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14-354000-11-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
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14-354000-21-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
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16-354000-11-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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16-354000-21-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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18-354000-11-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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18-354000-21-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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20-354000-11-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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20-354000-21-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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24-354000-11-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 24SOIC
Packaging: Bulk
Number of Pins: 24
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
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24-354000-21-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 24SOIC
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28-354000-11-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
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28-354000-21-RC Aries Electronics 18009rc-rohs-compliant-dip-to-soic-adapter.pdf Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
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08-350000-11-RC-P 08-350000-11-RC-P Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
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14-350000-11-RC-P Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
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16-350000-11-RC-P Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
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18-350000-11-RC-P Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
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20-350000-11-RC-P Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
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28-350002-11-RC-P Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Package Accepted: SOIC
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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28-653000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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32-653000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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44-653000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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68-653000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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84-653000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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24-351000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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16-307349-11-RC-P (170 UP) Aries Electronics 18101rc-rohs-compliant-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
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16-307349-11-RC Aries Electronics 18101rc-rohs-compliant-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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1109681-308 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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1109681-314 Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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1109681-316 Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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1109681-318 Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Spacer
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
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1109681-320 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
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1109681-324 Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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1109681-328 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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1109681-624 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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1109681-628 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
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1109681-632 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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1109681-648 100 PCS MINIMUM Aries Electronics 18008-mirror-image-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
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LCQT-QFP0.5-32 LCQT-QFP0.5-32 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
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LCQT-QFP0.8-32 LCQT-QFP0.8-32 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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LCQT-QFP0.5-40 LCQT-QFP0.5-40 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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LCQT-QFP0.5-40-1 LCQT-QFP0.5-40-1 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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LCQT-QFP0.8-44 LCQT-QFP0.8-44 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 44QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
на замовлення 43 шт:
термін постачання 21-31 дні (днів)
1+1122.04 грн
10+830.94 грн
25+751.34 грн
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LCQT-QFP0.5-52 LCQT-QFP0.5-52 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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LCQT-QFP0.65-52 LCQT-QFP0.65-52 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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LCQT-QFP0.5-60 LCQT-QFP0.5-60 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 60QFP
Packaging: Tube
Number of Pins: 60
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-64 LCQT-QFP0.5-64 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
1+854.74 грн
17+640.11 грн
34+601.93 грн
В кошику  од. на суму  грн.
LCQT-QFP0.65-64 LCQT-QFP0.65-64 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.8-64 LCQT-QFP0.8-64 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-80 LCQT-QFP0.5-80 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.65-80 LCQT-QFP0.65-80 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.8-80 LCQT-QFP0.8-80 Aries Electronics 19001-qfp-prototyping-adapters.pdf Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-SOT23-6 LCQT-SOT23-6 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOT-23 TO 6DIP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.500" W (10.16mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT23
Part Status: Active
на замовлення 1809 шт:
термін постачання 21-31 дні (днів)
2+210.58 грн
10+172.32 грн
25+161.53 грн
78+139.88 грн
156+133.20 грн
312+126.85 грн
546+119.94 грн
1014+114.81 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-SOIC8-8 LCQT-SOIC8-8 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 8DIP
Packaging: Bulk
Size / Dimension: 0.500" L x 0.500" W (12.70mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 7864 шт:
термін постачання 21-31 дні (днів)
2+224.56 грн
10+183.55 грн
25+172.07 грн
59+151.96 грн
118+144.70 грн
295+135.64 грн
531+128.00 грн
1003+122.38 грн
2537+114.63 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-MSOP10 LCQT-MSOP10 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER MSOP TO 10DIP
Packaging: Bulk
Size / Dimension: 0.600" L x 0.500" W (15.24mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 341 шт:
термін постачання 21-31 дні (днів)
2+237.77 грн
10+194.32 грн
48+173.95 грн
96+155.46 грн
144+151.07 грн
288+143.86 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-TSSOP14 LCQT-TSSOP14 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSSOP TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 3405 шт:
термін постачання 21-31 дні (днів)
2+282.06 грн
10+230.61 грн
34+211.47 грн
68+188.99 грн
102+183.66 грн
272+171.37 грн
510+161.25 грн
1020+153.56 грн
2516+144.09 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-SOIC14 LCQT-SOIC14 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
1+323.25 грн
10+264.58 грн
34+242.65 грн
68+216.85 грн
102+210.73 грн
В кошику  од. на суму  грн.
LCQT-SOIC14W LCQT-SOIC14W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 160 шт:
термін постачання 21-31 дні (днів)
1+323.25 грн
10+264.58 грн
34+242.65 грн
68+216.85 грн
102+210.73 грн
В кошику  од. на суму  грн.
LCQT-TSSOP16 LCQT-TSSOP16 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSSOP TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 590 шт:
термін постачання 21-31 дні (днів)
1+338.01 грн
10+276.70 грн
30+256.05 грн
60+228.80 грн
120+217.88 грн
270+205.77 грн
510+193.51 грн
В кошику  од. на суму  грн.
LCQT-SOIC16 LCQT-SOIC16 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 345 шт:
термін постачання 21-31 дні (днів)
1+335.68 грн
10+274.83 грн
30+254.31 грн
60+227.25 грн
120+216.40 грн
270+204.36 грн
В кошику  од. на суму  грн.
LCQT-SOIC16W LCQT-SOIC16W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 121 шт:
термін постачання 21-31 дні (днів)
1+338.01 грн
10+276.56 грн
30+255.90 грн
60+228.69 грн
120+217.77 грн
В кошику  од. на суму  грн.
14-354000-11-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
14-354000-21-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
16-354000-11-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
16-354000-21-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
18-354000-11-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
18-354000-21-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 18SOIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
20-354000-11-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
20-354000-21-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 20SOIC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
24-354000-11-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 24SOIC
Packaging: Bulk
Number of Pins: 24
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
24-354000-21-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 24SOIC
товару немає в наявності
В кошику  од. на суму  грн.
28-354000-11-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
28-354000-21-RC 18009rc-rohs-compliant-dip-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 28SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
товару немає в наявності
В кошику  од. на суму  грн.
08-350000-11-RC-P 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
08-350000-11-RC-P
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP 0.3
Packaging: Bulk
Size / Dimension: 0.800" L x 0.460" W (20.32mm x 11.68mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику  од. на суму  грн.
14-350000-11-RC-P 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP 0.3
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В кошику  од. на суму  грн.
16-350000-11-RC-P 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP 0.3
Packaging: Bulk
Size / Dimension: 1.600" L x 0.450" W (40.64mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику  од. на суму  грн.
18-350000-11-RC-P 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18DIP 0.3
Packaging: Bulk
Size / Dimension: 1.800" L x 0.450" W (45.72mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику  од. на суму  грн.
20-350000-11-RC-P 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20DIP 0.3
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В кошику  од. на суму  грн.
28-350002-11-RC-P 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: DIP to DIP
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Package Accepted: SOIC
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
28-653000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
32-653000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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В кошику  од. на суму  грн.
44-653000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
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В кошику  од. на суму  грн.
68-653000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
84-653000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
24-351000-11-RC 18014-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 24DIP 0.3
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
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В кошику  од. на суму  грн.
16-307349-11-RC-P (170 UP) 18101rc-rohs-compliant-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
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В кошику  од. на суму  грн.
16-307349-11-RC 18101rc-rohs-compliant-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 16DIP 0.3
Packaging: Bulk
Number of Pins: 16
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
1109681-308 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
1109681-314 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
1109681-316 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
1109681-318 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Spacer
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
1109681-320 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
1109681-324 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
1109681-328 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
1109681-624 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
1109681-628 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
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В кошику  од. на суму  грн.
1109681-632 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
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В кошику  од. на суму  грн.
1109681-648 100 PCS MINIMUM 18008-mirror-image-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
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В кошику  од. на суму  грн.
LCQT-QFP0.5-32 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-32
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
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В кошику  од. на суму  грн.
LCQT-QFP0.8-32 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.8-32
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 32QFP
Packaging: Tube
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-40 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-40
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-40-1 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-40-1
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 40QFP
Packaging: Tube
Number of Pins: 40
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.8-44 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.8-44
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 44QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
на замовлення 43 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1122.04 грн
10+830.94 грн
25+751.34 грн
В кошику  од. на суму  грн.
LCQT-QFP0.5-52 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-52
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.65-52 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.65-52
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 52QFP
Packaging: Tube
Number of Pins: 52
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-60 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-60
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 60QFP
Packaging: Tube
Number of Pins: 60
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-64 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-64
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+854.74 грн
17+640.11 грн
34+601.93 грн
В кошику  од. на суму  грн.
LCQT-QFP0.65-64 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.65-64
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.500" L x 1.500" W (38.10mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.8-64 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.8-64
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 64QFP
Packaging: Tube
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.5-80 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.5-80
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.020" (0.50mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.65-80 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.65-80
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-QFP0.8-80 19001-qfp-prototyping-adapters.pdf
LCQT-QFP0.8-80
Виробник: Aries Electronics
Description: SOCKET ADAPTER MULT PKG TO 80QFP
Packaging: Tube
Number of Pins: 80
Mounting Type: Through Hole
Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.031" (0.80mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику  од. на суму  грн.
LCQT-SOT23-6 19000-small-outline-prototyping-adapters.pdf
LCQT-SOT23-6
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOT-23 TO 6DIP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.500" W (10.16mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT23
Part Status: Active
на замовлення 1809 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+210.58 грн
10+172.32 грн
25+161.53 грн
78+139.88 грн
156+133.20 грн
312+126.85 грн
546+119.94 грн
1014+114.81 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-SOIC8-8 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC8-8
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8DIP
Packaging: Bulk
Size / Dimension: 0.500" L x 0.500" W (12.70mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 7864 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+224.56 грн
10+183.55 грн
25+172.07 грн
59+151.96 грн
118+144.70 грн
295+135.64 грн
531+128.00 грн
1003+122.38 грн
2537+114.63 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-MSOP10 19000-small-outline-prototyping-adapters.pdf
LCQT-MSOP10
Виробник: Aries Electronics
Description: SOCKET ADAPTER MSOP TO 10DIP
Packaging: Bulk
Size / Dimension: 0.600" L x 0.500" W (15.24mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 341 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+237.77 грн
10+194.32 грн
48+173.95 грн
96+155.46 грн
144+151.07 грн
288+143.86 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-TSSOP14 19000-small-outline-prototyping-adapters.pdf
LCQT-TSSOP14
Виробник: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 3405 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+282.06 грн
10+230.61 грн
34+211.47 грн
68+188.99 грн
102+183.66 грн
272+171.37 грн
510+161.25 грн
1020+153.56 грн
2516+144.09 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LCQT-SOIC14 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC14
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+323.25 грн
10+264.58 грн
34+242.65 грн
68+216.85 грн
102+210.73 грн
В кошику  од. на суму  грн.
LCQT-SOIC14W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC14W
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 14DIP
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 160 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+323.25 грн
10+264.58 грн
34+242.65 грн
68+216.85 грн
102+210.73 грн
В кошику  од. на суму  грн.
LCQT-TSSOP16 19000-small-outline-prototyping-adapters.pdf
LCQT-TSSOP16
Виробник: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 590 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+338.01 грн
10+276.70 грн
30+256.05 грн
60+228.80 грн
120+217.88 грн
270+205.77 грн
510+193.51 грн
В кошику  од. на суму  грн.
LCQT-SOIC16 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC16
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 345 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
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LCQT-SOIC16W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC16W
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 121 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+338.01 грн
10+276.56 грн
30+255.90 грн
60+228.69 грн
120+217.77 грн
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