Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 1 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
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08-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 8POS TINPackaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Part Status: Active Number of Rows: 2 |
на замовлення 281 шт: термін постачання 21-31 дні (днів) |
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14-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 14POS TINPackaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Part Status: Active Number of Rows: 2 |
на замовлення 429 шт: термін постачання 21-31 дні (днів) |
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16-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 16POS TINPackaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Part Status: Active Number of Rows: 2 |
на замовлення 741 шт: термін постачання 21-31 дні (днів) |
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20-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 20POS TINPackaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 20 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
на замовлення 261 шт: термін постачання 21-31 дні (днів) |
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08-650-10 | Aries Electronics |
Description: .27 COVER 8 PIN |
на замовлення 1607 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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14-650-10 | Aries Electronics |
Description: .27" COVER 14 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 14 Accessory Type: Cap (Cover) |
на замовлення 172 шт: термін постачання 21-31 дні (днів) |
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14-650-20 | Aries Electronics |
Description: .51" COVER 14 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 14 Accessory Type: Cap (Cover) |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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14-650-30 | Aries Electronics |
Description: .65" COVER 14 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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14-650-40 | Aries Electronics |
Description: .90" COVER 14 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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16-650-10 | Aries Electronics |
Description: .27" COVER 16 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 16 Accessory Type: Cap (Cover) Part Status: Active |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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16-650-20 | Aries Electronics |
Description: .51" COVER 16 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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16-650-30 | Aries Electronics |
Description: .65" COVER 16 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 16 Accessory Type: Cap (Cover) Part Status: Active |
на замовлення 209 шт: термін постачання 21-31 дні (днів) |
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16-650-40 | Aries Electronics |
Description: .90" COVER 16 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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20-650-10 | Aries Electronics |
Description: .27" COVER 20 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 20 Accessory Type: Cap (Cover) |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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25-0600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 25POS TINPackaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 25 Pitch: 0.100" (2.54mm) Contact Type: Forked Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 1 |
на замовлення 287 шт: термін постачання 21-31 дні (днів) |
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14-810-90R | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Vertical Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 743 шт: термін постачання 21-31 дні (днів) |
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LP300 | Aries Electronics |
Description: CONN SCKT SHORTING PLUG FOR 0.3"Packaging: Bulk Color: Black For Use With/Related Products: 0.3" DIP Sockets Accessory Type: Shorting Plug Body Material: Polyamide (PA46), Nylon 4/6 |
на замовлення 243 шт: термін постачання 21-31 дні (днів) |
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12-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TINPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 182 шт: термін постачання 21-31 дні (днів) |
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20-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TINPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2704 шт: термін постачання 21-31 дні (днів) |
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25-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINPackaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 379 шт: термін постачання 21-31 дні (днів) |
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34-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 34POS TINPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 34 (1 x 34) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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12-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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20-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TIN |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||
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25-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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34-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 34POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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25-0513-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 663 шт: термін постачання 21-31 дні (днів) |
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25-0503-30 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Wire Wrap Housing Material: Polyamide (PA), Nylon, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 108 шт: термін постачання 21-31 дні (днів) |
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C8108-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C8114-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C8116-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C8118-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C8120-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| C8122-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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C8124-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C8128-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C8140-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9108-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9114-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9116-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9118-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9120-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9122-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9124-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9128-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9140-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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84-537-21 | Aries Electronics |
Description: CONN SOCKET PLCC ZIF 84POS GOLDFeatures: Closed Frame Mounting Type: Surface Mount Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12.0µin (0.30µm) Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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40-516-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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24-516-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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20-823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1096 шт: термін постачання 21-31 дні (днів) |
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40-526-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 170 шт: термін постачання 21-31 дні (днів) |
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44-547-11 | Aries Electronics |
Description: CONN SOCKET SOIC ZIF 44POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC, ZIF (ZIP) Number of Positions or Pins (Grid): 44 (2 x 22) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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44-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6Packaging: Bulk Number of Pins: 44 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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68-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6Packaging: Bulk Number of Pins: 68 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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18-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 18POS TINPackaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 18 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
на замовлення 128 шт: термін постачання 21-31 дні (днів) |
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40-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 40POS TINPackaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 40 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.600" (15.24mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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24-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS TINFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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24-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS GLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 205 шт: термін постачання 21-31 дні (днів) |
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28-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 200 шт: термін постачання 21-31 дні (днів) |
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28-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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32-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 32POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 368 шт: термін постачання 21-31 дні (днів) |
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| 08-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 8POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 8POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
на замовлення 281 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 133.19 грн |
| 44+ | 103.93 грн |
| 132+ | 99.22 грн |
| 14-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 14POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 14POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
на замовлення 429 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 184.17 грн |
| 26+ | 140.86 грн |
| 104+ | 127.72 грн |
| 16-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 16POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 16POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
на замовлення 741 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 199.79 грн |
| 23+ | 154.25 грн |
| 115+ | 137.68 грн |
| 506+ | 116.38 грн |
| 20-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 20POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP FORK 20POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
на замовлення 261 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 231.85 грн |
| 10+ | 202.68 грн |
| 100+ | 178.62 грн |
| 08-650-10 |
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Виробник: Aries Electronics
Description: .27 COVER 8 PIN
Description: .27 COVER 8 PIN
на замовлення 1607 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 14-650-10 |
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Виробник: Aries Electronics
Description: .27" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
Description: .27" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
на замовлення 172 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 204.72 грн |
| 10+ | 167.45 грн |
| 25+ | 156.95 грн |
| 50+ | 140.25 грн |
| 100+ | 133.55 грн |
| 14-650-20 |
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Виробник: Aries Electronics
Description: .51" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
Description: .51" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 248.29 грн |
| 10+ | 203.15 грн |
| 14-650-30 |
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Виробник: Aries Electronics
Description: .65" COVER 14 PIN
Description: .65" COVER 14 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-650-40 |
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Виробник: Aries Electronics
Description: .90" COVER 14 PIN
Description: .90" COVER 14 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 16-650-10 |
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Виробник: Aries Electronics
Description: .27" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
Description: .27" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 212.12 грн |
| 10+ | 173.94 грн |
| 25+ | 163.06 грн |
| 50+ | 145.70 грн |
| 16-650-20 |
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Виробник: Aries Electronics
Description: .51" COVER 16 PIN
Description: .51" COVER 16 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 16-650-30 |
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Виробник: Aries Electronics
Description: .65" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
Description: .65" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
на замовлення 209 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 212.12 грн |
| 10+ | 173.94 грн |
| 25+ | 163.06 грн |
| 50+ | 145.70 грн |
| 100+ | 138.74 грн |
| 16-650-40 |
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Виробник: Aries Electronics
Description: .90" COVER 16 PIN
Description: .90" COVER 16 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-650-10 |
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Виробник: Aries Electronics
Description: .27" COVER 20 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 20
Accessory Type: Cap (Cover)
Description: .27" COVER 20 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 20
Accessory Type: Cap (Cover)
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 336.27 грн |
| 10+ | 275.04 грн |
| 25+ | 257.85 грн |
| 25-0600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 25POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
Description: CONN HDR DIP FORK 25POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
на замовлення 287 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 259.80 грн |
| 10+ | 212.81 грн |
| 100+ | 180.86 грн |
| 14-810-90R |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Vertical
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 743 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 585.38 грн |
| 10+ | 507.81 грн |
| 25+ | 478.39 грн |
| 50+ | 437.42 грн |
| 100+ | 425.91 грн |
| 250+ | 405.31 грн |
| LP300 |
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Виробник: Aries Electronics
Description: CONN SCKT SHORTING PLUG FOR 0.3"
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
Description: CONN SCKT SHORTING PLUG FOR 0.3"
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
на замовлення 243 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 189.92 грн |
| 10+ | 155.18 грн |
| 25+ | 145.45 грн |
| 50+ | 129.96 грн |
| 100+ | 123.76 грн |
| 12-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 12POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 182 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 332.15 грн |
| 16+ | 290.56 грн |
| 112+ | 256.01 грн |
| 20-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 20POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2704 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 414.37 грн |
| 10+ | 325.71 грн |
| 100+ | 265.53 грн |
| 500+ | 216.07 грн |
| 1000+ | 207.16 грн |
| 25-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET SIP 25POS TIN
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 379 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 578.80 грн |
| 16+ | 435.44 грн |
| 104+ | 368.81 грн |
| 34-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 34POS TIN
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (1 x 34)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 12-0501-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Description: CONN SOCKET SIP 12POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-0501-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Description: CONN SOCKET SIP 20POS TIN
на замовлення 14 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 25-0501-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 34-0501-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Description: CONN SOCKET SIP 34POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-0513-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 663 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 277.89 грн |
| 10+ | 226.83 грн |
| 100+ | 192.74 грн |
| 500+ | 161.46 грн |
| 25-0503-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 108 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1214.34 грн |
| 10+ | 899.07 грн |
| 100+ | 702.28 грн |
| C8108-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| C8114-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8116-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| C8118-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Description: CONN IC DIP SOCKET 18POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8120-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8122-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
Description: CONN IC DIP SOCKET 22POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8124-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8128-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8140-04 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C9108-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9114-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| C9116-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9118-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9120-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9122-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9124-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9128-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| C9140-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 84-537-21 |
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Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Part Status: Active
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC, ZIF (ZIP)
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 25173.07 грн |
| 40-516-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Description: CONN IC DIP SOCKET ZIF 40POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 24-516-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-823-90 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1096 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1046.62 грн |
| 10+ | 893.45 грн |
| 25+ | 859.11 грн |
| 50+ | 773.99 грн |
| 100+ | 730.99 грн |
| 250+ | 666.49 грн |
| 500+ | 613.27 грн |
| 1000+ | 562.52 грн |
| 40-526-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 170 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1034.28 грн |
| 11+ | 840.44 грн |
| 33+ | 777.75 грн |
| 55+ | 704.03 грн |
| 110+ | 670.44 грн |
| 44-547-11 |
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Виробник: Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 18035.03 грн |
| 44-653000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 68-653000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 18-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 18POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP FORK 18POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
на замовлення 128 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 208.83 грн |
| 20+ | 162.18 грн |
| 100+ | 144.75 грн |
| 40-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP FORK 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 477.68 грн |
| 10+ | 390.39 грн |
| 24-6554-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 74 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 921.65 грн |
| 10+ | 754.50 грн |
| 30+ | 698.19 грн |
| 50+ | 632.04 грн |
| 24-6554-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 205 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1696.95 грн |
| 10+ | 1388.83 грн |
| 30+ | 1285.27 грн |
| 50+ | 1163.48 грн |
| 100+ | 1107.98 грн |
| 28-6554-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1040.04 грн |
| 18+ | 816.92 грн |
| 27+ | 793.89 грн |
| 54+ | 709.46 грн |
| 108+ | 675.62 грн |
| 28-6554-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1826.03 грн |
| 18+ | 1433.44 грн |
| 27+ | 1393.01 грн |
| 32-6554-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 368 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1147.74 грн |
| 16+ | 908.35 грн |
| 32+ | 864.95 грн |
| 56+ | 780.30 грн |
| 104+ | 746.97 грн |
| 256+ | 701.01 грн |

























































