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40-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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48-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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48-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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48-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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14-81000-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-81000-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-81100-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-81100-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-81187-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-81187-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
14-81250-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-81250-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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В кошику  од. на суму  грн.
14-8260-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
14-8260-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
14-8350-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8350-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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В кошику  од. на суму  грн.
14-8400-10 14-8400-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
2+230.21 грн
10+188.11 грн
25+176.33 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
14-8400-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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В кошику  од. на суму  грн.
14-8435-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8435-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
14-8470-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-8470-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8510-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8510-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
14-8620-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8620-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8770-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8770-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
14-8870-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
14-8870-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
16-81250-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
16-8430-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
16-8430-10WR Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
16-8480-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-8700-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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В кошику  од. на суму  грн.
16-8810-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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В кошику  од. на суму  грн.
10-28440-10 10-28440-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
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18-68500-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
18-68587-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
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18-68660-10 Aries Electronics 13006-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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В кошику  од. на суму  грн.
08-8255-211C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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1109002 Aries Electronics 13007-elevated-display-socket.pdf Description: SERIES 8XXX ELEVATOR SOCKET .200
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2632-102-13 Aries Electronics 13007-elevated-display-socket.pdf Description: SERIES 8XXX ELEVATOR SOCKET .200
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06-81250-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
08-81250-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
08-8255-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8300-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8343-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8430-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8460-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8550-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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08-8620-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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10-81000-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-81250-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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10-8240-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8285-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8300-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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40-6823-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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40-820-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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40-822-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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40-823-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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48-6820-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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48-6822-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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48-6823-90C 13005-horizontal-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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14-81000-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-81000-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-81100-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-81100-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-81187-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-81187-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-81250-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-81250-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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14-8260-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
14-8260-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
14-8350-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8350-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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14-8400-10 13006-elevated-display-socket.pdf
14-8400-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+230.21 грн
10+188.11 грн
25+176.33 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
14-8400-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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14-8435-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-8435-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-8470-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-8470-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-8510-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-8510-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-8620-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-8620-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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14-8770-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8770-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
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В кошику  од. на суму  грн.
14-8870-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
14-8870-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику  од. на суму  грн.
16-81250-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
16-8430-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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В кошику  од. на суму  грн.
16-8430-10WR 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
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16-8480-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
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16-8700-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
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16-8810-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
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10-28440-10 13006-elevated-display-socket.pdf
10-28440-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
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18-68500-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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18-68587-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
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18-68660-10 13006-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
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08-8255-211C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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1109002 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: SERIES 8XXX ELEVATOR SOCKET .200
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2632-102-13 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: SERIES 8XXX ELEVATOR SOCKET .200
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06-81250-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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08-81250-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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08-8255-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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08-8300-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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08-8343-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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08-8430-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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08-8460-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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08-8550-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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08-8620-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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10-81000-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
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10-81250-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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10-8240-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
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10-8285-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
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10-8300-210C 13007-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
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