Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15926) > Сторінка 128 з 266
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 18-666000-00 | Aries Electronics |
 Description: SOCKET ADAPTER SOIC TO 18SOWICPackaging: Bulk Number of Pins: 18 Mounting Type: Surface Mount Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 32 шт В кошику од. на суму грн. | |||||||
| 20-666000-00 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20SOWIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 22-666000-00 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 22SOWIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 24-666000-00 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 24SOWIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
08-665000-00 | Aries Electronics |
Description: SCK ADAPT 8P SOIC-W TO SOIC 0.6 Packaging: Bulk Number of Pins: 8 Mounting Type: Surface Mount Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | ||||||
| 10-665000-00 | Aries Electronics |
Description: SCK ADAPT 10P SOIC-W TO SOIC 0.6 Packaging: Bulk Number of Pins: 10 Mounting Type: Surface Mount Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 12-665000-00 | Aries Electronics |
Description: SCK ADAPT 12P SOIC-W TO SOIC 0.6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 14-665000-00 | Aries Electronics |
Description: SCK ADAPT 14P SOIC-W TO SOIC 0.6 Packaging: Bulk Number of Pins: 14 Mounting Type: Surface Mount Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 22 шт В кошику од. на суму грн. | |||||||
 |
16-665000-00 | Aries Electronics |
Description: SCK ADAPT 16P SOIC-W TO SOIC 0.6 Packaging: Tube Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to SMD Package Accepted: SOIC Part Status: Active |
на замовлення 412 шт: термін постачання 21-31 дні (днів) |
|
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| 18-665000-00 | Aries Electronics |
Description: SCK ADAPT 18P SOIC-W TO SOIC 0.6 |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | |||||||
| 20-665000-00 | Aries Electronics |
Description: SCK ADAPT 20P SOIC-W TO SOIC 0.6 |
товару немає в наявності |
Мінімальне замовлення: 5 шт В кошику од. на суму грн. | |||||||
| 22-665000-00 | Aries Electronics |
Description: SCK ADAPT 22P SOIC-W TO SOIC 0.6 |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | |||||||
| 24-665000-00 | Aries Electronics |
Description: SCK ADAPT 24P SOIC-W TO SOIC 0.6 Packaging: Bulk Number of Pins: 24 Mounting Type: Surface Mount Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 240 шт В кошику од. на суму грн. | |||||||
| 26-665000-00 | Aries Electronics |
Description: SCK ADAPT 26P SOIC-W TO SOIC 0.6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 28-665000-00 | Aries Electronics |
Description: SCK ADAPT 28P SOIC-W TO SOIC 0.6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-14 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-16 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-18 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-28 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800 | Aries Electronics |
Description: PROGRAMMABLE CORRECT-A-CHIP |
товару немає в наявності |
Мінімальне замовлення: 5 шт В кошику од. на суму грн. | |||||||
| 1109800-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-12 | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-22 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-24 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-26 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109800-8 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Programmable Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1109252 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6 Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 1110267-N | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 68DIP 0.9 Packaging: Bulk Number of Pins: 68 Mounting Type: Through Hole Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | |||||||
| 1111841-8 | Aries Electronics |
Description: SOCKET ADAPTER MSOP TO 8DIP 0.3 |
товару немає в наявності |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | |||||||
| 28-555000-00 | Aries Electronics |
Description: SOCKET ADAPTER SSOP TO 28SOWIC Packaging: Bulk Number of Pins: 28 Mounting Type: Surface Mount Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 17 шт В кошику од. на суму грн. | |||||||
| 1111903 | Aries Electronics |
Description: SOCKET ADAPT SOWIC TO 24DIP 0.4 Packaging: Bulk Number of Pins: 24 Mounting Type: Through Hole Convert From (Adapter End): SOWIC Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 68-304538-10 | Aries Electronics |
Description: SOCKET ADAPTER PLCC TO 68PGA |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||||||
| 14-354W00-20 | Aries Electronics |
Description: DIP-TO-SOWIC ADAPTOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 16-354W00-20 | Aries Electronics |
Description: DIP-TO-SOWIC ADAPTOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 20-354W00-20 | Aries Electronics |
Description: DIP-TO-SOWIC ADAPTOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 24-354W00-20 | Aries Electronics |
Description: DIP-TO-SOWIC ADAPTOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 20-301550-10 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20PLCC Packaging: Bulk Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SOIC Convert To (Adapter End): PLCC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | |||||||
| 20-301550-20 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 20PLCC Packaging: Bulk Number of Pins: 20 Mounting Type: Through Hole Convert From (Adapter End): SOIC Convert To (Adapter End): PLCC Termination: Solder Pitch - Mating: 0.050" (1.27mm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | |||||||
| 22-304504-18 | Aries Electronics |
Description: SOCKET ADAPTER SOIC TO 22DIP 0.4 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 7131-108-18 | Aries Electronics |
Description: SOCKET ADAPT HB2E RELAY TO 8DIP Packaging: Bulk Number of Pins: 8 Mounting Type: Through Hole Convert From (Adapter End): HB2E Relay Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 08-305984-11 | Aries Electronics |
Description: ADAPTER WITH SMD TYPE TX2SA Packaging: Bulk For Use With/Related Products: HB2E Relay Accessory Type: Adapter |
товару немає в наявності |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. | |||||||
| 08-307472-10 | Aries Electronics |
Description: ADAPTER FOR TX2SA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 08-307472-11 | Aries Electronics |
Description: ADAPTER WITH SMD TYPE TX2SA |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | |||||||
| 160-306045-10 | Aries Electronics | Description: SOCKET ADAPTER QFP THRU HOLE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 97-80C251 | Aries Electronics |
Description: SOCKET ADAPTER DIP TO PLCC Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
T-0600 | Aries Electronics |
Description: STRIP HEADER/SOCKET BREAK TOOL |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||
| T-675 | Aries Electronics |
Description: PROGRAMMING TOOL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 16-35W000-11-RC-P (220 UP) | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| 14-35W000-11-RC | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3 |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | |||||||
| 18-35W000-11-RC | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3 |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | |||||||
| 28-35W000-11-RC | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3 Packaging: Bulk Number of Pins: 28 Mounting Type: Through Hole Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Board Material: FR4 Epoxy Glass |
товару немає в наявності |
Мінімальне замовлення: 126 шт В кошику од. на суму грн. | |||||||
 |
16-35W000-11-RC | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3 |
товару немає в наявності |
Мінімальне замовлення: 4 шт В кошику од. на суму грн. | ||||||
 |
20-35W000-11-RC | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3 Packaging: Bulk Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 24-35W000-11-RC | Aries Electronics |
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
 |
08-354000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 8SOIC Packaging: Bulk Number of Pins: 8 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. | ||||||
|
|
08-354000-21-RC | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 8SOIC Packaging: Bulk Number of Pins: 8 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
товару немає в наявності |
Мінімальне замовлення: 16 шт В кошику од. на суму грн. | ||||||
| 14-354000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 14SOIC Packaging: Bulk Number of Pins: 14 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. | |||||||
| 14-354000-21-RC | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 14SOIC Packaging: Bulk Number of Pins: 14 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 16 шт В кошику од. на суму грн. | |||||||
| 16-354000-11-RC | Aries Electronics |
Description: SOCKET ADAPTER DIP TO 16SOIC Packaging: Bulk Number of Pins: 16 Mounting Type: Surface Mount Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. |
| 18-666000-00 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18SOWIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER SOIC TO 18SOWIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 32 шт
В кошику
од. на суму грн.
| 20-666000-00 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20SOWIC
Description: SOCKET ADAPTER SOIC TO 20SOWIC
товару немає в наявності
В кошику
од. на суму грн.
| 22-666000-00 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 22SOWIC
Description: SOCKET ADAPTER SOIC TO 22SOWIC
товару немає в наявності
В кошику
од. на суму грн.
| 24-666000-00 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24SOWIC
Description: SOCKET ADAPTER SOIC TO 24SOWIC
товару немає в наявності
В кошику
од. на суму грн.
| 08-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 8P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SCK ADAPT 8P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 10-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 10P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 10
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SCK ADAPT 10P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 10
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 12-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 12P SOIC-W TO SOIC 0.6
Description: SCK ADAPT 12P SOIC-W TO SOIC 0.6
товару немає в наявності
В кошику
од. на суму грн.
| 14-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 14P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SCK ADAPT 14P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 22 шт
В кошику
од. на суму грн.
| 16-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 16P SOIC-W TO SOIC 0.6
Packaging: Tube
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to SMD
Package Accepted: SOIC
Part Status: Active
Description: SCK ADAPT 16P SOIC-W TO SOIC 0.6
Packaging: Tube
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to SMD
Package Accepted: SOIC
Part Status: Active
на замовлення 412 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1086.10 грн |
| 10+ | 888.81 грн |
| 43+ | 818.09 грн |
| 18-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 18P SOIC-W TO SOIC 0.6
Description: SCK ADAPT 18P SOIC-W TO SOIC 0.6
товару немає в наявності
Мінімальне замовлення: 7 шт
В кошику
од. на суму грн.
| 20-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 20P SOIC-W TO SOIC 0.6
Description: SCK ADAPT 20P SOIC-W TO SOIC 0.6
товару немає в наявності
Мінімальне замовлення: 5 шт
В кошику
од. на суму грн.
| 22-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 22P SOIC-W TO SOIC 0.6
Description: SCK ADAPT 22P SOIC-W TO SOIC 0.6
товару немає в наявності
Мінімальне замовлення: 7 шт
В кошику
од. на суму грн.
| 24-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 24P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 24
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SCK ADAPT 24P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 24
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 240 шт
В кошику
од. на суму грн.
| 26-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 26P SOIC-W TO SOIC 0.6
Description: SCK ADAPT 26P SOIC-W TO SOIC 0.6
товару немає в наявності
В кошику
од. на суму грн.
| 28-665000-00 |
|
Виробник: Aries Electronics
Description: SCK ADAPT 28P SOIC-W TO SOIC 0.6
Description: SCK ADAPT 28P SOIC-W TO SOIC 0.6
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-14 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-16 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-18 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-20 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-28 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800 |
|
Виробник: Aries Electronics
Description: PROGRAMMABLE CORRECT-A-CHIP
Description: PROGRAMMABLE CORRECT-A-CHIP
товару немає в наявності
Мінімальне замовлення: 5 шт
В кошику
од. на суму грн.
| 1109800-10 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-12 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-22 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-24 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-26 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109800-8 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 1109252 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1110267-N |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.9
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPTER PLCC TO 68DIP 0.9
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 1111841-8 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER MSOP TO 8DIP 0.3
Description: SOCKET ADAPTER MSOP TO 8DIP 0.3
товару немає в наявності
Мінімальне замовлення: 10 шт
В кошику
од. на суму грн.
| 28-555000-00 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28SOWIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP TO 28SOWIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 17 шт
В кошику
од. на суму грн.
| 1111903 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOWIC TO 24DIP 0.4
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SOWIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPT SOWIC TO 24DIP 0.4
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SOWIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 68-304538-10 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
Description: SOCKET ADAPTER PLCC TO 68PGA
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| 14-354W00-20 |
|
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
Description: DIP-TO-SOWIC ADAPTOR
товару немає в наявності
В кошику
од. на суму грн.
| 16-354W00-20 |
|
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
Description: DIP-TO-SOWIC ADAPTOR
товару немає в наявності
В кошику
од. на суму грн.
| 20-354W00-20 |
|
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
Description: DIP-TO-SOWIC ADAPTOR
товару немає в наявності
В кошику
од. на суму грн.
| 24-354W00-20 |
|
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
Description: DIP-TO-SOWIC ADAPTOR
товару немає в наявності
В кошику
од. на суму грн.
| 20-301550-10 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 20-301550-20 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 22-304504-18 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 22DIP 0.4
Description: SOCKET ADAPTER SOIC TO 22DIP 0.4
товару немає в наявності
В кошику
од. на суму грн.
| 7131-108-18 |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT HB2E RELAY TO 8DIP
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): HB2E Relay
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Description: SOCKET ADAPT HB2E RELAY TO 8DIP
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): HB2E Relay
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 08-305984-11 |
|
Виробник: Aries Electronics
Description: ADAPTER WITH SMD TYPE TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
Description: ADAPTER WITH SMD TYPE TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
товару немає в наявності
Мінімальне замовлення: 14 шт
В кошику
од. на суму грн.
| 08-307472-10 |
|
Виробник: Aries Electronics
Description: ADAPTER FOR TX2SA
Description: ADAPTER FOR TX2SA
товару немає в наявності
В кошику
од. на суму грн.
| 08-307472-11 |
|
Виробник: Aries Electronics
Description: ADAPTER WITH SMD TYPE TX2SA
Description: ADAPTER WITH SMD TYPE TX2SA
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 160-306045-10 |
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP THRU HOLE
Description: SOCKET ADAPTER QFP THRU HOLE
товару немає в наявності
В кошику
од. на суму грн.
| 97-80C251 |
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO PLCC
Packaging: Bulk
Part Status: Active
Description: SOCKET ADAPTER DIP TO PLCC
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| T-0600 |
|
Виробник: Aries Electronics
Description: STRIP HEADER/SOCKET BREAK TOOL
Description: STRIP HEADER/SOCKET BREAK TOOL
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| T-675 |
|
Виробник: Aries Electronics
Description: PROGRAMMING TOOL
Description: PROGRAMMING TOOL
товару немає в наявності
В кошику
од. на суму грн.
| 16-35W000-11-RC-P (220 UP) |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 14-35W000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 18-35W000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 28-35W000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
товару немає в наявності
Мінімальне замовлення: 126 шт
В кошику
од. на суму грн.
| 16-35W000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товару немає в наявності
Мінімальне замовлення: 4 шт
В кошику
од. на суму грн.
| 20-35W000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 24-35W000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
товару немає в наявності
В кошику
од. на суму грн.
| 08-354000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 14 шт
В кошику
од. на суму грн.
| 08-354000-21-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 8SOIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
Мінімальне замовлення: 16 шт
В кошику
од. на суму грн.
| 14-354000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 14 шт
В кошику
од. на суму грн.
| 14-354000-21-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
Description: SOCKET ADAPTER DIP TO 14SOIC
Packaging: Bulk
Number of Pins: 14
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 16 шт
В кошику
од. на суму грн.
| 16-354000-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Description: SOCKET ADAPTER DIP TO 16SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.