Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15982) > Сторінка 86 з 267
| Фото | Назва | Виробник | Інформація |
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02-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDPitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
на замовлення 12441 шт: термін постачання 21-31 дні (днів) |
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| 02-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDPackaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDNumber of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Type: DIP, 0.2" (5.08mm) Row Spacing |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 02-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 2 (1 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 03-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 03-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 03-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 03-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 3 (1 x 3) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (1 x 4) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDType: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDContact Material - Post: Brass Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 04-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 05-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 05-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 05-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 05-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 05-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 5 (1 x 5) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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06-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
на замовлення 143 шт: термін постачання 21-31 дні (днів) |
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06-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (1 x 6) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
на замовлення 107 шт: термін постачання 21-31 дні (днів) |
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| 06-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (1 x 6) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDType: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 06-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 07-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 07-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 07-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 07-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 07-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 7 (1 x 7) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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08-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 1623 шт: термін постачання 21-31 дні (днів) |
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| 08-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (1 x 8) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 08-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 09-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 09-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 09-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 09-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 09-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 9 (1 x 9) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
|
|
10-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLDType: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (1 x 10) |
на замовлення 1077 шт: термін постачання 21-31 дні (днів) |
|
| 02-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 2POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
на замовлення 12441 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 34.49 грн |
| 12+ | 26.79 грн |
| 25+ | 24.73 грн |
| 50+ | 21.83 грн |
| 100+ | 20.53 грн |
| 250+ | 18.92 грн |
| 500+ | 17.50 грн |
| 1000+ | 16.46 грн |
| 2500+ | 15.17 грн |
| 02-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Description: CONN SOCKET SIP 2POS GOLD
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
товару немає в наявності
В кошику
од. на суму грн.
| 02-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Description: CONN SOCKET SIP 2POS GOLD
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
товару немає в наявності
В кошику
од. на суму грн.
| 02-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 02-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 02-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 02-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 02-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Type: DIP, 0.2" (5.08mm) Row Spacing
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Type: DIP, 0.2" (5.08mm) Row Spacing
товару немає в наявності
В кошику
од. на суму грн.
| 02-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Description: CONN IC DIP SOCKET 2POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 02-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 2POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 2 (1 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 03-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 03-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 03-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 03-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 3 (1 x 3)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 3POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 3 (1 x 3)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 04-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 04-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 04-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 04-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 04-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (1 x 4)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (1 x 4)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 04-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику
од. на суму грн.
| 04-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Description: CONN IC DIP SOCKET 4POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
товару немає в наявності
В кошику
од. на суму грн.
| 04-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
товару немає в наявності
В кошику
од. на суму грн.
| 04-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 04-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 05-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 05-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 05-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 05-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 05-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 5 (1 x 5)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 5POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 5 (1 x 5)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 06-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
на замовлення 143 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 73.68 грн |
| 10+ | 59.78 грн |
| 25+ | 57.39 грн |
| 50+ | 52.71 грн |
| 100+ | 50.43 грн |
| 06-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
на замовлення 107 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 82.30 грн |
| 10+ | 67.25 грн |
| 100+ | 60.40 грн |
| 06-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 06-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 06-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (1 x 6)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 06-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Description: CONN IC DIP SOCKET 6POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
товару немає в наявності
В кошику
од. на суму грн.
| 06-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 06-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 06-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 06-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 07-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 07-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 07-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 07-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 07-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 7 (1 x 7)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 7POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 7 (1 x 7)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 08-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 1623 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 101.11 грн |
| 10+ | 82.95 грн |
| 25+ | 77.77 грн |
| 50+ | 69.47 грн |
| 100+ | 66.16 грн |
| 250+ | 62.01 грн |
| 500+ | 58.08 грн |
| 1000+ | 55.31 грн |
| 08-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (1 x 8)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (1 x 8)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 08-1518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 08-1518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 08-1518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 08-1518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 08-1518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 09-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 09-0518-10H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 09-0518-10T |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 09-0518-11 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 09-0518-11H |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 9POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 9 (1 x 9)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 10-0518-10 |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Description: CONN SOCKET SIP 10POS GOLD
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
на замовлення 1077 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 105.03 грн |
| 10+ | 85.82 грн |
| 25+ | 80.43 грн |
| 50+ | 71.87 грн |
| 100+ | 68.43 грн |
| 250+ | 64.14 грн |
| 500+ | 60.08 грн |
| 1000+ | 57.21 грн |

