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LCQT-TSSOP20 LCQT-TSSOP20 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSSOP TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+423.26 грн
24+325.50 грн
48+309.97 грн
72+282.68 грн
120+272.67 грн
В кошику  од. на суму  грн.
LCQT-SSOP20 LCQT-SSOP20 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SSOP TO 20DIP
Packaging: Tube
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
1+462.45 грн
24+355.38 грн
48+338.41 грн
В кошику  од. на суму  грн.
LCQT-SOIC20W LCQT-SOIC20W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 87 шт:
термін постачання 21-31 дні (днів)
1+462.45 грн
24+355.38 грн
48+338.41 грн
72+308.64 грн
В кошику  од. на суму  грн.
LCQT-TSSOP28 LCQT-TSSOP28 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSSOP TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
1+523.59 грн
17+412.47 грн
34+392.78 грн
51+358.20 грн
В кошику  од. на суму  грн.
LCQT-SOIC28 LCQT-SOIC28 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 943 шт:
термін постачання 21-31 дні (днів)
1+547.89 грн
17+432.23 грн
34+411.56 грн
51+375.33 грн
102+357.42 грн
255+335.05 грн
510+313.84 грн
В кошику  од. на суму  грн.
LCQT-SOIC32 LCQT-SOIC32 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 32DIP
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 32
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Packaging: Tube
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
1+573.75 грн
15+434.40 грн
В кошику  од. на суму  грн.
LCQT-SOIC32W LCQT-SOIC32W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 32DIP
Part Status: Active
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 32
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Packaging: Tube
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
1+573.75 грн
15+434.40 грн
30+408.46 грн
В кошику  од. на суму  грн.
LCQT-TSOP32-1 LCQT-TSOP32-1 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP TO 32DIP
Part Status: Active
Package Accepted: TSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.100" (2.54mm)
Number of Positions: 32
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Packaging: Tube
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
1+610.59 грн
15+485.48 грн
В кошику  од. на суму  грн.
28-450001-11-RC Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
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24-650000-11-RC-P Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
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28-650000-11-RC-P Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
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04-002-154YS Aries Electronics 11015-yellow-streak-sip-jumpers.pdf Description: CABLE 4POS .100 JUMPER 1 INCH
товару немає в наявності
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97-AQ132D-P Aries Electronics 18022-pqfp-to-pga-socket.pdf Description: SCKT ADPT PQFP-132PGA PANELIZED
Part Status: Discontinued at Digi-Key
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Contact Finish - Mating: Gold
Pitch - Mating: 0.025" (0.64mm)
Termination: Solder
Convert To (Adapter End): PGA
Convert From (Adapter End): PQFP
Mounting Type: Through Hole
Number of Pins: 132
Packaging: Bulk
товару немає в наявності
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08-008.75-173 Aries Electronics 11005-flat-pin-staked-flex-jumpers.pdf Description: FLAT PIN-STAKED FLEX 8 POS 8.75"
Packaging: Bag
Contact Termination: Receptacle to Receptacle
Length: 8.75" (222.25mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
товару немає в наявності
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25-0625-31 25-0625-31 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP SOLDER 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товару немає в наявності
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16-820-90T Aries Electronics Description: RT ANGLE 16 PIN SKT .1 INCH CTR
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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68-PGM10006-10 Aries Electronics Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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14-600-21 Aries Electronics Description: CONN HDR DIP POST 14POS GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Post
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Gold
Connector Type: DIP, DIL - Header
Packaging: Bulk
товару немає в наявності
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132-PGM13038-10 Aries Electronics Description: PIN GRID ARRAY SOCKET/HEADER
товару немає в наявності
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132-PGM13038-50 Aries Electronics Description: CONN SOCKET PGA GOLD
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132-PRS14033-12 Aries Electronics Description: PGA ZIF TEST/BURN-IN SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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08-354000-10 Aries Electronics Description: CONN ADAPTER 8POS DIP-S01C
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
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1111841 Aries Electronics Description: SOCKET MSOP TO SOIC
товару немає в наявності
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16-354000-10 Aries Electronics Description: CONN ADAPTER 16POS DIP-SOIC
Packaging: Bulk
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): SOIC
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Number of Pins: 16
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20-354000-10 Aries Electronics Description: CONN ADAPTER 20POS DIP-SOIC
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): SOIC
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Number of Pins: 20
Packaging: Bulk
товару немає в наявності
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225-PLS18003-12 Aries Electronics Description: ZIF PGA SOCKET 225 PIN 18 X 18
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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181-PLS18040-12 Aries Electronics Description: ZIF PGA LIST SOCKET 181PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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14-8875-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
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10-2511-10 Aries Electronics Description: 10-PIN SOLDER TAIL IC SOCKET
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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14-0518-10 Aries Electronics Description: 14 PIN SOCKET
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36-6625-21 Aries Electronics 12035-dip-header.pdf Description: CONN HDR DIP POST 36POS GOLD
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28-354000-10 Aries Electronics Description: ADAPTER 28 PIN DIP TO SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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20-3540-10 Aries Electronics Description: COLLET PIN CARRIER 20-PIN .300
товару немає в наявності
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14-0600-20 Aries Electronics Description: CONN SIL HDR POST 14POS TIN
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Contact Type: Post
Number of Rows: 1
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: SIP, SIL - Header
Packaging: Bulk
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20-600-20 Aries Electronics Description: CONN HDR DIP POST 20POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
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10-6511-10 Aries Electronics Description: SOCKET 10 POS SOLDER TAIL TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
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180-PGM18006-10 Aries Electronics Description: PIN GRID ARRAY SOCKET 180PIN
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Type: PGA
Mounting Type: Through Hole
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
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LP300 RED Aries Electronics Description: CONN SCKT SHORT PLUG FOR 0.3"RED
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
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84-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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32-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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84-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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68-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
68-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
20-352000-10 Aries Electronics 18015-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
32-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
44-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-352000-10 Aries Electronics 18015-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
32-652000-10-P Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику  од. на суму  грн.
28-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
товару немає в наявності
В кошику  од. на суму  грн.
44-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 44
Packaging: Bulk
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
товару немає в наявності
В кошику  од. на суму  грн.
181-PLS15003-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
181-PLS15006-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
225-PLS15001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
товару немає в наявності
В кошику  од. на суму  грн.
225-PRS15001-12 225-PRS15001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 113 шт:
термін постачання 21-31 дні (днів)
1+7203.26 грн
10+5896.60 грн
25+5527.71 грн
50+4940.25 грн
100+4758.74 грн
В кошику  од. на суму  грн.
108-PLS12024-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
181-PLS15006-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
181-PGM15005-10 Aries Electronics Description: SOCKET IC PGA 181POS SOLDER
Mounting Type: Through Hole
Type: PGA
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
48-6556-30 Aries Electronics Description: UNIVERSAL TEST SOCKET 48POS
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-TSOP32 LCQT-TSOP32 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP 32DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-TSSOP20 19000-small-outline-prototyping-adapters.pdf
LCQT-TSSOP20
Виробник: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+423.26 грн
24+325.50 грн
48+309.97 грн
72+282.68 грн
120+272.67 грн
В кошику  од. на суму  грн.
LCQT-SSOP20 19000-small-outline-prototyping-adapters.pdf
LCQT-SSOP20
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP
Packaging: Tube
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+462.45 грн
24+355.38 грн
48+338.41 грн
В кошику  од. на суму  грн.
LCQT-SOIC20W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC20W
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 87 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+462.45 грн
24+355.38 грн
48+338.41 грн
72+308.64 грн
В кошику  од. на суму  грн.
LCQT-TSSOP28 19000-small-outline-prototyping-adapters.pdf
LCQT-TSSOP28
Виробник: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+523.59 грн
17+412.47 грн
34+392.78 грн
51+358.20 грн
В кошику  од. на суму  грн.
LCQT-SOIC28 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC28
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 943 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+547.89 грн
17+432.23 грн
34+411.56 грн
51+375.33 грн
102+357.42 грн
255+335.05 грн
510+313.84 грн
В кошику  од. на суму  грн.
LCQT-SOIC32 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC32
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 32DIP
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 32
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Packaging: Tube
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+573.75 грн
15+434.40 грн
В кошику  од. на суму  грн.
LCQT-SOIC32W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC32W
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 32DIP
Part Status: Active
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 32
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Packaging: Tube
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+573.75 грн
15+434.40 грн
30+408.46 грн
В кошику  од. на суму  грн.
LCQT-TSOP32-1 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP32-1
Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 32DIP
Part Status: Active
Package Accepted: TSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.100" (2.54mm)
Number of Positions: 32
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Packaging: Tube
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+610.59 грн
15+485.48 грн
В кошику  од. на суму  грн.
28-450001-11-RC 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
24-650000-11-RC-P 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
товару немає в наявності
В кошику  од. на суму  грн.
28-650000-11-RC-P 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
04-002-154YS 11015-yellow-streak-sip-jumpers.pdf
Виробник: Aries Electronics
Description: CABLE 4POS .100 JUMPER 1 INCH
товару немає в наявності
В кошику  од. на суму  грн.
97-AQ132D-P 18022-pqfp-to-pga-socket.pdf
Виробник: Aries Electronics
Description: SCKT ADPT PQFP-132PGA PANELIZED
Part Status: Discontinued at Digi-Key
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Contact Finish - Mating: Gold
Pitch - Mating: 0.025" (0.64mm)
Termination: Solder
Convert To (Adapter End): PGA
Convert From (Adapter End): PQFP
Mounting Type: Through Hole
Number of Pins: 132
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
08-008.75-173 11005-flat-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: FLAT PIN-STAKED FLEX 8 POS 8.75"
Packaging: Bag
Contact Termination: Receptacle to Receptacle
Length: 8.75" (222.25mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
товару немає в наявності
В кошику  од. на суму  грн.
25-0625-31 12036-pin-line-header.pdf
25-0625-31
Виробник: Aries Electronics
Description: CONN HDR STRIP SOLDER 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товару немає в наявності
В кошику  од. на суму  грн.
16-820-90T
Виробник: Aries Electronics
Description: RT ANGLE 16 PIN SKT .1 INCH CTR
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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68-PGM10006-10
Виробник: Aries Electronics
Description: CONN SOCKET PGA GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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14-600-21
Виробник: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Row Spacing: 0.300" (7.62mm)
Contact Type: Post
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Gold
Connector Type: DIP, DIL - Header
Packaging: Bulk
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132-PGM13038-10
Виробник: Aries Electronics
Description: PIN GRID ARRAY SOCKET/HEADER
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132-PGM13038-50
Виробник: Aries Electronics
Description: CONN SOCKET PGA GOLD
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132-PRS14033-12
Виробник: Aries Electronics
Description: PGA ZIF TEST/BURN-IN SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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08-354000-10
Виробник: Aries Electronics
Description: CONN ADAPTER 8POS DIP-S01C
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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1111841
Виробник: Aries Electronics
Description: SOCKET MSOP TO SOIC
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16-354000-10
Виробник: Aries Electronics
Description: CONN ADAPTER 16POS DIP-SOIC
Packaging: Bulk
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): SOIC
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Number of Pins: 16
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20-354000-10
Виробник: Aries Electronics
Description: CONN ADAPTER 20POS DIP-SOIC
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Convert To (Adapter End): SOIC
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Number of Pins: 20
Packaging: Bulk
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225-PLS18003-12
Виробник: Aries Electronics
Description: ZIF PGA SOCKET 225 PIN 18 X 18
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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181-PLS18040-12
Виробник: Aries Electronics
Description: ZIF PGA LIST SOCKET 181PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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14-8875-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
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10-2511-10
Виробник: Aries Electronics
Description: 10-PIN SOLDER TAIL IC SOCKET
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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14-0518-10
Виробник: Aries Electronics
Description: 14 PIN SOCKET
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36-6625-21 12035-dip-header.pdf
Виробник: Aries Electronics
Description: CONN HDR DIP POST 36POS GOLD
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28-354000-10
Виробник: Aries Electronics
Description: ADAPTER 28 PIN DIP TO SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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20-3540-10
Виробник: Aries Electronics
Description: COLLET PIN CARRIER 20-PIN .300
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14-0600-20
Виробник: Aries Electronics
Description: CONN SIL HDR POST 14POS TIN
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Contact Type: Post
Number of Rows: 1
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: SIP, SIL - Header
Packaging: Bulk
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20-600-20
Виробник: Aries Electronics
Description: CONN HDR DIP POST 20POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
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10-6511-10
Виробник: Aries Electronics
Description: SOCKET 10 POS SOLDER TAIL TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
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180-PGM18006-10
Виробник: Aries Electronics
Description: PIN GRID ARRAY SOCKET 180PIN
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Type: PGA
Mounting Type: Through Hole
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
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LP300 RED
Виробник: Aries Electronics
Description: CONN SCKT SHORT PLUG FOR 0.3"RED
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
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84-652000-10 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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32-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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84-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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68-652000-10 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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68-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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20-352000-10 18015-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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32-652000-10 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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44-652000-10 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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28-352000-10 18015-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
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32-652000-10-P 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
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28-652000-10 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
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28-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Bulk
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
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44-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Convert From (Adapter End): PLCC
Mounting Type: Through Hole
Number of Pins: 44
Packaging: Bulk
Part Status: Active
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
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181-PLS15003-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
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181-PLS15006-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
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225-PLS15001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
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225-PRS15001-12 10004-pga-zif-test-and-burn-in-socket.pdf
225-PRS15001-12
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 113 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7203.26 грн
10+5896.60 грн
25+5527.71 грн
50+4940.25 грн
100+4758.74 грн
В кошику  од. на суму  грн.
108-PLS12024-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
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181-PLS15006-12 10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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181-PGM15005-10
Виробник: Aries Electronics
Description: SOCKET IC PGA 181POS SOLDER
Mounting Type: Through Hole
Type: PGA
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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48-6556-30
Виробник: Aries Electronics
Description: UNIVERSAL TEST SOCKET 48POS
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
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LCQT-TSOP32 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP32
Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP 32DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
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