Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15982) > Сторінка 69 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 20-7850-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 20-7875-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (1 x 20) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 20-7903-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (1 x 20) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 20-7905-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 20-7906-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 20-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 20POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 21-7438-10 | Aries Electronics |
Description: CONN SOCKET SIP 21POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 21-7530-10 | Aries Electronics |
Description: CONN SOCKET SIP 21POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 21 (1 x 21) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 21-7562-10 | Aries Electronics |
Description: CONN SOCKET SIP 21POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 21-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 21POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-7400-10 | Aries Electronics |
Description: CONN SOCKET SIP 22POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 22POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 23-7400-10 | Aries Electronics |
Description: CONN SOCKET SIP 23POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 23-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 23POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-7445-10 | Aries Electronics |
Description: CONN SOCKET SIP 24POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-7500-10 | Aries Electronics |
Description: CONN SOCKET SIP 24POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 24POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-71000-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-71219-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-71220-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7350-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7390-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7435-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINNumber of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7450-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7500-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7590-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7625-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7650-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7677-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7700-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7750-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7770-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Contact Finish - Mating: Tin |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7787-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7800-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7846-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINPackaging: Bulk Features: Elevated Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7950-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 25-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 25POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-71250-10 | Aries Electronics |
Description: CONN SOCKET SIP 26POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-7500-10 | Aries Electronics |
Description: CONN SOCKET SIP 26POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-7590-10 | Aries Electronics |
Description: CONN SOCKET SIP 26POS TINContact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 26 (1 x 26) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-7650-10 | Aries Electronics |
Description: CONN SOCKET SIP 26POS TINContact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 26 (1 x 26) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 26POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 27-7500-10 | Aries Electronics |
Description: CONN SOCKET SIP 27POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 27 (1 x 27) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| 27-7530-10 | Aries Electronics |
Description: CONN SOCKET SIP 27POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 27-7550-10 | Aries Electronics |
Description: CONN SOCKET SIP 27POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 27-7580-10 | Aries Electronics |
Description: CONN SOCKET SIP 27POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 27-7650-10 | Aries Electronics |
Description: CONN SOCKET SIP 27POS TINContact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 27 (1 x 27) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | |
| 27-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 27POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-7440-10 | Aries Electronics |
Description: CONN SOCKET SIP 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-7750-10 | Aries Electronics |
Description: CONN SOCKET SIP 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-7770-10 | Aries Electronics |
Description: CONN SOCKET SIP 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-7850-10 | Aries Electronics |
Description: CONN SOCKET SIP 28POS TINNumber of Positions or Pins (Grid): 28 (1 x 28) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 28POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 29-71250-10 | Aries Electronics |
Description: CONN SOCKET SIP 29POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 29-7600-10 | Aries Electronics |
Description: CONN SOCKET SIP 29POS TINType: SIP Mounting Type: Through Hole Features: Elevated Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 29 (1 x 29) Operating Temperature: -55°C ~ 105°C |
товару немає в наявності |
В кошику од. на суму грн. | |
| 29-7625-10 | Aries Electronics |
Description: CONN SOCKET SIP 29POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 29-7XXXX-10 | Aries Electronics |
Description: CONN SOCKET SIP 29POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-7360-10 | Aries Electronics |
Description: CONN SOCKET SIP 30POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-7365-10 | Aries Electronics |
Description: CONN SOCKET SIP 30POS TIN |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-7374-10 | Aries Electronics |
Description: CONN SOCKET SIP 30POS TINPart Status: Active Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 30 (1 x 30) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Features: Elevated |
товару немає в наявності |
В кошику од. на суму грн. |
| 20-7850-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Description: CONN SOCKET SIP 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-7875-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 20POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 20-7903-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 20POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 20-7905-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Description: CONN SOCKET SIP 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-7906-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Description: CONN SOCKET SIP 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 20-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS TIN
Description: CONN SOCKET SIP 20POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 21-7438-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS TIN
Description: CONN SOCKET SIP 21POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 21-7530-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 21 (1 x 21)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 21POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 21 (1 x 21)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 21-7562-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS TIN
Description: CONN SOCKET SIP 21POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 21-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 21POS TIN
Description: CONN SOCKET SIP 21POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 22-7400-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 22POS TIN
Description: CONN SOCKET SIP 22POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 22-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 22POS TIN
Description: CONN SOCKET SIP 22POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 23-7400-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 23POS TIN
Description: CONN SOCKET SIP 23POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 23-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 23POS TIN
Description: CONN SOCKET SIP 23POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 24-7445-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS TIN
Description: CONN SOCKET SIP 24POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 24-7500-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS TIN
Description: CONN SOCKET SIP 24POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 24-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS TIN
Description: CONN SOCKET SIP 24POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-71000-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-71219-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-71220-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7350-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 25-7390-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7435-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Description: CONN SOCKET SIP 25POS TIN
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
товару немає в наявності
В кошику
од. на суму грн.
| 25-7450-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7500-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7590-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7625-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7650-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 25-7677-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 25-7700-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7750-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7770-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Finish - Mating: Tin
Description: CONN SOCKET SIP 25POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Finish - Mating: Tin
товару немає в наявності
В кошику
од. на суму грн.
| 25-7787-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 25-7800-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 25-7846-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 25POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 25-7950-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 25POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 25-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS TIN
Description: CONN SOCKET SIP 25POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 26-71250-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 26POS TIN
Description: CONN SOCKET SIP 26POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 26-7500-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 26POS TIN
Description: CONN SOCKET SIP 26POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 26-7590-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 26POS TIN
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 26 (1 x 26)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Description: CONN SOCKET SIP 26POS TIN
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 26 (1 x 26)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику
од. на суму грн.
| 26-7650-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 26POS TIN
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 26 (1 x 26)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET SIP 26POS TIN
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 26 (1 x 26)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 26-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 26POS TIN
Description: CONN SOCKET SIP 26POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 27-7500-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 27POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 27 (1 x 27)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Description: CONN SOCKET SIP 27POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 27 (1 x 27)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 27-7530-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 27POS TIN
Description: CONN SOCKET SIP 27POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 27-7550-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 27POS TIN
Description: CONN SOCKET SIP 27POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 27-7580-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 27POS TIN
Description: CONN SOCKET SIP 27POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 27-7650-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 27POS TIN
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 27 (1 x 27)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET SIP 27POS TIN
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 27 (1 x 27)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 27-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 27POS TIN
Description: CONN SOCKET SIP 27POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 28-7440-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 28POS TIN
Description: CONN SOCKET SIP 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 28-7750-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 28POS TIN
Description: CONN SOCKET SIP 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 28-7770-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 28POS TIN
Description: CONN SOCKET SIP 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 28-7850-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 28POS TIN
Number of Positions or Pins (Grid): 28 (1 x 28)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Description: CONN SOCKET SIP 28POS TIN
Number of Positions or Pins (Grid): 28 (1 x 28)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
товару немає в наявності
В кошику
од. на суму грн.
| 28-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 28POS TIN
Description: CONN SOCKET SIP 28POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 29-71250-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 29POS TIN
Description: CONN SOCKET SIP 29POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 29-7600-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 29POS TIN
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 29 (1 x 29)
Operating Temperature: -55°C ~ 105°C
Description: CONN SOCKET SIP 29POS TIN
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 29 (1 x 29)
Operating Temperature: -55°C ~ 105°C
товару немає в наявності
В кошику
од. на суму грн.
| 29-7625-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 29POS TIN
Description: CONN SOCKET SIP 29POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 29-7XXXX-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 29POS TIN
Description: CONN SOCKET SIP 29POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 30-7360-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Description: CONN SOCKET SIP 30POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 30-7365-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Description: CONN SOCKET SIP 30POS TIN
товару немає в наявності
В кошику
од. на суму грн.
| 30-7374-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 30POS TIN
Part Status: Active
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 30 (1 x 30)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
Description: CONN SOCKET SIP 30POS TIN
Part Status: Active
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 30 (1 x 30)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Features: Elevated
товару немає в наявності
В кошику
од. на суму грн.
