| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 153226-2000-TB | 3M |
 Description: CONN SKT 2MM 26POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | |
| 153226-2020-TB | 3M |
Description: CONN SKT 2MM 26POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | |
| 153226-2020-TH | 3M |
Description: CONN SKT 2MM 26POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 140 шт В кошику од. на суму грн. | |
| 153230-2020-TB | 3M |
Description: CONN RCPT 30POS 0.079 GOLD SMD Number of Positions: 30 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable |
товару немає в наявності |
В кошику од. на суму грн. | |
| 153230-2020-TH | 3M |
Description: CONN SKT 2MM 30POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 126 шт В кошику од. на суму грн. | |
| 153232-2020-TB | 3M |
Description: CONN SKT 2MM 32POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 336 шт В кошику од. на суму грн. | |
| 153236-2020-TB | 3M |
Description: CONN RCPT 36POS 0.079 GOLD SMD Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 36 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 |
товару немає в наявності |
В кошику од. на суму грн. | |
 |
153240-2020-TB | 3M |
Description: CONN RCPT 40POS 0.079 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 40 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| 153242-2020-TB | 3M |
Description: CONN SKT 2MM 42POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 252 шт В кошику од. на суму грн. | |
| 153242-2020-TB-WE | 3M |
Description: CONN SKT 2MM 42POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 2400 шт В кошику од. на суму грн. | |
| 153244-2020-TB | 3M |
Description: CONN RCPT 44POS 0.079 GOLD SMD |
товару немає в наявності |
Мінімальне замовлення: 252 шт В кошику од. на суму грн. | |
| 153246-2000-TB | 3M |
Description: CONN RCPT 46POS 0.079 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 46 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| 153246-2000-TB-WF | 3M |
Description: CONN RCPT 46POS 0.079 GOLD SMD Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 46 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Number of Rows: 2 Connector Type: Receptacle, Bottom or Top Entry Features: Pick and Place Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |
| 153250-2020-TB | 3M |
Description: CONN RCPT 50POS 0.079 GOLD SMD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 153250-2020-TH | 3M |
Description: CONN RCPT 50POS 0.079 GOLD SMD Part Status: Obsolete Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 50 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) |
товару немає в наявності |
В кошику од. на суму грн. | |
| 153260-2000-TB | 3M |
Description: CONN SKT 2MM 60POS THRU-BRD SMD |
товару немає в наявності |
Мінімальне замовлення: 168 шт В кошику од. на суму грн. | |
| 153260-2020-TB | 3M |
Description: CONN RCPT 60POS 0.079 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 60 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| 153204-2000-RB-WA | 3M |
Description: CONN RCPT 4POS 0.079 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 4 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Pick and Place Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2400 шт В кошику од. на суму грн. | |
| 153214-2000-RB | 3M |
Description: CONN RCPT 14POS 0.079 GOLD SMD Style: Board to Board or Cable Number of Positions: 14 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Packaging: Tray Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C |
товару немає в наявності |
Мінімальне замовлення: 532 шт В кошику од. на суму грн. | |
 |
153216-2020-RB | 3M |
Description: CONN RCPT 16POS 0.079 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 16 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 476 шт В кошику од. на суму грн. |
 |
153250-2020-RB | 3M |
Description: CONN RCPT 50POS 0.079 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.129" (3.28mm) Part Status: Obsolete Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 105°C Style: Board to Board or Cable Number of Positions: 50 Mounting Type: Surface Mount Current Rating (Amps): 1A Voltage Rating: 500VDC Connector Type: Receptacle, Bottom or Top Entry Features: Board Guide Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| ICO-083-S8A-T | 3M |
Description: CONN IC DIP SOCKET 8POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| ICO-083-S8-T | 3M |
Description: CONN IC DIP SOCKET 8POS TIN Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 10000 шт В кошику од. на суму грн. | |
| ICO-143-S8A-T | 3M |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
Мінімальне замовлення: 8400 шт В кошику од. на суму грн. | |
| ICO-143-S8-T | 3M |
Description: CONN IC DIP SOCKET 14POS TIN Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 8400 шт В кошику од. на суму грн. | |
| ICO-163-S8A-T | 3M |
Description: CONN IC DIP SOCKET 16POS TIN Part Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 9600 шт В кошику од. на суму грн. | |
| ICO-183-S8A-T | 3M |
Description: CONN IC DIP SOCKET 18POS TIN Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 8800 шт В кошику од. на суму грн. | |
| ICO-203-S8A-T | 3M |
Description: CONN IC DIP SOCKET 20POS TIN Part Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 8000 шт В кошику од. на суму грн. | |
| ICO-203-S8-T | 3M |
Description: CONN IC DIP SOCKET 20POS TIN Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze |
товару немає в наявності |
Мінімальне замовлення: 8000 шт В кошику од. на суму грн. | |
| ICO-243-S8A-T | 3M |
Description: CONN IC DIP SOCKET 24POS TIN Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Box |
товару немає в наявності |
Мінімальне замовлення: 9600 шт В кошику од. на суму грн. | |
| ICO-246-S8-T | 3M |
Description: CONN IC DIP SOCKET 24POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -65°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
Мінімальне замовлення: 7680 шт В кошику од. на суму грн. | |
| ICO-286-S8A-T | 3M |
Description: CONN IC DIP SOCKET 28POS TIN |
товару немає в наявності |
Мінімальне замовлення: 10080 шт В кошику од. на суму грн. | |
| ICO-286-S8-T | 3M |
Description: CONN IC DIP SOCKET 28POS TIN Part Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |
| ICO-326-S8A-T | 3M |
Description: CONN IC DIP SOCKET 32POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -65°C ~ 105°C |
товару немає в наявності |
Мінімальне замовлення: 8640 шт В кошику од. на суму грн. | |
| ICO-326-S8-T | 3M |
Description: CONN IC DIP SOCKET 32POS TIN Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing |
товару немає в наявності |
Мінімальне замовлення: 8640 шт В кошику од. на суму грн. | |
| ICO-406-S8A-T | 3M |
Description: CONN IC DIP SOCKET 40POS TIN |
товару немає в наявності |
Мінімальне замовлення: 9600 шт В кошику од. на суму грн. | |
| ICO-406-S8-T | 3M |
Description: CONN IC DIP SOCKET 40POS TIN |
товару немає в наявності |
Мінімальне замовлення: 9600 шт В кошику од. на суму грн. | |
| ICO-426-S8A-T | 3M |
Description: CONN IC DIP SOCKET 42POS TIN Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 42 (2 x 21) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 8640 шт В кошику од. на суму грн. | |
| ICO-426-S8-T | 3M |
Description: CONN IC DIP SOCKET 42POS TIN Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 42 (2 x 21) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 8640 шт В кошику од. на суму грн. | |
| ICO-486-S8A-T | 3M |
Description: CONN IC DIP SOCKET 48POS TIN Part Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |
| ICO-486-S8-T | 3M |
Description: CONN IC DIP SOCKET 48POS TIN Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -65°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze |
товару немає в наявності |
Мінімальне замовлення: 9600 шт В кошику од. на суму грн. | |
| 923719 | 3M |
Description: TEST CLIP 32POS DIP NAIL-HEAD |
товару немає в наявності |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | |
| 100-006-000 | 3M |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-008-000 | 3M |
Description: CONN IC DIP SOCKET 8POS GOLD Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-008-001 | 3M |
Description: CONN IC DIP SOCKET 8POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-010-000 | 3M |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-014-000 | 3M |
Description: CONN IC DIP SOCKET 14POS GOLD Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-014-001 | 3M |
Description: CONN IC DIP SOCKET 14POS GOLD Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-016-000 | 3M |
Description: CONN IC DIP SOCKET 16POS GOLD Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-016-001 | 3M |
Description: CONN IC DIP SOCKET 16POS GOLD Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Features: Closed Frame, Seal Tape Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-018-000 | 3M |
Description: CONN IC DIP SOCKET 18POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -65°C ~ 125°C |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-018-001 | 3M |
Description: CONN IC DIP SOCKET 18POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-020-000 | 3M |
Description: CONN IC DIP SOCKET 20POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-020-001 | 3M |
Description: CONN IC DIP SOCKET 20POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-022-000 | 3M |
Description: CONN IC DIP SOCKET 22POS GOLD Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-024-000 | 3M |
Description: CONN IC DIP SOCKET 24POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-024-001 | 3M |
Description: CONN IC DIP SOCKET 24POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-028-000 | 3M |
Description: CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -65°C ~ 125°C |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-028-001 | 3M |
Description: CONN IC DIP SOCKET 28POS GOLD Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 100-032-000 | 3M |
Description: CONN IC DIP SOCKET 32POS GOLD Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) |
товару немає в наявності |
В кошику од. на суму грн. |
| 153226-2000-TB |
|
Виробник: 3M
Description: CONN SKT 2MM 26POS THRU-BRD SMD
Description: CONN SKT 2MM 26POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| 153226-2020-TB |
|
Виробник: 3M
Description: CONN SKT 2MM 26POS THRU-BRD SMD
Description: CONN SKT 2MM 26POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| 153226-2020-TH |
|
Виробник: 3M
Description: CONN SKT 2MM 26POS THRU-BRD SMD
Description: CONN SKT 2MM 26POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 140 шт
В кошику
од. на суму грн.
| 153230-2020-TB |
|
Виробник: 3M
Description: CONN RCPT 30POS 0.079 GOLD SMD
Number of Positions: 30
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Description: CONN RCPT 30POS 0.079 GOLD SMD
Number of Positions: 30
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
товару немає в наявності
В кошику
од. на суму грн.
| 153230-2020-TH |
|
Виробник: 3M
Description: CONN SKT 2MM 30POS THRU-BRD SMD
Description: CONN SKT 2MM 30POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 126 шт
В кошику
од. на суму грн.
| 153232-2020-TB |
|
Виробник: 3M
Description: CONN SKT 2MM 32POS THRU-BRD SMD
Description: CONN SKT 2MM 32POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 336 шт
В кошику
од. на суму грн.
| 153236-2020-TB |
|
Виробник: 3M
Description: CONN RCPT 36POS 0.079 GOLD SMD
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 36
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Description: CONN RCPT 36POS 0.079 GOLD SMD
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 36
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
товару немає в наявності
В кошику
од. на суму грн.
| 153240-2020-TB |
|
Виробник: 3M
Description: CONN RCPT 40POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 40
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Description: CONN RCPT 40POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 40
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 153242-2020-TB |
|
Виробник: 3M
Description: CONN SKT 2MM 42POS THRU-BRD SMD
Description: CONN SKT 2MM 42POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 252 шт
В кошику
од. на суму грн.
| 153242-2020-TB-WE |
|
Виробник: 3M
Description: CONN SKT 2MM 42POS THRU-BRD SMD
Description: CONN SKT 2MM 42POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 2400 шт
В кошику
од. на суму грн.
| 153244-2020-TB |
|
Виробник: 3M
Description: CONN RCPT 44POS 0.079 GOLD SMD
Description: CONN RCPT 44POS 0.079 GOLD SMD
товару немає в наявності
Мінімальне замовлення: 252 шт
В кошику
од. на суму грн.
| 153246-2000-TB |
|
Виробник: 3M
Description: CONN RCPT 46POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 46
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Packaging: Tray
Description: CONN RCPT 46POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 46
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 153246-2000-TB-WF |
|
Виробник: 3M
Description: CONN RCPT 46POS 0.079 GOLD SMD
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 46
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Number of Rows: 2
Connector Type: Receptacle, Bottom or Top Entry
Features: Pick and Place
Packaging: Tape & Reel (TR)
Description: CONN RCPT 46POS 0.079 GOLD SMD
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 46
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Number of Rows: 2
Connector Type: Receptacle, Bottom or Top Entry
Features: Pick and Place
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| 153250-2020-TB |
|
Виробник: 3M
Description: CONN RCPT 50POS 0.079 GOLD SMD
Description: CONN RCPT 50POS 0.079 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
| 153250-2020-TH |
|
Виробник: 3M
Description: CONN RCPT 50POS 0.079 GOLD SMD
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 50
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Description: CONN RCPT 50POS 0.079 GOLD SMD
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 50
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
товару немає в наявності
В кошику
од. на суму грн.
| 153260-2000-TB |
|
Виробник: 3M
Description: CONN SKT 2MM 60POS THRU-BRD SMD
Description: CONN SKT 2MM 60POS THRU-BRD SMD
товару немає в наявності
Мінімальне замовлення: 168 шт
В кошику
од. на суму грн.
| 153260-2020-TB |
|
Виробник: 3M
Description: CONN RCPT 60POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 60
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Description: CONN RCPT 60POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 60
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 153204-2000-RB-WA |
|
Виробник: 3M
Description: CONN RCPT 4POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 4
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Pick and Place
Packaging: Tape & Reel (TR)
Description: CONN RCPT 4POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 4
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Pick and Place
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2400 шт
В кошику
од. на суму грн.
| 153214-2000-RB |
|
Виробник: 3M
Description: CONN RCPT 14POS 0.079 GOLD SMD
Style: Board to Board or Cable
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Description: CONN RCPT 14POS 0.079 GOLD SMD
Style: Board to Board or Cable
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
товару немає в наявності
Мінімальне замовлення: 532 шт
В кошику
од. на суму грн.
| 153216-2020-RB |
|
Виробник: 3M
Description: CONN RCPT 16POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 16
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Description: CONN RCPT 16POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 16
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 476 шт
В кошику
од. на суму грн.
| 153250-2020-RB |
|
Виробник: 3M
Description: CONN RCPT 50POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 50
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
Description: CONN RCPT 50POS 0.079 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.129" (3.28mm)
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 50
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Voltage Rating: 500VDC
Connector Type: Receptacle, Bottom or Top Entry
Features: Board Guide
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| ICO-083-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| ICO-083-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 10000 шт
В кошику
од. на суму грн.
| ICO-143-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
Мінімальне замовлення: 8400 шт
В кошику
од. на суму грн.
| ICO-143-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 14POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 8400 шт
В кошику
од. на суму грн.
| ICO-163-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 16POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 9600 шт
В кошику
од. на суму грн.
| ICO-183-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 8800 шт
В кошику
од. на суму грн.
| ICO-203-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 20POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 8000 шт
В кошику
од. на суму грн.
| ICO-203-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Description: CONN IC DIP SOCKET 20POS TIN
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
товару немає в наявності
Мінімальне замовлення: 8000 шт
В кошику
од. на суму грн.
| ICO-243-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Box
Description: CONN IC DIP SOCKET 24POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Box
товару немає в наявності
Мінімальне замовлення: 9600 шт
В кошику
од. на суму грн.
| ICO-246-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
Мінімальне замовлення: 7680 шт
В кошику
од. на суму грн.
| ICO-286-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
Мінімальне замовлення: 10080 шт
В кошику
од. на суму грн.
| ICO-286-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| ICO-326-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 105°C
Description: CONN IC DIP SOCKET 32POS TIN
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 105°C
товару немає в наявності
Мінімальне замовлення: 8640 шт
В кошику
од. на суму грн.
| ICO-326-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Description: CONN IC DIP SOCKET 32POS TIN
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
товару немає в наявності
Мінімальне замовлення: 8640 шт
В кошику
од. на суму грн.
| ICO-406-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
Мінімальне замовлення: 9600 шт
В кошику
од. на суму грн.
| ICO-406-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
Мінімальне замовлення: 9600 шт
В кошику
од. на суму грн.
| ICO-426-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 42POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 8640 шт
В кошику
од. на суму грн.
| ICO-426-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 42POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 8640 шт
В кошику
од. на суму грн.
| ICO-486-S8A-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 48POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| ICO-486-S8-T |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Description: CONN IC DIP SOCKET 48POS TIN
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
товару немає в наявності
Мінімальне замовлення: 9600 шт
В кошику
од. на суму грн.
| 923719 |
|
Виробник: 3M
Description: TEST CLIP 32POS DIP NAIL-HEAD
Description: TEST CLIP 32POS DIP NAIL-HEAD
товару немає в наявності
Мінімальне замовлення: 10 шт
В кошику
од. на суму грн.
| 100-006-000 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 100-008-000 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 100-008-001 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-010-000 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 100-014-000 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-014-001 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Part Status: Obsolete
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 100-016-000 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Description: CONN IC DIP SOCKET 16POS GOLD
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
товару немає в наявності
В кошику
од. на суму грн.
| 100-016-001 |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Features: Closed Frame, Seal Tape
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Features: Closed Frame, Seal Tape
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику
од. на суму грн.
| 100-018-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -65°C ~ 125°C
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -65°C ~ 125°C
товару немає в наявності
В кошику
од. на суму грн.
| 100-018-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-020-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-020-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-022-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 22POS GOLD
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Description: CONN IC DIP SOCKET 22POS GOLD
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
товару немає в наявності
В кошику
од. на суму грн.
| 100-024-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-024-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 100-028-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Description: CONN IC DIP SOCKET 28POS GOLD
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
товару немає в наявності
В кошику
од. на суму грн.
| 100-028-001 |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 100-032-000 |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Description: CONN IC DIP SOCKET 32POS GOLD
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
товару немає в наявності
В кошику
од. на суму грн.