Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15982) > Сторінка 1 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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08-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 8POS TINNumber of Rows: 2 Part Status: Active Contact Finish Thickness: 200.0µin (5.08µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Contact Type: Forked Pitch: 0.100" (2.54mm) Number of Positions: 8 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: DIP, DIL - Header Packaging: Tube |
на замовлення 281 шт: термін постачання 21-31 дні (днів) |
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14-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 14POS TINNumber of Rows: 2 Part Status: Active Contact Finish Thickness: 200.0µin (5.08µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Contact Type: Forked Pitch: 0.100" (2.54mm) Number of Positions: 14 Packaging: Bulk Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: DIP, DIL - Header |
на замовлення 691 шт: термін постачання 21-31 дні (днів) |
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16-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 16POS TINPackaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Contact Type: Forked Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Part Status: Active Number of Rows: 2 |
на замовлення 1184 шт: термін постачання 21-31 дні (днів) |
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20-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 20POS TINNumber of Rows: 2 Contact Finish Thickness: 200.0µin (5.08µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Contact Type: Forked Pitch: 0.100" (2.54mm) Number of Positions: 20 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: DIP, DIL - Header Packaging: Tube |
на замовлення 261 шт: термін постачання 21-31 дні (днів) |
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08-650-10 | Aries Electronics |
Description: .27 COVER 8 PIN |
на замовлення 1607 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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14-650-10 | Aries Electronics |
Description: .27" COVER 14 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 14 Accessory Type: Cap (Cover) |
на замовлення 162 шт: термін постачання 21-31 дні (днів) |
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14-650-20 | Aries Electronics |
Description: .51" COVER 14 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 14 Accessory Type: Cap (Cover) |
на замовлення 139 шт: термін постачання 21-31 дні (днів) |
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14-650-30 | Aries Electronics |
Description: .65" COVER 14 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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14-650-40 | Aries Electronics |
Description: .90" COVER 14 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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16-650-10 | Aries Electronics |
Description: .27" COVER 16 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 16 Accessory Type: Cap (Cover) Part Status: Active |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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16-650-20 | Aries Electronics |
Description: .51" COVER 16 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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16-650-30 | Aries Electronics |
Description: .65" COVER 16 PINPackaging: Bulk For Use With/Related Products: 0600 Series Header Number of Positions: 16 Accessory Type: Cap (Cover) Part Status: Active |
на замовлення 96 шт: термін постачання 21-31 дні (днів) |
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16-650-40 | Aries Electronics |
Description: .90" COVER 16 PIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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20-650-10 | Aries Electronics |
Description: .27" COVER 20 PINAccessory Type: Cap (Cover) Number of Positions: 20 For Use With/Related Products: 0600 Series Header Packaging: Bulk |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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25-0600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 25POS TINNumber of Rows: 1 Contact Finish Thickness: 200.0µin (5.08µm) Termination: Solder Contact Type: Forked Pitch: 0.100" (2.54mm) Number of Positions: 25 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: DIP, DIL - Header Packaging: Bulk |
на замовлення 287 шт: термін постачання 21-31 дні (днів) |
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14-810-90R | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TINContact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Packaging: Bulk |
на замовлення 104 шт: термін постачання 21-31 дні (днів) |
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LP300 | Aries Electronics |
Description: CONN SCKT SHORTING PLUG FOR 0.3"Body Material: Polyamide (PA46), Nylon 4/6 Accessory Type: Shorting Plug For Use With/Related Products: 0.3" DIP Sockets Color: Black Packaging: Bulk |
на замовлення 243 шт: термін постачання 21-31 дні (днів) |
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12-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TINTermination: Solder Number of Positions or Pins (Grid): 12 (1 x 12) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled |
на замовлення 182 шт: термін постачання 21-31 дні (днів) |
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20-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (1 x 20) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Packaging: Bulk |
на замовлення 2704 шт: термін постачання 21-31 дні (днів) |
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25-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Packaging: Tube Part Status: Active |
на замовлення 379 шт: термін постачання 21-31 дні (днів) |
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34-0511-10 | Aries Electronics |
Description: CONN SOCKET SIP 34POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 34 (1 x 34) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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12-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 12POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 12 (1 x 12) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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20-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TIN |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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25-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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34-0501-30 | Aries Electronics |
Description: CONN SOCKET SIP 34POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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25-0513-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLDTermination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Type: SIP Mounting Type: Through Hole Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled |
на замовлення 1049 шт: термін постачання 21-31 дні (днів) |
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25-0503-30 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 25 (1 x 25) Type: SIP Mounting Type: Through Hole Packaging: Bulk |
на замовлення 108 шт: термін постачання 21-31 дні (днів) |
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C8108-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C8114-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C8116-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TINPart Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C8118-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C8120-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| C8122-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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C8124-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C8128-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C8140-04 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9108-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9114-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLDContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9116-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9118-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9120-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9122-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9124-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9128-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLDContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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C9140-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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84-537-21 | Aries Electronics |
Description: CONN SOCKET PLCC ZIF 84POS GOLDContact Finish Thickness - Mating: 12.0µin (0.30µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Number of Positions or Pins (Grid): 84 (4 x 21) Type: PLCC, ZIF (ZIP) Mounting Type: Surface Mount Features: Closed Frame Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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40-516-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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24-516-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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20-823-90 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLDContact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze |
на замовлення 802 шт: термін постачання 21-31 дні (днів) |
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40-526-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 175 шт: термін постачання 21-31 дні (днів) |
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44-547-11 | Aries Electronics |
Description: CONN SOCKET SOIC ZIF 44POS GOLDFeatures: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Finish - Post: Gold Pitch - Post: 0.050" (1.27mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Mating: Gold Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 44 (2 x 22) Type: SOIC, ZIF (ZIP) Mounting Type: Through Hole |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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44-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6Part Status: Active Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert From (Adapter End): PLCC Mounting Type: Through Hole Number of Pins: 44 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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68-653000-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6Number of Pins: 68 Packaging: Bulk Part Status: Active Board Material: FR4 Epoxy Glass Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert From (Adapter End): PLCC Mounting Type: Through Hole |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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18-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 18POS TINNumber of Rows: 2 Contact Finish Thickness: 200.0µin (5.08µm) Termination: Solder Row Spacing: 0.300" (7.62mm) Contact Type: Forked Pitch: 0.100" (2.54mm) Number of Positions: 18 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: DIP, DIL - Header Packaging: Bulk |
на замовлення 128 шт: термін постачання 21-31 дні (днів) |
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40-600-10 | Aries Electronics |
Description: CONN HDR DIP FORK 40POS TINNumber of Rows: 2 Contact Finish Thickness: 200.0µin (5.08µm) Termination: Solder Row Spacing: 0.600" (15.24mm) Contact Type: Forked Pitch: 0.100" (2.54mm) Number of Positions: 40 Mounting Type: Through Hole Color: Black Contact Finish: Tin Connector Type: DIP, DIL - Header Packaging: Bulk |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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24-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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24-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 177 шт: термін постачання 21-31 дні (днів) |
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28-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 241 шт: термін постачання 21-31 дні (днів) |
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28-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
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32-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 32POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 314 шт: термін постачання 21-31 дні (днів) |
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| 08-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 8POS TIN
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Tube
Description: CONN HDR DIP FORK 8POS TIN
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Tube
на замовлення 281 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 126.98 грн |
| 44+ | 99.08 грн |
| 132+ | 94.59 грн |
| 14-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 14POS TIN
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Packaging: Bulk
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Description: CONN HDR DIP FORK 14POS TIN
Number of Rows: 2
Part Status: Active
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Packaging: Bulk
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
на замовлення 691 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 176.36 грн |
| 26+ | 135.22 грн |
| 104+ | 122.59 грн |
| 520+ | 102.70 грн |
| 16-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 16POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR DIP FORK 16POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Forked
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
на замовлення 1184 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 195.95 грн |
| 23+ | 151.25 грн |
| 115+ | 134.98 грн |
| 506+ | 114.10 грн |
| 1012+ | 108.65 грн |
| 20-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 20POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 20
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Tube
Description: CONN HDR DIP FORK 20POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 20
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Tube
на замовлення 261 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 221.04 грн |
| 10+ | 193.22 грн |
| 100+ | 170.29 грн |
| 08-650-10 |
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Виробник: Aries Electronics
Description: .27 COVER 8 PIN
Description: .27 COVER 8 PIN
на замовлення 1607 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 14-650-10 |
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Виробник: Aries Electronics
Description: .27" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
Description: .27" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
на замовлення 162 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 234.36 грн |
| 10+ | 192.24 грн |
| 25+ | 180.18 грн |
| 50+ | 161.02 грн |
| 100+ | 153.33 грн |
| 14-650-20 |
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Виробник: Aries Electronics
Description: .51" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
Description: .51" COVER 14 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 14
Accessory Type: Cap (Cover)
на замовлення 139 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 234.36 грн |
| 10+ | 192.24 грн |
| 25+ | 180.18 грн |
| 50+ | 161.02 грн |
| 100+ | 153.33 грн |
| 14-650-30 |
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Виробник: Aries Electronics
Description: .65" COVER 14 PIN
Description: .65" COVER 14 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 14-650-40 |
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Виробник: Aries Electronics
Description: .90" COVER 14 PIN
Description: .90" COVER 14 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 16-650-10 |
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Виробник: Aries Electronics
Description: .27" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
Description: .27" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
на замовлення 61 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 241.41 грн |
| 10+ | 197.45 грн |
| 25+ | 185.07 грн |
| 50+ | 165.38 грн |
| 16-650-20 |
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Виробник: Aries Electronics
Description: .51" COVER 16 PIN
Description: .51" COVER 16 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 16-650-30 |
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Виробник: Aries Electronics
Description: .65" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
Description: .65" COVER 16 PIN
Packaging: Bulk
For Use With/Related Products: 0600 Series Header
Number of Positions: 16
Accessory Type: Cap (Cover)
Part Status: Active
на замовлення 96 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 241.41 грн |
| 10+ | 197.45 грн |
| 25+ | 185.07 грн |
| 50+ | 165.38 грн |
| 16-650-40 |
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Виробник: Aries Electronics
Description: .90" COVER 16 PIN
Description: .90" COVER 16 PIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-650-10 |
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Виробник: Aries Electronics
Description: .27" COVER 20 PIN
Accessory Type: Cap (Cover)
Number of Positions: 20
For Use With/Related Products: 0600 Series Header
Packaging: Bulk
Description: .27" COVER 20 PIN
Accessory Type: Cap (Cover)
Number of Positions: 20
For Use With/Related Products: 0600 Series Header
Packaging: Bulk
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 320.58 грн |
| 10+ | 262.21 грн |
| 25+ | 245.82 грн |
| 25-0600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 25POS TIN
Number of Rows: 1
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 25
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Description: CONN HDR DIP FORK 25POS TIN
Number of Rows: 1
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 25
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
на замовлення 287 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 247.69 грн |
| 10+ | 202.89 грн |
| 100+ | 172.42 грн |
| 14-810-90R |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 14POS TIN
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Packaging: Bulk
на замовлення 104 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 797.92 грн |
| 10+ | 653.42 грн |
| 25+ | 612.46 грн |
| 50+ | 547.33 грн |
| 100+ | 521.22 грн |
| LP300 |
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Виробник: Aries Electronics
Description: CONN SCKT SHORTING PLUG FOR 0.3"
Body Material: Polyamide (PA46), Nylon 4/6
Accessory Type: Shorting Plug
For Use With/Related Products: 0.3" DIP Sockets
Color: Black
Packaging: Bulk
Description: CONN SCKT SHORTING PLUG FOR 0.3"
Body Material: Polyamide (PA46), Nylon 4/6
Accessory Type: Shorting Plug
For Use With/Related Products: 0.3" DIP Sockets
Color: Black
Packaging: Bulk
на замовлення 243 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 181.06 грн |
| 10+ | 147.94 грн |
| 25+ | 138.67 грн |
| 50+ | 123.90 грн |
| 100+ | 117.99 грн |
| 12-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Description: CONN SOCKET SIP 12POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
на замовлення 182 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 316.66 грн |
| 16+ | 277.01 грн |
| 112+ | 244.07 грн |
| 20-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP 20POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
на замовлення 2704 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 395.04 грн |
| 10+ | 310.52 грн |
| 100+ | 253.15 грн |
| 500+ | 205.99 грн |
| 1000+ | 197.49 грн |
| 25-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
Part Status: Active
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
Part Status: Active
на замовлення 379 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 551.81 грн |
| 16+ | 415.13 грн |
| 104+ | 351.61 грн |
| 34-0511-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 34 (1 x 34)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP 34POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 34 (1 x 34)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 12-0501-30 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 12 (1 x 12)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP 12POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 12 (1 x 12)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 20-0501-30 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Description: CONN SOCKET SIP 20POS TIN
на замовлення 14 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 25-0501-30 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 34-0501-30 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 34POS TIN
Description: CONN SOCKET SIP 34POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-0513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Description: CONN SOCKET SIP 25POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
на замовлення 1049 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 291.58 грн |
| 10+ | 238.89 грн |
| 100+ | 203.07 грн |
| 500+ | 170.12 грн |
| 1000+ | 162.00 грн |
| 25-0503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 25 (1 x 25)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP 25POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 25 (1 x 25)
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
на замовлення 108 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1157.69 грн |
| 10+ | 857.13 грн |
| 100+ | 669.52 грн |
| C8108-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| C8114-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8116-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 16POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| C8118-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Description: CONN IC DIP SOCKET 18POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8120-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8122-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
Description: CONN IC DIP SOCKET 22POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8124-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8128-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C8140-04 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| C9108-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9114-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| C9116-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9118-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9120-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9122-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9124-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| C9128-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| C9140-00 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 84-537-21 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 84 (4 x 21)
Type: PLCC, ZIF (ZIP)
Mounting Type: Surface Mount
Features: Closed Frame
Part Status: Active
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 84 (4 x 21)
Type: PLCC, ZIF (ZIP)
Mounting Type: Surface Mount
Features: Closed Frame
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 23998.84 грн |
| 40-516-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Description: CONN IC DIP SOCKET ZIF 40POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 24-516-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 20-823-90 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Description: CONN IC DIP SOCKET 20POS GOLD
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
на замовлення 802 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 816.73 грн |
| 10+ | 668.21 грн |
| 25+ | 626.35 грн |
| 50+ | 559.76 грн |
| 100+ | 533.04 грн |
| 250+ | 526.14 грн |
| 40-526-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 175 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 989.17 грн |
| 11+ | 803.71 грн |
| 33+ | 743.69 грн |
| 55+ | 673.22 грн |
| 110+ | 641.10 грн |
| 44-547-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 44 (2 x 22)
Type: SOIC, ZIF (ZIP)
Mounting Type: Through Hole
Description: CONN SOCKET SOIC ZIF 44POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 44 (2 x 22)
Type: SOIC, ZIF (ZIP)
Mounting Type: Through Hole
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 17193.76 грн |
| 44-653000-10 |
![]() |
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 44
Packaging: Bulk
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 44
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 68-653000-10 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Number of Pins: 68
Packaging: Bulk
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Number of Pins: 68
Packaging: Bulk
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
товару немає в наявності
В кошику
од. на суму грн.
| 18-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 18POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 18
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Description: CONN HDR DIP FORK 18POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 18
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
на замовлення 128 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 199.09 грн |
| 20+ | 154.62 грн |
| 100+ | 138.00 грн |
| 40-600-10 |
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Виробник: Aries Electronics
Description: CONN HDR DIP FORK 40POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 40
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Description: CONN HDR DIP FORK 40POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Forked
Pitch: 0.100" (2.54mm)
Number of Positions: 40
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 455.40 грн |
| 10+ | 372.18 грн |
| 24-6554-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 881.79 грн |
| 10+ | 721.50 грн |
| 30+ | 667.61 грн |
| 24-6554-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 177 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1623.28 грн |
| 10+ | 1328.19 грн |
| 30+ | 1229.12 грн |
| 50+ | 1112.65 грн |
| 100+ | 1059.58 грн |
| 28-6554-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 241 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 994.66 грн |
| 18+ | 780.95 грн |
| 27+ | 758.92 грн |
| 54+ | 678.25 грн |
| 108+ | 645.88 грн |
| 28-6554-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1746.34 грн |
| 18+ | 1371.40 грн |
| 27+ | 1332.73 грн |
| 54+ | 1191.03 грн |
| 32-6554-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 314 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1097.34 грн |
| 16+ | 868.99 грн |
| 32+ | 827.48 грн |
| 56+ | 746.50 грн |
| 104+ | 714.62 грн |
| 256+ | 670.64 грн |

























































