Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 74 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|
| 30-6513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 30-9513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 30-9513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 30-9513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 30-9513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 30-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 32-9513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 32-9513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 32-9513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 32-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 34-3513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 34 (2 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 34-3513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 34 (2 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 34-3513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 34 (2 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 34-3513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 34 (2 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 34-3513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 34 (2 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 36-6513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 36-6513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 36-6513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 36-6513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 36-6513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 38-3513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 38-3513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 38-3513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 38-3513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 38-3513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
|
|
40-9513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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| 40-9513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 40-9513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 40-9513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 40-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 42-6513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 50-9513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 50-9513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 50-9513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 50-9513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 50POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 50-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 52-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 52POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 60-9513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 60-9513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 60-9513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 60-9513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 60-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 60POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 64-9513-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 64POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 64-9513-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 64POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 64-9513-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 64POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 64-9513-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 64POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 64-9513-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 64POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-6502-31 | Aries Electronics |
Description: SERIES 503 LO-PRO SCKT WIRE WRAP |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-6503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 06-6503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 08-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 08-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 08-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 08-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 08-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
| 30-6513-11H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9513-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9513-10H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9513-10T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9513-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-9513-10H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 32-9513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 32-9513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 32-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 34-3513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 34-3513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 34-3513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 34-3513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 34-3513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 36-6513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 36-6513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 36-6513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 36-6513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 36-6513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 38-3513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 38-3513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 38-3513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 38-3513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 38-3513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Description: CONN IC DIP SOCKET 38POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-9513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 727.62 грн |
| 10+ | 631.23 грн |
| 40-9513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-9513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-9513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 40-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 42-6513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 50-9513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 50-9513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 50-9513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 50-9513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 50-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 52-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 60-9513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 60-9513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 60-9513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 60-9513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 60-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 60POS GOLD
Description: CONN IC DIP SOCKET 60POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 64-9513-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 64-9513-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 64-9513-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 64-9513-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 64-9513-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 06-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 06-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 06-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 06-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 06-6502-31 |
![]() |
Виробник: Aries Electronics
Description: SERIES 503 LO-PRO SCKT WIRE WRAP
Description: SERIES 503 LO-PRO SCKT WIRE WRAP
товару немає в наявності
В кошику
од. на суму грн.
| 06-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 06-6503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 06-6503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
