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36-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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36-8580-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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36-8750-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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36-8970-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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38-81000-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 38POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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38-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 38POS GOLD
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40-81000-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-81000-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-81150-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-81250-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8260-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8300-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8320-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8350-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8370-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8435-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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40-8460-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8500-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8530-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8600-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8620-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8625-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
40-8650-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8700-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
40-8700-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
40-8750-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
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В кошику  од. на суму  грн.
40-8770-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
40-8785-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8785-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
40-8800-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-8810-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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48-81000-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
48-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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1108883-05 Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: SERIES 0517 PIN-LINE VERTISOCKET
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01-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 1POS GOLD
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02-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 2POS GOLD
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03-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 3POS GOLD
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04-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
05-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
06-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 6POS GOLD
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07-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 7POS GOLD
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08-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 8POS GOLD
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09-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 9POS GOLD
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10-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 10POS GOLD
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11-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
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12-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
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13-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
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14-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 14POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
15-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
16-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 16POS GOLD
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17-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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18-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 18POS GOLD
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19-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
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20-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 20POS GOLD
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21-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 21POS GOLD
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22-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 22POS GOLD
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23-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 23POS GOLD
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24-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 24POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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25-0517-90C Aries Electronics 13009-right-angle-pin-line-socket.pdf Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
36-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
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36-8580-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
36-8750-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
36-8970-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
38-81000-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
38-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
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В кошику  од. на суму  грн.
40-81000-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-81000-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-81150-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-81250-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8260-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8300-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8320-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8350-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8370-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8435-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
40-8460-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8500-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8530-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8600-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8620-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8625-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
40-8650-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8700-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
40-8700-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
40-8750-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
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В кошику  од. на суму  грн.
40-8770-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
40-8785-310C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8785-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
40-8800-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
40-8810-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
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В кошику  од. на суму  грн.
48-81000-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
48-81250-610C 13008-elevated-display-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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В кошику  од. на суму  грн.
1108883-05 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: SERIES 0517 PIN-LINE VERTISOCKET
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В кошику  од. на суму  грн.
01-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 1POS GOLD
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В кошику  од. на суму  грн.
02-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
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В кошику  од. на суму  грн.
03-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
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В кошику  од. на суму  грн.
04-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
05-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
06-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
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В кошику  од. на суму  грн.
07-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
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В кошику  од. на суму  грн.
08-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
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В кошику  од. на суму  грн.
09-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
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В кошику  од. на суму  грн.
10-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
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В кошику  од. на суму  грн.
11-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
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В кошику  од. на суму  грн.
12-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
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В кошику  од. на суму  грн.
13-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
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В кошику  од. на суму  грн.
14-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
15-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
16-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
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В кошику  од. на суму  грн.
17-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
18-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD
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19-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
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20-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS GOLD
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21-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS GOLD
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22-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 22POS GOLD
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23-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 23POS GOLD
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24-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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25-0517-90C 13009-right-angle-pin-line-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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