Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15952) > Сторінка 86 з 266
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 02-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDNumber of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder |
товару немає в наявності |
Мінімальне замовлення: 1316 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1191 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 807 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1563 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1316 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Type: DIP, 0.2" (5.08mm) Row Spacing |
товару немає в наявності |
Мінімальне замовлення: 1316 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 295 шт В кошику од. на суму грн. | |||||||||||||||||
| 02-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 807 шт В кошику од. на суму грн. | |||||||||||||||||
| 03-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 264 шт В кошику од. на суму грн. | |||||||||||||||||
| 03-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 278 шт В кошику од. на суму грн. | |||||||||||||||||
| 03-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 239 шт В кошику од. на суму грн. | |||||||||||||||||
| 03-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 3 (1 x 3) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 582 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 173 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 179 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 152 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (1 x 4) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 463 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDType: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) |
товару немає в наявності |
Мінімальне замовлення: 863 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDContact Material - Post: Brass Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin |
товару немає в наявності |
Мінімальне замовлення: 893 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 193 шт В кошику од. на суму грн. | |||||||||||||||||
| 04-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 463 шт В кошику од. на суму грн. | |||||||||||||||||
| 05-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 218 шт В кошику од. на суму грн. | |||||||||||||||||
| 05-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 186 шт В кошику од. на суму грн. | |||||||||||||||||
| 05-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 193 шт В кошику од. на суму грн. | |||||||||||||||||
| 05-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 157 шт В кошику од. на суму грн. | |||||||||||||||||
| 05-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 5 (1 x 5) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 391 шт В кошику од. на суму грн. | |||||||||||||||||
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06-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
на замовлення 143 шт: термін постачання 21-31 дні (днів) |
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06-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (1 x 6) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
на замовлення 107 шт: термін постачання 21-31 дні (днів) |
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| 06-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 167 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 136 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (1 x 6) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 334 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDType: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) |
товару немає в наявності |
Мінімальне замовлення: 736 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 642 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 658 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 136 шт В кошику од. на суму грн. | |||||||||||||||||
| 06-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 334 шт В кошику од. на суму грн. | |||||||||||||||||
| 07-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 132 шт В кошику од. на суму грн. | |||||||||||||||||
| 07-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 143 шт В кошику од. на суму грн. | |||||||||||||||||
| 07-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 148 шт В кошику од. на суму грн. | |||||||||||||||||
| 07-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. | |||||||||||||||||
| 07-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 7 (1 x 7) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 295 шт В кошику од. на суму грн. | |||||||||||||||||
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08-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 2262 шт: термін постачання 21-31 дні (днів) |
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| 08-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 93 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 74 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (1 x 8) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 261 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 582 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 511 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 544 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 107 шт В кошику од. на суму грн. | |||||||||||||||||
| 08-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 261 шт В кошику од. на суму грн. | |||||||||||||||||
| 09-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 136 шт В кошику од. на суму грн. | |||||||||||||||||
| 09-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 117 шт В кошику од. на суму грн. | |||||||||||||||||
| 09-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 122 шт В кошику од. на суму грн. | |||||||||||||||||
| 09-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 09-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 9 (1 x 9) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 232 шт В кошику од. на суму грн. | |||||||||||||||||
|
|
10-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLDType: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (1 x 10) |
на замовлення 1077 шт: термін постачання 21-31 дні (днів) |
|
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| 10-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 105 шт В кошику од. на суму грн. | |||||||||||||||||
| 10-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 112 шт В кошику од. на суму грн. |
| 02-0518-10T |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Description: CONN SOCKET SIP 2POS GOLD
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
товару немає в наявності
Мінімальне замовлення: 1316 шт
В кошику
од. на суму грн.
| 02-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1191 шт
В кошику
од. на суму грн.
| 02-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 807 шт
В кошику
од. на суму грн.
| 02-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1563 шт
В кошику
од. на суму грн.
| 02-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1316 шт
В кошику
од. на суму грн.
| 02-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Type: DIP, 0.2" (5.08mm) Row Spacing
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Type: DIP, 0.2" (5.08mm) Row Spacing
товару немає в наявності
Мінімальне замовлення: 1316 шт
В кошику
од. на суму грн.
| 02-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Description: CONN IC DIP SOCKET 2POS GOLD
товару немає в наявності
Мінімальне замовлення: 295 шт
В кошику
од. на суму грн.
| 02-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 807 шт
В кошику
од. на суму грн.
| 03-0518-10H |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
Мінімальне замовлення: 264 шт
В кошику
од. на суму грн.
| 03-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
Мінімальне замовлення: 278 шт
В кошику
од. на суму грн.
| 03-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
Мінімальне замовлення: 239 шт
В кошику
од. на суму грн.
| 03-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 3 (1 x 3)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 3POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 3 (1 x 3)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 582 шт
В кошику
од. на суму грн.
| 04-0518-10 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| 04-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
Мінімальне замовлення: 173 шт
В кошику
од. на суму грн.
| 04-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
Мінімальне замовлення: 179 шт
В кошику
од. на суму грн.
| 04-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
Мінімальне замовлення: 152 шт
В кошику
од. на суму грн.
| 04-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (1 x 4)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (1 x 4)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 463 шт
В кошику
од. на суму грн.
| 04-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 04-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Description: CONN IC DIP SOCKET 4POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
товару немає в наявності
Мінімальне замовлення: 863 шт
В кошику
од. на суму грн.
| 04-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
товару немає в наявності
Мінімальне замовлення: 893 шт
В кошику
од. на суму грн.
| 04-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
Мінімальне замовлення: 193 шт
В кошику
од. на суму грн.
| 04-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 463 шт
В кошику
од. на суму грн.
| 05-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
Мінімальне замовлення: 218 шт
В кошику
од. на суму грн.
| 05-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
Мінімальне замовлення: 186 шт
В кошику
од. на суму грн.
| 05-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
Мінімальне замовлення: 193 шт
В кошику
од. на суму грн.
| 05-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
Мінімальне замовлення: 157 шт
В кошику
од. на суму грн.
| 05-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 5 (1 x 5)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 5POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 5 (1 x 5)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 391 шт
В кошику
од. на суму грн.
| 06-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
на замовлення 143 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 74.37 грн |
| 10+ | 60.34 грн |
| 25+ | 57.93 грн |
| 50+ | 53.21 грн |
| 100+ | 50.90 грн |
| 06-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
на замовлення 107 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 83.07 грн |
| 10+ | 67.88 грн |
| 100+ | 60.96 грн |
| 06-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
Мінімальне замовлення: 167 шт
В кошику
од. на суму грн.
| 06-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
Мінімальне замовлення: 136 шт
В кошику
од. на суму грн.
| 06-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 334 шт
В кошику
од. на суму грн.
| 06-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Description: CONN IC DIP SOCKET 6POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
товару немає в наявності
Мінімальне замовлення: 736 шт
В кошику
од. на суму грн.
| 06-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 642 шт
В кошику
од. на суму грн.
| 06-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 658 шт
В кошику
од. на суму грн.
| 06-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
Мінімальне замовлення: 136 шт
В кошику
од. на суму грн.
| 06-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 334 шт
В кошику
од. на суму грн.
| 07-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
Мінімальне замовлення: 132 шт
В кошику
од. на суму грн.
| 07-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
Мінімальне замовлення: 143 шт
В кошику
од. на суму грн.
| 07-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
Мінімальне замовлення: 148 шт
В кошику
од. на суму грн.
| 07-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| 07-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 7 (1 x 7)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 7POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 7 (1 x 7)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 295 шт
В кошику
од. на суму грн.
| 08-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 2262 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 104.43 грн |
| 10+ | 85.56 грн |
| 25+ | 80.15 грн |
| 50+ | 71.61 грн |
| 100+ | 68.19 грн |
| 250+ | 63.92 грн |
| 500+ | 59.87 грн |
| 1000+ | 57.01 грн |
| 08-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| 08-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
Мінімальне замовлення: 93 шт
В кошику
од. на суму грн.
| 08-0518-11 |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
Мінімальне замовлення: 74 шт
В кошику
од. на суму грн.
| 08-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (1 x 8)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (1 x 8)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 261 шт
В кошику
од. на суму грн.
| 08-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 582 шт
В кошику
од. на суму грн.
| 08-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 511 шт
В кошику
од. на суму грн.
| 08-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 544 шт
В кошику
од. на суму грн.
| 08-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
Мінімальне замовлення: 107 шт
В кошику
од. на суму грн.
| 08-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 261 шт
В кошику
од. на суму грн.
| 09-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
Мінімальне замовлення: 136 шт
В кошику
од. на суму грн.
| 09-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
Мінімальне замовлення: 117 шт
В кошику
од. на суму грн.
| 09-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
Мінімальне замовлення: 122 шт
В кошику
од. на суму грн.
| 09-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 09-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 9POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 232 шт
В кошику
од. на суму грн.
| 10-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Description: CONN SOCKET SIP 10POS GOLD
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
на замовлення 1077 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 106.02 грн |
| 10+ | 86.62 грн |
| 25+ | 81.18 грн |
| 50+ | 72.54 грн |
| 100+ | 69.07 грн |
| 250+ | 64.75 грн |
| 500+ | 60.64 грн |
| 1000+ | 57.75 грн |
| 10-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
товару немає в наявності
Мінімальне замовлення: 105 шт
В кошику
од. на суму грн.
| 10-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
товару немає в наявності
Мінімальне замовлення: 112 шт
В кошику
од. на суму грн.


