Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 113 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2552-111-13 | Aries Electronics |
Description: 800 VERTISOCKET HORIZONTAL MOUNT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 26-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 26-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 28-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 30-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 30-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 32-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 32-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 34-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 34-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 36-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 36-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 38-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 38-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 40-6820-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 40-6822-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 40-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 4847-111-13 | Aries Electronics |
Description: 800 VERTISOCKET HORIZONTAL MOUNT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 48-6823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 48POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 48-6823-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 48POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-2810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-2810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-2810-90WR | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
10-2810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
на замовлення 236 шт: термін постачання 21-31 дні (днів) |
|
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| 10-6810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 10-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 1105572 | Aries Electronics |
Description: 800 VERTISOCKET VERTICAL MOUNTPart Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 1108680 | Aries Electronics |
Description: 800 VERTISOCKET VERTICAL MOUNTPart Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 1110137 | Aries Electronics |
Description: 800 VERTISOCKET VERTICAL MOUNT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 1110221 | Aries Electronics |
Description: 800 VERTISOCKET VERTICAL MOUNT |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 12-6810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 12-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 12-6810-90TWR | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 12-6810-90WR | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 14-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 14-810-90TWR | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 14-810-90WR | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 16-6810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 16-810-90TWR | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 16-810-90WR | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
|
18-6810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
| 18-810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 18-810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 18-810-90WR | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 20-6810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 20-6810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 20-810-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 20-810-90T | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 20-810-90TWR | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-822-90E | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 14-810-90RWR | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 14-822-90E | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 18-822-90E | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 18-822-90EWR | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 20-822-90E | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 06-810-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-2810-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| 08-810-90C | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
| 2552-111-13 |
![]() |
Виробник: Aries Electronics
Description: 800 VERTISOCKET HORIZONTAL MOUNT
Description: 800 VERTISOCKET HORIZONTAL MOUNT
товару немає в наявності
В кошику
од. на суму грн.
| 26-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Description: CONN IC DIP SOCKET 26POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 26-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS TIN
Description: CONN IC DIP SOCKET 26POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 28-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 30-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 30-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 30POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 32-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 32-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 34-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Description: CONN IC DIP SOCKET 34POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 34-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS TIN
Description: CONN IC DIP SOCKET 34POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 36-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 36-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS TIN
Description: CONN IC DIP SOCKET 36POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 38-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 38-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS TIN
Description: CONN IC DIP SOCKET 38POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 40-6820-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 40-6822-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 40-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 4847-111-13 |
![]() |
Виробник: Aries Electronics
Description: 800 VERTISOCKET HORIZONTAL MOUNT
Description: 800 VERTISOCKET HORIZONTAL MOUNT
товару немає в наявності
В кошику
од. на суму грн.
| 48-6823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 48-6823-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS TIN
Description: CONN IC DIP SOCKET 48POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 08-2810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-2810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 08-2810-90WR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-6810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 08-810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 10-2810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 10POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
на замовлення 236 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 624.02 грн |
| 10+ | 510.58 грн |
| 25+ | 478.58 грн |
| 50+ | 427.68 грн |
| 100+ | 407.26 грн |
| 10-6810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 10-6810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Description: CONN IC DIP SOCKET 10POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 1110137 |
![]() |
Виробник: Aries Electronics
Description: 800 VERTISOCKET VERTICAL MOUNT
Description: 800 VERTISOCKET VERTICAL MOUNT
товару немає в наявності
В кошику
од. на суму грн.
| 1110221 |
![]() |
Виробник: Aries Electronics
Description: 800 VERTISOCKET VERTICAL MOUNT
Description: 800 VERTISOCKET VERTICAL MOUNT
товару немає в наявності
В кошику
од. на суму грн.
| 12-6810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 12-6810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Description: CONN IC DIP SOCKET 12POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 12-6810-90TWR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS TIN
Description: CONN IC DIP SOCKET 12POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 12-6810-90WR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 14-6810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-810-90TWR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-810-90WR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 16-6810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 16-810-90TWR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 16-810-90WR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 18-6810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
на замовлення 53 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 18-810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 18-810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 18-810-90WR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 20-6810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 20-6810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-810-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 20-810-90T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-810-90TWR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 08-822-90E |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-810-90RWR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-822-90E |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 18-822-90E |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Description: CONN IC DIP SOCKET 18POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 18-822-90EWR |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Description: CONN IC DIP SOCKET 18POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-822-90E |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 06-810-90C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-2810-90C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-810-90C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.

