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24-8600-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-8700-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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24-8750-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
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24-8770-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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24-8844-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-8900-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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24-8900-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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26-81250-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
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26-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
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26-8350-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
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26-8450-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
26-8500-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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26-8530-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
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26-8900-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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26-8975-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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26-8984-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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28-81000-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-81010-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
28-8240-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8300-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-8350-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8370-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8375-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8400-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8459-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-8472-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8495-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8500-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
28-8600-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8620-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8670-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8675-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8680-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8700-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8725-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8750-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
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В кошику  од. на суму  грн.
28-8800-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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28-8830-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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30-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
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30-8563-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
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30-8940-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
30-8950-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
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32-81000-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-81000-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8240-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8312-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8350-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8370-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
32-8375-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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32-8540-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8600-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8724-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8724-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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32-8850-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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34-81150-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 34POS GOLD
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34-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 34POS GOLD
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36-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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24-8600-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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24-8700-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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24-8750-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
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24-8770-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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24-8844-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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24-8900-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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24-8900-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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26-81250-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
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26-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
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26-8350-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
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26-8450-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
26-8500-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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26-8530-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
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26-8900-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
26-8975-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
26-8984-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-81000-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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28-81010-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
28-8240-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8300-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-8350-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8370-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8375-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8400-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8459-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8472-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
28-8495-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8500-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
28-8600-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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28-8620-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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28-8670-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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28-8675-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8680-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8700-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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28-8725-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8750-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
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В кошику  од. на суму  грн.
28-8800-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
28-8830-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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30-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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30-8563-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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30-8940-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
30-8950-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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В кошику  од. на суму  грн.
32-81000-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-81000-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
32-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8240-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8312-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8350-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8370-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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32-8375-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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32-8540-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8600-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8724-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8724-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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32-8850-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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34-81150-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
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34-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
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36-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
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