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08-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 8SOWIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
10-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 10SOWIC
товар відсутній
12-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 12SOWIC
товар відсутній
14-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 14SOWIC
товар відсутній
16-666000-00 16-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 16SOWIC
Packaging: Tube
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to SMD
Package Accepted: SOIC
Part Status: Active
на замовлення 105 шт:
термін постачання 21-31 дні (днів)
1+1188.48 грн
10+ 991.42 грн
25+ 939.7 грн
50+ 869.08 грн
100+ 766.83 грн
18-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 18SOWIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
20-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 20SOWIC
товар відсутній
22-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 22SOWIC
товар відсутній
24-666000-00 Aries Electronics 18044-soic-to-sowic-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24SOWIC
товар відсутній
08-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 8P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
10-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 10P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 10
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
12-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 12P SOIC-W TO SOIC 0.6
товар відсутній
14-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 14P SOIC-W TO SOIC 0.6
товар відсутній
16-665000-00 16-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 16P SOIC-W TO SOIC 0.6
Packaging: Tube
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to SMD
Package Accepted: SOIC
Part Status: Active
на замовлення 1184 шт:
термін постачання 21-31 дні (днів)
1+1274.34 грн
10+ 1075.09 грн
43+ 995.46 грн
86+ 903.05 грн
258+ 853.23 грн
516+ 828.32 грн
18-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 18P SOIC-W TO SOIC 0.6
товар відсутній
20-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 20P SOIC-W TO SOIC 0.6
товар відсутній
22-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 22P SOIC-W TO SOIC 0.6
товар відсутній
24-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 24P SOIC-W TO SOIC 0.6
товар відсутній
26-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 26P SOIC-W TO SOIC 0.6
товар відсутній
28-665000-00 Aries Electronics 18045-sowi-to-soic-adapter.pdf Description: SCK ADAPT 28P SOIC-W TO SOIC 0.6
товар відсутній
1109800-14 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-16 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-18 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-20 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-28 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: PROGRAMMABLE CORRECT-A-CHIP
товар відсутній
1109800-10 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-12 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-22 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-24 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Programmable
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-26 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-8 Aries Electronics 18046-program-your-own-correct-a-chip.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109252 Aries Electronics 18052-plcc-to-sdip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
1110267-N Aries Electronics 18054-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.9
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
1111841-8 Aries Electronics 18067-msop-to-dip-adapter.pdf Description: SOCKET ADAPTER MSOP TO 8DIP 0.3
товар відсутній
28-555000-00 Aries Electronics 18069-ssop-to-sowic-adapter.pdf Description: SOCKET ADAPTER SSOP TO 28SOWIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
1111903 Aries Electronics 18071-sowic-to-dip-adapter.pdf Description: SOCKET ADAPT SOWIC TO 24DIP 0.4
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SOWIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
68-304538-10 Aries Electronics 18072-plcc-to-pga-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68PGA
товар відсутній
14-354W00-20 Aries Electronics dp40_ds_05-29-14_021207f9e8.pdf Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
16-354W00-20 Aries Electronics dp40_ds_05-29-14_021207f9e8.pdf Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
20-354W00-20 Aries Electronics dp40_ds_05-29-14_021207f9e8.pdf Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
24-354W00-20 Aries Electronics dp40_ds_05-29-14_021207f9e8.pdf Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
20-301550-10 Aries Electronics 18079-soic-to-plcc-adapter.pdf Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
20-301550-20 Aries Electronics 18079-soic-to-plcc-adapter.pdf Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
22-304504-18 Aries Electronics 18080-soic-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 22DIP 0.4
товар відсутній
7131-108-18 Aries Electronics Correct_A_Chip_Worksheet.pdf Description: SOCKET ADAPT HB2E RELAY TO 8DIP
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): HB2E Relay
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
08-305984-11 Aries Electronics 18086-aromat-relay-adapter.pdf Description: ADAPTER WITH SMD TYPE TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
товар відсутній
08-307472-10 Aries Electronics 18086-aromat-relay-adapter.pdf Description: ADAPTER FOR TX2SA
товар відсутній
08-307472-11 Aries Electronics 18086-aromat-relay-adapter.pdf Description: ADAPTER WITH SMD TYPE TX2SA
товар відсутній
160-306045-10 Aries Electronics Description: SOCKET ADAPTER QFP THRU HOLE
товар відсутній
97-80C251 Aries Electronics Description: SOCKET ADAPTER DIP TO PLCC
Packaging: Bulk
Part Status: Active
товар відсутній
T-0600 T-0600 Aries Electronics 22001-header-socket-break-tool.pdf Description: STRIP HEADER/SOCKET BREAK TOOL
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
T-675 Aries Electronics 22002-programming-tools.pdf Description: PROGRAMMING TOOL
товар відсутній
16-35W000-11-RC-P (220 UP) Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товар відсутній
14-35W000-11-RC Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
товар відсутній
18-35W000-11-RC Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
товар відсутній
28-35W000-11-RC Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
товар відсутній
16-35W000-11-RC 16-35W000-11-RC Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товар відсутній
20-35W000-11-RC 20-35W000-11-RC Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
24-35W000-11-RC Aries Electronics 18007rc-rohs-compliant-sowic-to-dip.pdf Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
товар відсутній
08-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 8SOWIC
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
10-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 10SOWIC
товар відсутній
12-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 12SOWIC
товар відсутній
14-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 14SOWIC
товар відсутній
16-666000-00 18044-soic-to-sowic-adapter.pdf
16-666000-00
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16SOWIC
Packaging: Tube
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to SMD
Package Accepted: SOIC
Part Status: Active
на замовлення 105 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1188.48 грн
10+ 991.42 грн
25+ 939.7 грн
50+ 869.08 грн
100+ 766.83 грн
18-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 18SOWIC
Packaging: Bulk
Number of Pins: 18
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
20-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20SOWIC
товар відсутній
22-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 22SOWIC
товар відсутній
24-666000-00 18044-soic-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24SOWIC
товар відсутній
08-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 8P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
10-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 10P SOIC-W TO SOIC 0.6
Packaging: Bulk
Number of Pins: 10
Mounting Type: Surface Mount
Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
12-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 12P SOIC-W TO SOIC 0.6
товар відсутній
14-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 14P SOIC-W TO SOIC 0.6
товар відсутній
16-665000-00 18045-sowi-to-soic-adapter.pdf
16-665000-00
Виробник: Aries Electronics
Description: SCK ADAPT 16P SOIC-W TO SOIC 0.6
Packaging: Tube
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to SMD
Package Accepted: SOIC
Part Status: Active
на замовлення 1184 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1274.34 грн
10+ 1075.09 грн
43+ 995.46 грн
86+ 903.05 грн
258+ 853.23 грн
516+ 828.32 грн
18-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 18P SOIC-W TO SOIC 0.6
товар відсутній
20-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 20P SOIC-W TO SOIC 0.6
товар відсутній
22-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 22P SOIC-W TO SOIC 0.6
товар відсутній
24-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 24P SOIC-W TO SOIC 0.6
товар відсутній
26-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 26P SOIC-W TO SOIC 0.6
товар відсутній
28-665000-00 18045-sowi-to-soic-adapter.pdf
Виробник: Aries Electronics
Description: SCK ADAPT 28P SOIC-W TO SOIC 0.6
товар відсутній
1109800-14 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-16 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-18 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-20 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-28 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: PROGRAMMABLE CORRECT-A-CHIP
товар відсутній
1109800-10 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-12 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-22 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-24 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Programmable
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-26 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109800-8 18046-program-your-own-correct-a-chip.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Programmable
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
1109252 18052-plcc-to-sdip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
1110267-N 18054-plcc-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.9
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
1111841-8 18067-msop-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER MSOP TO 8DIP 0.3
товар відсутній
28-555000-00 18069-ssop-to-sowic-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 28SOWIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
1111903 18071-sowic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT SOWIC TO 24DIP 0.4
Packaging: Bulk
Number of Pins: 24
Mounting Type: Through Hole
Convert From (Adapter End): SOWIC
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
68-304538-10 18072-plcc-to-pga-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68PGA
товар відсутній
14-354W00-20 dp40_ds_05-29-14_021207f9e8.pdf
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
16-354W00-20 dp40_ds_05-29-14_021207f9e8.pdf
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
20-354W00-20 dp40_ds_05-29-14_021207f9e8.pdf
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
24-354W00-20 dp40_ds_05-29-14_021207f9e8.pdf
Виробник: Aries Electronics
Description: DIP-TO-SOWIC ADAPTOR
товар відсутній
20-301550-10 18079-soic-to-plcc-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
20-301550-20 18079-soic-to-plcc-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 20PLCC
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): PLCC
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товар відсутній
22-304504-18 18080-soic-to-dip-adapter.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 22DIP 0.4
товар відсутній
7131-108-18 Correct_A_Chip_Worksheet.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT HB2E RELAY TO 8DIP
Packaging: Bulk
Number of Pins: 8
Mounting Type: Through Hole
Convert From (Adapter End): HB2E Relay
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
товар відсутній
08-305984-11 18086-aromat-relay-adapter.pdf
Виробник: Aries Electronics
Description: ADAPTER WITH SMD TYPE TX2SA
Packaging: Bulk
For Use With/Related Products: HB2E Relay
Accessory Type: Adapter
товар відсутній
08-307472-10 18086-aromat-relay-adapter.pdf
Виробник: Aries Electronics
Description: ADAPTER FOR TX2SA
товар відсутній
08-307472-11 18086-aromat-relay-adapter.pdf
Виробник: Aries Electronics
Description: ADAPTER WITH SMD TYPE TX2SA
товар відсутній
160-306045-10
Виробник: Aries Electronics
Description: SOCKET ADAPTER QFP THRU HOLE
товар відсутній
97-80C251
Виробник: Aries Electronics
Description: SOCKET ADAPTER DIP TO PLCC
Packaging: Bulk
Part Status: Active
товар відсутній
T-0600 22001-header-socket-break-tool.pdf
T-0600
Виробник: Aries Electronics
Description: STRIP HEADER/SOCKET BREAK TOOL
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
T-675 22002-programming-tools.pdf
Виробник: Aries Electronics
Description: PROGRAMMING TOOL
товар відсутній
16-35W000-11-RC-P (220 UP) 18007rc-rohs-compliant-sowic-to-dip.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товар відсутній
14-35W000-11-RC 18007rc-rohs-compliant-sowic-to-dip.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 14DIP 0.3
товар відсутній
18-35W000-11-RC 18007rc-rohs-compliant-sowic-to-dip.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 18DIP 0.3
товар відсутній
28-35W000-11-RC 18007rc-rohs-compliant-sowic-to-dip.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 28DIP 0.3
товар відсутній
16-35W000-11-RC 18007rc-rohs-compliant-sowic-to-dip.pdf
16-35W000-11-RC
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 16DIP 0.3
товар відсутній
20-35W000-11-RC 18007rc-rohs-compliant-sowic-to-dip.pdf
20-35W000-11-RC
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Packaging: Bulk
Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
24-35W000-11-RC 18007rc-rohs-compliant-sowic-to-dip.pdf
Виробник: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 24DIP 0.3
товар відсутній
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