |
| 56+ | 108.78 грн |
| 104+ | 104.12 грн |
| 256+ | 97.71 грн |
| 504+ | 91.62 грн |
| 1000+ | 87.29 грн |
| 4808-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 22033 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 67.89 грн |
| 10+ | 55.42 грн |
| 25+ | 51.96 грн |
| 50+ | 46.44 грн |
| 100+ | 44.22 грн |
| 250+ | 41.44 грн |
| 500+ | 38.82 грн |
| 1000+ | 36.96 грн |
| 2500+ | 34.65 грн |
| 4814-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4376 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 63.94 грн |
| 10+ | 52.60 грн |
| 28+ | 48.87 грн |
| 56+ | 43.66 грн |
| 112+ | 41.57 грн |
| 252+ | 39.25 грн |
| 504+ | 36.77 грн |
| 1008+ | 35.01 грн |
| 2520+ | 32.82 грн |
| 4816-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4952 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 77.36 грн |
| 10+ | 63.02 грн |
| 25+ | 59.05 грн |
| 50+ | 52.76 грн |
| 100+ | 50.24 грн |
| 250+ | 47.09 грн |
| 500+ | 44.11 грн |
| 1000+ | 42.00 грн |
| 2500+ | 39.37 грн |
| 4818-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6002 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 54.47 грн |
| 22+ | 42.02 грн |
| 44+ | 40.01 грн |
| 66+ | 36.49 грн |
| 110+ | 35.20 грн |
| 264+ | 33.09 грн |
| 506+ | 31.08 грн |
| 1012+ | 29.60 грн |
| 2508+ | 27.76 грн |
| 4820-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8411 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 54.47 грн |
| 20+ | 42.30 грн |
| 40+ | 40.29 грн |
| 60+ | 36.74 грн |
| 100+ | 35.43 грн |
| 260+ | 33.12 грн |
| 500+ | 31.11 грн |
| 1000+ | 29.62 грн |
| 2500+ | 27.77 грн |
| 4824-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
Мінімальне замовлення: 6400 шт
В кошику
од. на суму грн.
| 4824-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2938 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 93.94 грн |
| 16+ | 74.54 грн |
| 32+ | 70.98 грн |
| 64+ | 63.42 грн |
| 112+ | 60.96 грн |
| 256+ | 57.50 грн |
| 512+ | 53.86 грн |
| 1008+ | 51.35 грн |
| 2512+ | 48.14 грн |
| 4828-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6898 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 116.04 грн |
| 14+ | 92.41 грн |
| 28+ | 87.99 грн |
| 56+ | 78.61 грн |
| 112+ | 74.85 грн |
| 252+ | 70.68 грн |
| 504+ | 66.20 грн |
| 1008+ | 63.05 грн |
| 2506+ | 59.12 грн |
| 4828-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2150 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 111.30 грн |
| 14+ | 88.99 грн |
| 28+ | 84.73 грн |
| 56+ | 75.72 грн |
| 112+ | 72.10 грн |
| 252+ | 68.09 грн |
| 504+ | 63.77 грн |
| 1008+ | 60.73 грн |
| 4832-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2880 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 79.73 грн |
| 12+ | 64.30 грн |
| 36+ | 59.53 грн |
| 60+ | 53.87 грн |
| 108+ | 51.68 грн |
| 252+ | 48.68 грн |
| 504+ | 45.60 грн |
| 1008+ | 43.42 грн |
| 2508+ | 40.71 грн |
| 4840-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1785 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 85.25 грн |
| 10+ | 69.86 грн |
| 30+ | 64.61 грн |
| 50+ | 58.47 грн |
| 100+ | 55.69 грн |
| 250+ | 52.19 грн |
| 500+ | 48.89 грн |
| 1000+ | 46.55 грн |
| 4848-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1582 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 156.30 грн |
| 16+ | 123.38 грн |
| 32+ | 117.49 грн |
| 56+ | 105.98 грн |
| 104+ | 101.44 грн |
| 256+ | 95.19 грн |
| 504+ | 89.25 грн |
| 1000+ | 85.04 грн |
| D7E50-7316-02 |
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Виробник: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Part Status: Active
Insertion, Removal Method: Push In, Push Out
Ejector Side: Right
Card Type: CompactFlash® - Type I
Mounting Type: Snap-In
Connector Type: Ejector
Packaging: Bulk
Description: CONN COMPACT FLASH CARD SNAP-IN
Part Status: Active
Insertion, Removal Method: Push In, Push Out
Ejector Side: Right
Card Type: CompactFlash® - Type I
Mounting Type: Snap-In
Connector Type: Ejector
Packaging: Bulk
на замовлення 650 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 498.90 грн |
| 10+ | 408.13 грн |
| 25+ | 382.54 грн |
| 50+ | 341.85 грн |
| 100+ | 325.53 грн |
| 300+ | 301.25 грн |
| 500+ | 285.83 грн |
| D7E50-8316-03 |
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Виробник: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
на замовлення 691 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 601.52 грн |
| 10+ | 492.13 грн |
| 25+ | 461.30 грн |
| 50+ | 412.23 грн |
| 100+ | 392.56 грн |
| 300+ | 363.29 грн |
| 500+ | 344.69 грн |
| 3418-0000 |
![]() |
Виробник: 3M
Description: CONN IDC 40POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 40
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Description: CONN IDC 40POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 40
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 3426-0000 |
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Виробник: 3M
Description: CONN IDC 50POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 50
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Description: CONN IDC 50POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 50
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 3434-0000 |
![]() |
Виробник: 3M
Description: CONN IDC 26POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 26
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Description: CONN IDC 26POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 26
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MP2-H024-41P1-S-TG30 |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Part Status: Obsolete
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 24
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Part Status: Obsolete
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 24
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 1008 шт
В кошику
од. на суму грн.
| MP2-H030-51P1-S-TG30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 840 шт
В кошику
од. на суму грн.
| MP2-H030-54P1-S-TR30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
товару немає в наявності
Мінімальне замовлення: 840 шт
В кошику
од. на суму грн.
| MP2-H048-41P1-S-TG30 |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Description: CONN HEADER FUTUREBUS+ 48POS PCB
товару немає в наявності
Мінімальне замовлення: 1008 шт
В кошику
од. на суму грн.
| MP2-H048-41S3-S-TG |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Contact Finish Thickness: 10.0µin (0.25µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 48
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Contact Finish Thickness: 10.0µin (0.25µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 48
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
товару немає в наявності
Мінімальне замовлення: 1008 шт
В кошику
од. на суму грн.
| MP2-H060-51P5-S-R30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 60POS PCB
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 60
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Description: CONN HEADER FUTUREBUS+ 60POS PCB
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 60
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 546 шт
В кошику
од. на суму грн.
| MP2-H060-54S1-S-TR30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 60POS PCB
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 60
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Description: CONN HEADER FUTUREBUS+ 60POS PCB
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 60
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| MP2-H090-51P1-S-TR30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 90POS PCB
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 90
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Description: CONN HEADER FUTUREBUS+ 90POS PCB
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 90
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
товару немає в наявності
Мінімальне замовлення: 280 шт
В кошику
од. на суму грн.
| MP2-H090-51S1-S-TG30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 90POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 90
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Description: CONN HEADER FUTUREBUS+ 90POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 90
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
товару немає в наявності
Мінімальне замовлення: 560 шт
В кошику
од. на суму грн.
| MP2-H090-54S2-S-TG30 |
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Виробник: 3M
Description: CONN HEADER 2-FB 90POS 5ROW
Description: CONN HEADER 2-FB 90POS 5ROW
товару немає в наявності
Мінімальне замовлення: 560 шт
В кошику
од. на суму грн.
| MP2-H096-41P1-S-TG30 |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 96POS PCB
Description: CONN HEADER FUTUREBUS+ 96POS PCB
товару немає в наявності
Мінімальне замовлення: 480 шт
В кошику
од. на суму грн.
| MP2-H120-41S1-S-TG30 |
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Виробник: 3M
Description: CONN HDR FUTUREBUS+ 120POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 120
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Description: CONN HDR FUTUREBUS+ 120POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 120
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.


























