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ICO-143-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 14POS TIN
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ICO-143-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-163-S8A-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
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ICO-183-S8A-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-203-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
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ICO-203-S8-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-243-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Box
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-246-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 24POS TIN
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ICO-286-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 28POS TIN
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ICO-286-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
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ICO-326-S8A-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-326-S8-T 3M ICO%2CCICO%2CICB_Series.pdf Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-406-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 40POS TIN
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ICO-406-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 40POS TIN
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ICO-426-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 42POS TIN
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ICO-426-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 42POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-486-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
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ICO-486-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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923719 3M 3mtm-test-clips-accessories.pdf Description: TEST CLIP 32POS DIP NAIL-HEAD
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100-006-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 6POS GOLD
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100-008-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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100-008-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-010-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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100-014-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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100-014-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-016-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-016-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-000 3M Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-001 3M Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-020-000 3M Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-020-001 3M Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-022-000 3M Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-024-000 3M Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-024-001 3M Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-028-000 3M Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-028-001 3M Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-032-000 3M Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-032-001 3M Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-040-000 3M Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-040-001 3M Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-042-000 3M Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-048-000 3M Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-00-0602J 203-6585-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-50-0602J 203-6585-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
203-6970-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
1+862.96 грн
10+602.26 грн
В кошику  од. на суму  грн.
203-6970-50-0602J 203-6970-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+760.55 грн
В кошику  од. на суму  грн.
204-6585-00-0602J 204-6585-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
204-6585-50-0602J 204-6585-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+989.98 грн
10+740.94 грн
В кошику  од. на суму  грн.
204-6970-00-0602J 204-6970-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 78 шт:
термін постачання 21-31 дні (днів)
1+928.06 грн
10+692.70 грн
В кошику  од. на суму  грн.
204-6970-50-0602J 204-6970-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
203-2737-55-1102 203-2737-55-1102 3M 3mtm-discrete-power-in-line-sockets-ts0458.pdf Description: CONN TRANSIST TO-3/TO-66 3POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
1+3586.01 грн
10+2935.02 грн
30+2716.23 грн
50+2458.92 грн
В кошику  од. на суму  грн.
SBR-ST-29-P-ML SBR-ST-29-P-ML 3M 3mtm-serial-attached-scsi-sas-connector-sbr-series-ts-2176.pdf Description: CONN SOCKET SAS 29POS VERT
товару немає в наявності
В кошику  од. на суму  грн.
SBR-EV-29-P-ML SBR-EV-29-P-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2177.pdf Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
1+433.47 грн
10+340.35 грн
25+313.72 грн
40+282.40 грн
80+265.55 грн
В кошику  од. на суму  грн.
SBH-ST-29-SA-ML SBH-ST-29-SA-ML 3M 3mtm-serial-attached-scsisas-conn-sbh-series-ts-2179.pdf Description: CONN PLUG SAS 29POS STRADDLE MNT
товару немає в наявності
В кошику  од. на суму  грн.
SBH-ST-29-SM-ML SBH-ST-29-SM-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbh-series-cd-2178.pdf Description: CONN SAS PLUG 29POS SLD SMD
Packaging: Tray
Features: Flange
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 936 шт:
термін постачання 21-31 дні (днів)
1+437.43 грн
10+382.32 грн
25+362.09 грн
40+331.91 грн
80+316.10 грн
230+276.58 грн
440+264.28 грн
В кошику  од. на суму  грн.
SBR-RA-29-S-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2180.pdf Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
В кошику  од. на суму  грн.
4808-3000-CP 4808-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 19715 шт:
термін постачання 21-31 дні (днів)
8+42.87 грн
10+34.78 грн
25+32.57 грн
50+29.09 грн
100+27.70 грн
250+25.97 грн
500+24.32 грн
1000+23.16 грн
2500+21.71 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4814-3000-CP 4814-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6955 шт:
термін постачання 21-31 дні (днів)
8+42.87 грн
10+34.78 грн
28+32.30 грн
56+28.86 грн
112+27.48 грн
252+25.95 грн
504+24.31 грн
1008+23.15 грн
2520+21.70 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4816-3000-CP 4816-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8056 шт:
термін постачання 21-31 дні (днів)
8+42.87 грн
10+34.78 грн
25+32.57 грн
50+29.09 грн
100+27.70 грн
250+25.97 грн
500+24.32 грн
1000+23.16 грн
2500+21.71 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4818-3000-CP 4818-3000-CP 3M 3mtm-dip-socket-4800-series-ts1099.pdf Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 886 шт:
термін постачання 21-31 дні (днів)
6+54.78 грн
22+44.72 грн
44+41.99 грн
110+37.71 грн
264+34.27 грн
506+30.85 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
ICO-143-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
ICO-143-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-163-S8A-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
ICO-183-S8A-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-203-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
ICO-203-S8-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-243-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Box
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-246-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
ICO-286-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
ICO-286-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
ICO-326-S8A-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
ICO-326-S8-T ICO%2CCICO%2CICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-406-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
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ICO-406-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
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ICO-426-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
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В кошику  од. на суму  грн.
ICO-426-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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ICO-486-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
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В кошику  од. на суму  грн.
ICO-486-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
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923719 3mtm-test-clips-accessories.pdf
Виробник: 3M
Description: TEST CLIP 32POS DIP NAIL-HEAD
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100-006-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 6POS GOLD
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100-008-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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100-008-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-010-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 10POS GOLD
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100-014-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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100-014-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-016-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-016-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-000
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-018-001
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-020-000
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-020-001
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
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100-022-000
Виробник: 3M
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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100-024-000
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-024-001
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
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100-028-000
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-028-001
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
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100-032-000
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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В кошику  од. на суму  грн.
100-032-001
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
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100-040-000
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-040-001
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
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100-042-000
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
100-048-000
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
203-6585-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6585-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
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В кошику  од. на суму  грн.
203-6585-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6585-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
203-6970-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+862.96 грн
10+602.26 грн
В кошику  од. на суму  грн.
203-6970-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6970-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+760.55 грн
В кошику  од. на суму  грн.
204-6585-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6585-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
В кошику  од. на суму  грн.
204-6585-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6585-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+989.98 грн
10+740.94 грн
В кошику  од. на суму  грн.
204-6970-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6970-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 78 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+928.06 грн
10+692.70 грн
В кошику  од. на суму  грн.
204-6970-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6970-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
203-2737-55-1102 3mtm-discrete-power-in-line-sockets-ts0458.pdf
203-2737-55-1102
Виробник: 3M
Description: CONN TRANSIST TO-3/TO-66 3POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3586.01 грн
10+2935.02 грн
30+2716.23 грн
50+2458.92 грн
В кошику  од. на суму  грн.
SBR-ST-29-P-ML 3mtm-serial-attached-scsi-sas-connector-sbr-series-ts-2176.pdf
SBR-ST-29-P-ML
Виробник: 3M
Description: CONN SOCKET SAS 29POS VERT
товару немає в наявності
В кошику  од. на суму  грн.
SBR-EV-29-P-ML 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2177.pdf
SBR-EV-29-P-ML
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+433.47 грн
10+340.35 грн
25+313.72 грн
40+282.40 грн
80+265.55 грн
В кошику  од. на суму  грн.
SBH-ST-29-SA-ML 3mtm-serial-attached-scsisas-conn-sbh-series-ts-2179.pdf
SBH-ST-29-SA-ML
Виробник: 3M
Description: CONN PLUG SAS 29POS STRADDLE MNT
товару немає в наявності
В кошику  од. на суму  грн.
SBH-ST-29-SM-ML 3mtm-serial-attached-scsi-sas-conn-sbh-series-cd-2178.pdf
SBH-ST-29-SM-ML
Виробник: 3M
Description: CONN SAS PLUG 29POS SLD SMD
Packaging: Tray
Features: Flange
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 936 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+437.43 грн
10+382.32 грн
25+362.09 грн
40+331.91 грн
80+316.10 грн
230+276.58 грн
440+264.28 грн
В кошику  од. на суму  грн.
SBR-RA-29-S-ML 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2180.pdf
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
В кошику  од. на суму  грн.
4808-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4808-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 19715 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+42.87 грн
10+34.78 грн
25+32.57 грн
50+29.09 грн
100+27.70 грн
250+25.97 грн
500+24.32 грн
1000+23.16 грн
2500+21.71 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4814-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4814-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6955 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+42.87 грн
10+34.78 грн
28+32.30 грн
56+28.86 грн
112+27.48 грн
252+25.95 грн
504+24.31 грн
1008+23.15 грн
2520+21.70 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4816-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4816-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8056 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+42.87 грн
10+34.78 грн
25+32.57 грн
50+29.09 грн
100+27.70 грн
250+25.97 грн
500+24.32 грн
1000+23.16 грн
2500+21.71 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
4818-3000-CP 3mtm-dip-socket-4800-series-ts1099.pdf
4818-3000-CP
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 886 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+54.78 грн
22+44.72 грн
44+41.99 грн
110+37.71 грн
264+34.27 грн
506+30.85 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
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