Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 123 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 36-8580-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 36-8750-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 36-8970-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 38-81000-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 38 (2 x 19) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
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| 38-81250-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
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| 40-81000-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-81000-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-81150-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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| 40-81250-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-81250-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8260-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8300-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8320-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8350-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8370-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8435-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8460-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8500-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8530-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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| 40-8600-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8620-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8625-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8650-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8700-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8700-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8750-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDPackaging: Bulk |
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В кошику од. на суму грн. | |
| 40-8770-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8785-310C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 40-8785-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8800-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 40-8810-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
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В кошику од. на суму грн. | |
| 48-81000-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 48-81250-610C | Aries Electronics |
Description: CONN IC DIP SOCKET 48POS GOLD |
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В кошику од. на суму грн. | |
| 1108883-05 | Aries Electronics |
Description: SERIES 0517 PIN-LINE VERTISOCKET |
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| 01-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 1POS GOLD |
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В кошику од. на суму грн. | |
| 02-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLD |
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В кошику од. на суму грн. | |
| 03-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
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В кошику од. на суму грн. | |
| 04-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 05-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 06-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
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В кошику од. на суму грн. | |
| 07-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
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В кошику од. на суму грн. | |
| 08-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
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В кошику од. на суму грн. | |
| 09-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
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В кошику од. на суму грн. | |
| 10-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
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В кошику од. на суму грн. | |
| 11-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 11POS GOLD |
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В кошику од. на суму грн. | |
| 12-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 12POS GOLD |
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В кошику од. на суму грн. | |
| 13-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 13POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 14-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 14POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 15-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 15POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 16-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 17-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 17POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 18-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 19-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 19POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 20-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 20POS GOLD |
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В кошику од. на суму грн. | |
| 21-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 21POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 22POS GOLD |
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В кошику од. на суму грн. | |
| 23-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 23POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 24POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-0517-90C | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLDPackaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |
| 5362-107-12-06 | Aries Electronics |
Description: SERIES 0517 PIN-LINE VERTISOCKET |
товару немає в наявності |
В кошику од. на суму грн. |
| 36-8580-610C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 36-8750-310C |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 36-8970-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 38-81000-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 38POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 38-81250-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-81000-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-81000-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-81150-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-81250-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-81250-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8260-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8300-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8320-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8350-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8370-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8435-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 40-8460-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8500-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8530-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8600-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8620-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8625-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 40-8650-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8700-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 40-8700-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 40-8770-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 40-8785-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8785-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 40-8800-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-8810-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 48-81000-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 48-81250-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 1108883-05 |
![]() |
Виробник: Aries Electronics
Description: SERIES 0517 PIN-LINE VERTISOCKET
Description: SERIES 0517 PIN-LINE VERTISOCKET
товару немає в наявності
В кошику
од. на суму грн.
| 01-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 1POS GOLD
Description: CONN SOCKET SIP 1POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 02-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Description: CONN SOCKET SIP 2POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 03-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 04-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 05-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 06-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 07-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 09-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 10-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 11-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Description: CONN SOCKET SIP 11POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 12-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Description: CONN SOCKET SIP 12POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 13-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Description: CONN SOCKET SIP 13POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 14-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 14POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 15-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 16-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Description: CONN SOCKET SIP 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 17-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 18-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD
Description: CONN SOCKET SIP 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 19-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 20-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS GOLD
Description: CONN SOCKET SIP 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 21-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS GOLD
Description: CONN SOCKET SIP 21POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 22POS GOLD
Description: CONN SOCKET SIP 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 23-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 23POS GOLD
Description: CONN SOCKET SIP 23POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-0517-90C |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 24POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 25-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 5362-107-12-06 |
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Виробник: Aries Electronics
Description: SERIES 0517 PIN-LINE VERTISOCKET
Description: SERIES 0517 PIN-LINE VERTISOCKET
товару немає в наявності
В кошику
од. на суму грн.
