| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 100-020-001 | 3M |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Closed Frame, Seal Tape Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-022-000 | 3M |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-024-000 | 3M |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-024-001 | 3M |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Closed Frame, Seal Tape Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-028-000 | 3M |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-028-001 | 3M |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Closed Frame, Seal Tape Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-032-000 | 3M |
Description: CONN IC DIP SOCKET 32POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-032-001 | 3M |
Description: CONN IC DIP SOCKET 32POS GOLD Features: Closed Frame, Seal Tape Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-040-000 | 3M |
Description: CONN IC DIP SOCKET 40POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-040-001 | 3M |
Description: CONN IC DIP SOCKET 40POS GOLD Features: Closed Frame, Seal Tape Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-042-000 | 3M |
Description: CONN IC DIP SOCKET 42POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 100-048-000 | 3M |
Description: CONN IC DIP SOCKET 48POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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203-6585-00-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||||
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203-6585-50-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||||
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203-6970-00-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket |
на замовлення 103 шт: термін постачання 21-31 дні (днів) |
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203-6970-50-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
на замовлення 375 шт: термін постачання 21-31 дні (днів) |
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204-6585-00-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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204-6585-50-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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204-6970-00-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
на замовлення 184 шт: термін постачання 21-31 дні (днів) |
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204-6970-50-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
на замовлення 136 шт: термін постачання 21-31 дні (днів) |
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203-2737-55-1102 | 3M |
Description: CONN TRANSIST TO-3/TO-66 3POSFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: Transistor, TO-3 and TO-66 Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 3 (Rectangular) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.234" (5.94mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 337 шт: термін постачання 21-31 дні (днів) |
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SBR-ST-29-P-ML | 3M |
Description: CONN SAS RCPT 29POS PRESSFIT PCB |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | ||||||||||||||||||
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SBR-EV-29-P-ML | 3M |
Description: CONN SAS RCPT 29POS SLD PCBPackaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SBH-ST-29-SA-ML | 3M |
Description: CONN SAS PLUG 29POS SLD PCB |
товару немає в наявності |
Мінімальне замовлення: 5400 шт В кошику од. на суму грн. | ||||||||||||||||||
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SBH-ST-29-SM-ML | 3M |
Description: CONN SAS PLUG 29POS SLD SMDFeatures: Flange Packaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 29 Termination: Solder Connector Style: Plug Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
на замовлення 936 шт: термін постачання 21-31 дні (днів) |
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| SBR-RA-29-S-ML | 3M |
Description: CONN SAS RCPT 29POS SLD R/APackaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole, Right Angle Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) |
товару немає в наявності |
Мінімальне замовлення: 5250 шт В кошику од. на суму грн. | |||||||||||||||||||
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4808-3000-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 10082 шт: термін постачання 21-31 дні (днів) |
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4814-3000-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 10894 шт: термін постачання 21-31 дні (днів) |
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4816-3000-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1452 шт: термін постачання 21-31 дні (днів) |
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4818-3000-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7708 шт: термін постачання 21-31 дні (днів) |
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4820-3000-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7540 шт: термін постачання 21-31 дні (днів) |
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4824-3000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1159 шт: термін постачання 21-31 дні (днів) |
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4824-6000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3962 шт: термін постачання 21-31 дні (днів) |
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| 4828-3000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Obsolete |
товару немає в наявності |
Мінімальне замовлення: 3360 шт В кошику од. на суму грн. | |||||||||||||||||||
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4828-6000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1521 шт: термін постачання 21-31 дні (днів) |
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4832-6000-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2191 шт: термін постачання 21-31 дні (днів) |
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4840-6000-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1950 шт: термін постачання 21-31 дні (днів) |
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4848-6000-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1345 шт: термін постачання 21-31 дні (днів) |
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4808-3004-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 18692 шт: термін постачання 21-31 дні (днів) |
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4814-3004-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3939 шт: термін постачання 21-31 дні (днів) |
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4816-3004-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 4379 шт: термін постачання 21-31 дні (днів) |
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4818-3004-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 5910 шт: термін постачання 21-31 дні (днів) |
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4820-3004-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7695 шт: термін постачання 21-31 дні (днів) |
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4824-3004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TIN |
товару немає в наявності |
Мінімальне замовлення: 6400 шт В кошику од. на суму грн. | ||||||||||||||||||
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4824-6004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2788 шт: термін постачання 21-31 дні (днів) |
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4828-3004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 6846 шт: термін постачання 21-31 дні (днів) |
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4828-6004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1693 шт: термін постачання 21-31 дні (днів) |
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4832-6004-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2880 шт: термін постачання 21-31 дні (днів) |
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4840-6004-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1505 шт: термін постачання 21-31 дні (днів) |
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4848-6004-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1557 шт: термін постачання 21-31 дні (днів) |
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D7E50-7316-02 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-INPackaging: Bulk Connector Type: Ejector Mounting Type: Snap-In Card Type: CompactFlash® - Type I Ejector Side: Right Insertion, Removal Method: Push In, Push Out Part Status: Active |
на замовлення 650 шт: термін постачання 21-31 дні (днів) |
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D7E50-8316-03 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-INPackaging: Bulk Connector Type: Ejector Mounting Type: Snap-In Card Type: CompactFlash® - Type I Ejector Side: Right Insertion, Removal Method: Push In, Push Out Part Status: Active |
на замовлення 631 шт: термін постачання 21-31 дні (днів) |
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3418-0000 | 3M |
Description: CONN IDC 40POS 26-28AWG VERTFeatures: Feed Through Packaging: Bulk Connector Type: Ribbon Cable Contact Finish: Gold Color: Gray Mounting Type: Through Hole Wire Gauge: 26-28 AWG, Stranded or Solid Number of Positions: 40 Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: IDC Cable Pitch: 0.050" (1.27mm) Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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3426-0000 | 3M |
Description: CONN IDC 50POS 26-28AWG VERTFeatures: Feed Through Packaging: Bulk Connector Type: Ribbon Cable Contact Finish: Gold Color: Gray Mounting Type: Through Hole Wire Gauge: 26-28 AWG, Stranded or Solid Number of Positions: 50 Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: IDC Cable Pitch: 0.050" (1.27mm) Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
3434-0000 | 3M |
Description: CONN IDC 26POS 26-28AWG VERTFeatures: Feed Through Packaging: Bulk Connector Type: Ribbon Cable Contact Finish: Gold Color: Gray Mounting Type: Through Hole Wire Gauge: 26-28 AWG, Stranded or Solid Number of Positions: 26 Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: IDC Cable Pitch: 0.050" (1.27mm) Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| MP2-H024-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 24POS PCBFeatures: Board Guide, Mating Guide Packaging: Tube Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 24 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
товару немає в наявності |
Мінімальне замовлення: 1008 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H030-51P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCBFeatures: Board Guide, Mating Guide Packaging: Tube Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 30 Pitch: 0.079" (2.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 30.0µin (0.76µm) |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H030-54P1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCBFeatures: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 30 Pitch: 0.079" (2.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 3.00µin (0.076µm) Part Status: Obsolete |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H048-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 48POS PCB |
товару немає в наявності |
Мінімальне замовлення: 1008 шт В кошику од. на суму грн. | |||||||||||||||||||
| MP2-H048-41S3-S-TG | 3M |
Description: CONN HEADER FUTUREBUS+ 48POS PCBFeatures: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 48 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Solder Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 10.0µin (0.25µm) |
товару немає в наявності |
Мінімальне замовлення: 1008 шт В кошику од. на суму грн. |
| 100-020-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-022-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-024-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-024-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-028-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-028-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-032-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-032-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-040-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-040-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-042-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-048-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 203-6585-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 203-6585-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 203-6970-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 103 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 813.34 грн |
| 10+ | 604.87 грн |
| 100+ | 501.20 грн |
| 203-6970-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 375 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 788.74 грн |
| 10+ | 585.01 грн |
| 100+ | 483.31 грн |
| 204-6585-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1018.07 грн |
| 10+ | 765.03 грн |
| 204-6585-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 989.50 грн |
| 10+ | 740.58 грн |
| 204-6970-00-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 184 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 906.18 грн |
| 10+ | 677.77 грн |
| 100+ | 564.26 грн |
| 204-6970-50-0602J |
![]() |
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 136 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 890.31 грн |
| 10+ | 664.70 грн |
| 100+ | 552.41 грн |
| 203-2737-55-1102 |
![]() |
Виробник: 3M
Description: CONN TRANSIST TO-3/TO-66 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN TRANSIST TO-3/TO-66 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 337 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3816.76 грн |
| 10+ | 3124.08 грн |
| 30+ | 2891.16 грн |
| 50+ | 2617.27 грн |
| 100+ | 2492.49 грн |
| 250+ | 2370.73 грн |
| SBR-ST-29-P-ML |
![]() |
Виробник: 3M
Description: CONN SAS RCPT 29POS PRESSFIT PCB
Description: CONN SAS RCPT 29POS PRESSFIT PCB
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| SBR-EV-29-P-ML |
![]() |
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| SBH-ST-29-SA-ML |
![]() |
Виробник: 3M
Description: CONN SAS PLUG 29POS SLD PCB
Description: CONN SAS PLUG 29POS SLD PCB
товару немає в наявності
Мінімальне замовлення: 5400 шт
В кошику
од. на суму грн.
| SBH-ST-29-SM-ML |
![]() |
Виробник: 3M
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 936 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 437.22 грн |
| 10+ | 382.13 грн |
| 25+ | 361.92 грн |
| 40+ | 331.75 грн |
| 80+ | 315.94 грн |
| 230+ | 276.45 грн |
| 440+ | 264.15 грн |
| SBR-RA-29-S-ML |
![]() |
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
Мінімальне замовлення: 5250 шт
В кошику
од. на суму грн.
| 4808-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 10082 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 65.86 грн |
| 10+ | 54.40 грн |
| 25+ | 50.95 грн |
| 50+ | 45.54 грн |
| 100+ | 43.36 грн |
| 250+ | 40.64 грн |
| 500+ | 38.07 грн |
| 1000+ | 36.25 грн |
| 2500+ | 33.98 грн |
| 4814-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 10894 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 70.62 грн |
| 10+ | 57.46 грн |
| 28+ | 53.41 грн |
| 56+ | 47.73 грн |
| 112+ | 45.45 грн |
| 252+ | 42.92 грн |
| 504+ | 40.20 грн |
| 1008+ | 38.28 грн |
| 2520+ | 35.88 грн |
| 4816-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1452 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 76.97 грн |
| 10+ | 62.58 грн |
| 25+ | 58.68 грн |
| 50+ | 52.45 грн |
| 100+ | 49.95 грн |
| 250+ | 46.81 грн |
| 500+ | 43.85 грн |
| 1000+ | 41.75 грн |
| 4818-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7708 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 103.16 грн |
| 22+ | 79.68 грн |
| 44+ | 75.86 грн |
| 66+ | 69.18 грн |
| 110+ | 66.72 грн |
| 264+ | 62.72 грн |
| 506+ | 58.93 грн |
| 1012+ | 56.11 грн |
| 2508+ | 52.63 грн |
| 4820-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7540 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 80.94 грн |
| 20+ | 63.04 грн |
| 40+ | 60.02 грн |
| 60+ | 54.75 грн |
| 100+ | 52.80 грн |
| 260+ | 49.36 грн |
| 500+ | 46.36 грн |
| 1000+ | 44.14 грн |
| 2500+ | 41.38 грн |
| 4824-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1159 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 67.45 грн |
| 16+ | 53.44 грн |
| 32+ | 50.86 грн |
| 64+ | 45.45 грн |
| 112+ | 43.69 грн |
| 256+ | 41.20 грн |
| 512+ | 38.59 грн |
| 1008+ | 36.79 грн |
| 4824-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3962 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 67.45 грн |
| 16+ | 53.44 грн |
| 32+ | 50.86 грн |
| 64+ | 45.45 грн |
| 112+ | 43.69 грн |
| 256+ | 41.20 грн |
| 512+ | 38.59 грн |
| 1008+ | 36.79 грн |
| 2512+ | 34.50 грн |
| 4828-3000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
Мінімальне замовлення: 3360 шт
В кошику
од. на суму грн.
| 4828-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1521 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 128.55 грн |
| 14+ | 102.12 грн |
| 28+ | 97.26 грн |
| 56+ | 86.90 грн |
| 112+ | 82.75 грн |
| 252+ | 78.15 грн |
| 504+ | 73.20 грн |
| 1008+ | 69.70 грн |
| 4832-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2191 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 73.00 грн |
| 12+ | 59.28 грн |
| 36+ | 54.85 грн |
| 60+ | 49.65 грн |
| 108+ | 47.63 грн |
| 252+ | 44.86 грн |
| 504+ | 42.02 грн |
| 1008+ | 40.02 грн |
| 4840-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1950 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 134.90 грн |
| 10+ | 110.87 грн |
| 30+ | 102.60 грн |
| 50+ | 92.88 грн |
| 100+ | 88.43 грн |
| 250+ | 82.89 грн |
| 500+ | 77.64 грн |
| 1000+ | 73.93 грн |
| 4848-6000-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1345 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 163.46 грн |
| 16+ | 129.23 грн |
| 32+ | 123.05 грн |
| 56+ | 111.00 грн |
| 104+ | 106.25 грн |
| 256+ | 99.71 грн |
| 504+ | 93.50 грн |
| 1000+ | 89.08 грн |
| 4808-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 18692 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 70.62 грн |
| 10+ | 57.77 грн |
| 25+ | 54.16 грн |
| 50+ | 48.40 грн |
| 100+ | 46.09 грн |
| 250+ | 43.20 грн |
| 500+ | 40.46 грн |
| 1000+ | 38.53 грн |
| 2500+ | 36.11 грн |
| 4814-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3939 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 65.86 грн |
| 10+ | 53.64 грн |
| 28+ | 49.86 грн |
| 56+ | 44.55 грн |
| 112+ | 42.42 грн |
| 252+ | 40.06 грн |
| 504+ | 37.52 грн |
| 1008+ | 35.73 грн |
| 2520+ | 33.49 грн |
| 4816-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4379 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 80.14 грн |
| 10+ | 65.64 грн |
| 25+ | 61.53 грн |
| 50+ | 55.00 грн |
| 100+ | 52.36 грн |
| 250+ | 49.08 грн |
| 500+ | 45.97 грн |
| 1000+ | 43.78 грн |
| 2500+ | 41.04 грн |
| 4818-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 5910 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 55.55 грн |
| 22+ | 42.89 грн |
| 44+ | 40.85 грн |
| 66+ | 37.23 грн |
| 110+ | 35.92 грн |
| 264+ | 33.76 грн |
| 506+ | 31.72 грн |
| 1012+ | 30.20 грн |
| 2508+ | 28.33 грн |
| 4820-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7695 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 55.55 грн |
| 20+ | 43.17 грн |
| 40+ | 41.11 грн |
| 60+ | 37.49 грн |
| 100+ | 36.16 грн |
| 260+ | 33.80 грн |
| 500+ | 31.75 грн |
| 1000+ | 30.23 грн |
| 2500+ | 28.34 грн |
| 4824-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
Мінімальне замовлення: 6400 шт
В кошику
од. на суму грн.
| 4824-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2788 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 96.01 грн |
| 16+ | 76.08 грн |
| 32+ | 72.42 грн |
| 64+ | 64.72 грн |
| 112+ | 62.21 грн |
| 256+ | 58.68 грн |
| 512+ | 54.96 грн |
| 1008+ | 52.40 грн |
| 2512+ | 49.13 грн |
| 4828-3004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6846 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 118.23 грн |
| 14+ | 94.26 грн |
| 28+ | 89.78 грн |
| 56+ | 80.21 грн |
| 112+ | 76.38 грн |
| 252+ | 72.13 грн |
| 504+ | 67.56 грн |
| 1008+ | 64.34 грн |
| 2506+ | 60.33 грн |
| 4828-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1693 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 113.47 грн |
| 14+ | 90.82 грн |
| 28+ | 86.45 грн |
| 56+ | 77.28 грн |
| 112+ | 73.57 грн |
| 252+ | 69.48 грн |
| 504+ | 65.08 грн |
| 1008+ | 61.97 грн |
| 4832-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2880 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 80.94 грн |
| 12+ | 65.65 грн |
| 36+ | 60.75 грн |
| 60+ | 54.98 грн |
| 108+ | 52.74 грн |
| 252+ | 49.68 грн |
| 504+ | 46.53 грн |
| 1008+ | 44.31 грн |
| 2508+ | 41.55 грн |
| 4840-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1505 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 87.29 грн |
| 10+ | 71.29 грн |
| 30+ | 65.94 грн |
| 50+ | 59.68 грн |
| 100+ | 56.82 грн |
| 250+ | 53.26 грн |
| 500+ | 49.89 грн |
| 1000+ | 47.51 грн |
| 4848-6004-CP |
![]() |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1557 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 159.49 грн |
| 16+ | 125.89 грн |
| 32+ | 119.89 грн |
| 56+ | 108.15 грн |
| 104+ | 103.52 грн |
| 256+ | 97.14 грн |
| 504+ | 91.08 грн |
| 1000+ | 86.79 грн |
| D7E50-7316-02 |
![]() |
Виробник: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
на замовлення 650 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 501.49 грн |
| 10+ | 410.25 грн |
| 25+ | 384.53 грн |
| 50+ | 343.63 грн |
| 100+ | 327.22 грн |
| 300+ | 302.82 грн |
| 500+ | 287.32 грн |
| D7E50-8316-03 |
![]() |
Виробник: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
на замовлення 631 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 603.86 грн |
| 10+ | 494.38 грн |
| 25+ | 463.39 грн |
| 50+ | 414.09 грн |
| 100+ | 394.32 грн |
| 300+ | 364.92 грн |
| 500+ | 346.24 грн |
| 3418-0000 |
![]() |
Виробник: 3M
Description: CONN IDC 40POS 26-28AWG VERT
Features: Feed Through
Packaging: Bulk
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 40
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
Description: CONN IDC 40POS 26-28AWG VERT
Features: Feed Through
Packaging: Bulk
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 40
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| 3426-0000 |
![]() |
Виробник: 3M
Description: CONN IDC 50POS 26-28AWG VERT
Features: Feed Through
Packaging: Bulk
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 50
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
Description: CONN IDC 50POS 26-28AWG VERT
Features: Feed Through
Packaging: Bulk
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 50
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| 3434-0000 |
![]() |
Виробник: 3M
Description: CONN IDC 26POS 26-28AWG VERT
Features: Feed Through
Packaging: Bulk
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 26
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
Description: CONN IDC 26POS 26-28AWG VERT
Features: Feed Through
Packaging: Bulk
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 26
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| MP2-H024-41P1-S-TG30 |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Features: Board Guide, Mating Guide
Packaging: Tube
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 24
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Features: Board Guide, Mating Guide
Packaging: Tube
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 24
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
товару немає в наявності
Мінімальне замовлення: 1008 шт
В кошику
од. на суму грн.
| MP2-H030-51P1-S-TG30 |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Features: Board Guide, Mating Guide
Packaging: Tube
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Features: Board Guide, Mating Guide
Packaging: Tube
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
товару немає в наявності
Мінімальне замовлення: 840 шт
В кошику
од. на суму грн.
| MP2-H030-54P1-S-TR30 |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
товару немає в наявності
Мінімальне замовлення: 840 шт
В кошику
од. на суму грн.
| MP2-H048-41P1-S-TG30 |
![]() |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Description: CONN HEADER FUTUREBUS+ 48POS PCB
товару немає в наявності
Мінімальне замовлення: 1008 шт
В кошику
од. на суму грн.
| MP2-H048-41S3-S-TG |
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Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 10.0µin (0.25µm)
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 10.0µin (0.25µm)
товару немає в наявності
Мінімальне замовлення: 1008 шт
В кошику
од. на суму грн.


























