Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (342766) > Сторінка 1438 з 5713
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| SPNY801039 | Microchip Technology | Description: IC ETHERNET CONTROLLER SMD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| SPNY801049 | Microchip Technology | Description: IC ETHERNET CONTROLLER SMD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| SPNY801068 | Microchip Technology | Description: IC ETHERNET SWITCH SMD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| MX574EBH20M0000 | Microchip Technology |
 Description: OSC 20MHZ LVCMOS |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| MX574EBH20M0000-TR | Microchip Technology |
Description: 20MHZ LVCMOS |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MXRT100KP260CA | Microchip Technology |
Description: TVS DIODE 260VWM 512VC CASE 5A |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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ATSAMD51J20A-AU-EFP | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 64TQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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ATSAMD51J20A-AUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 51 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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ATSAMD51J20A-AUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 51 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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ATSAME53J20A-AU-EFP | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 64TQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025W104132-I/NX | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 132VQFN Packaging: Tray Package / Case: 132-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® M-Class Data Converters: A/D 20x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 132-VQFN (10x10) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 138 шт: термін постачання 21-31 дні (днів) |
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ATSAM4C16CA-AUR | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 100LQFP |
на замовлення 2939 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||
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ATSAM4CMS32CA-AUR | Microchip Technology |
Description: IC MCU 32BIT 2MB FLASH 100LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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ATSAM4CMS32CA-AUR | Microchip Technology |
Description: IC MCU 32BIT 2MB FLASH 100LQFP |
на замовлення 3950 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||
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1N5811E3 | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B AXIAL Packaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
на замовлення 88 шт: термін постачання 21-31 дні (днів) |
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1N5811E3/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B AXIAL Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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1N5811USE3/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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JAN1N5811/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 6A Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 6A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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JAN1N5811US/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 6A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 6A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| JANHCE1N5811 | Microchip Technology |
Description: DIODE GEN PURP 150V 3A DIE Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: Die Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| JANKCE1N5811 | Microchip Technology |
Description: DIODE GEN PURP 150V 3A DIE Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: Die Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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JANS1N5811/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 6A B AXIAL Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 6A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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JANS1N5811US/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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JANTX1N5811US/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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JANTXV1N5811/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 65pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V Qualification: MIL-PRF-19500/477 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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DM240017 | Microchip Technology |
Description: PIC24F LCD CURIOSITY DEV BOARD Packaging: Bulk Function: LCD Controller Type: Display Utilized IC / Part: PIC24F Supplied Contents: Board(s) Embedded: Yes, MCU, 16-Bit Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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| DM240415-2 | Microchip Technology | Description: ACCESSORY DEVELOPMENT START KIT |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MA240040 | Microchip Technology |
Description: PIC24FJ128GL306 GP PIM Packaging: Bulk For Use With/Related Products: PIC24FJ128GL306 Accessory Type: Plug-In Module (PIM) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PIC24FJ1024GA610-E/BG | Microchip Technology |
Description: IC MCU 16BIT 1MB FLASH 121TFBGA Packaging: Tray Package / Case: 121-TFBGA Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 1MB (341.5K x 24) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 24x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT Supplier Device Package: 121-TFBGA (10x10) Grade: Automotive Number of I/O: 85 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC24FJ1024GA610-E/PT | Microchip Technology |
Description: IC MCU 16BIT 1MB FLASH 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 1MB (341.5K x 24) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 24x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT Supplier Device Package: 100-TQFP (12x12) Grade: Automotive Number of I/O: 85 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC24FJ1024GB610-E/BG | Microchip Technology |
Description: IC MCU 16BIT 1MB FLASH 121TFBGA Packaging: Tray Package / Case: 121-TFBGA Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 1MB (341.5K x 24) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 24x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT Supplier Device Package: 121-TFBGA (10x10) Grade: Automotive Number of I/O: 85 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC24FJ1024GB610-E/PT | Microchip Technology |
Description: IC MCU 16BIT 1MB FLASH 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 1MB (341.5K x 24) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 24x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT Supplier Device Package: 100-TQFP (12x12) Grade: Automotive Number of I/O: 85 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC24FJ128GA610-E/BG | Microchip Technology | Description: IC MCU 16BIT 128KB FLSH 121TFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| MXPLAD15KP60Ae3 | Microchip Technology |
Description: TVS DIODE 60VWM 96.8VC PLAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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ATTINY261-15MD | Microchip Technology |
Description: IC MCU 8BIT 2KB FLASH 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (1K x 16) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 11x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Grade: Automotive Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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ATTINY261-15MD | Microchip Technology |
Description: IC MCU 8BIT 2KB FLASH 32QFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (1K x 16) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 11x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Grade: Automotive Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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AC244049 | Microchip Technology | Description: PIC12F752 PROCESSOR EXT PAK |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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AC244050 | Microchip Technology | Description: PIC12HV752 PROCESSOR EXT PAK |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| SW500024 | Microchip Technology | Description: CCS C COMPILER IDE |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||
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PIC32MZ1025DAK169-V/HF | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAK169T-V/HF | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAK176-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Part Status: Active Number of I/O: 120 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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PIC32MZ1025DAK176T-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Number of I/O: 120 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAL169-V/HF | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAL169T-V/HF | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAL176-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Number of I/O: 120 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAL176T-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Number of I/O: 120 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAR169-V/6J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 + 32MB DDR2 SDRAM Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 169-LFBGA (11x11) Number of I/O: 120 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAR169T-V/6J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 + 32MB DDR2 SDRAM Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 169-LFBGA (11x11) Number of I/O: 120 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||
 |
PIC32MZ1025DAR176-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAR176T-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAS176-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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PIC32MZ1025DAS176T-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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CDLL5250/TR | Microchip Technology |
Description: VOLTAGE REGULATOR |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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CDLL5250A/TR | Microchip Technology |
Description: VOLTAGE REGULATOR |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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CDLL5250B/TR | Microchip Technology |
Description: DIODE ZENER 20V DO-213AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: DO-213AB, MELF Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: DO-213AB Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 15 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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CDLL5250BE3 | Microchip Technology | Description: VOLTAGE REGULATOR |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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CDLL5250BE3/TR | Microchip Technology | Description: VOLTAGE REGULATOR |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| 2N1701 | Microchip Technology | Description: NPN TRANSISTOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| 2N1717 | Microchip Technology |
Description: NPN TRANSISTOR Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
| SPNY801039 |
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
Description: IC ETHERNET CONTROLLER SMD
товару немає в наявності
В кошику
од. на суму грн.
| SPNY801049 |
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
Description: IC ETHERNET CONTROLLER SMD
товару немає в наявності
В кошику
од. на суму грн.
| SPNY801068 |
Виробник: Microchip Technology
Description: IC ETHERNET SWITCH SMD
Description: IC ETHERNET SWITCH SMD
товару немає в наявності
В кошику
од. на суму грн.
| MX574EBH20M0000 |
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Виробник: Microchip Technology
Description: OSC 20MHZ LVCMOS
Description: OSC 20MHZ LVCMOS
товару немає в наявності
В кошику
од. на суму грн.
| MX574EBH20M0000-TR |
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Виробник: Microchip Technology
Description: 20MHZ LVCMOS
Description: 20MHZ LVCMOS
товару немає в наявності
В кошику
од. на суму грн.
| MXRT100KP260CA |
|
Виробник: Microchip Technology
Description: TVS DIODE 260VWM 512VC CASE 5A
Description: TVS DIODE 260VWM 512VC CASE 5A
товару немає в наявності
В кошику
од. на суму грн.
| ATSAMD51J20A-AU-EFP |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Description: IC MCU 32BIT 1MB FLASH 64TQFP
товару немає в наявності
В кошику
од. на суму грн.
| ATSAMD51J20A-AUT-EFP |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| ATSAMD51J20A-AUT-EFP |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| ATSAME53J20A-AU-EFP |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Description: IC MCU 32BIT 1MB FLASH 64TQFP
товару немає в наявності
В кошику
од. на суму грн.
| PIC32MZ1025W104132-I/NX |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 138 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 322.05 грн |
| ATSAM4C16CA-AUR |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Description: IC MCU 32BIT 1MB FLASH 100LQFP
на замовлення 2939 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| ATSAM4CMS32CA-AUR |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Description: IC MCU 32BIT 2MB FLASH 100LQFP
товару немає в наявності
В кошику
од. на суму грн.
| ATSAM4CMS32CA-AUR |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Description: IC MCU 32BIT 2MB FLASH 100LQFP
на замовлення 3950 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 1N5811E3 |
|
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 630.81 грн |
| 1N5811E3/TR |
|
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товару немає в наявності
В кошику
од. на суму грн.
| 1N5811USE3/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
товару немає в наявності
В кошику
од. на суму грн.
| JAN1N5811/TR |
|
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
товару немає в наявності
В кошику
од. на суму грн.
| JAN1N5811US/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
товару немає в наявності
В кошику
од. на суму грн.
| JANHCE1N5811 |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
товару немає в наявності
В кошику
од. на суму грн.
| JANKCE1N5811 |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товару немає в наявності
В кошику
од. на суму грн.
| JANS1N5811/TR |
|
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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| JANS1N5811US/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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| JANTX1N5811US/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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| JANTXV1N5811/TR |
|
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
Description: DIODE GEN PURP 150V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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| DM240017 |
|
Виробник: Microchip Technology
Description: PIC24F LCD CURIOSITY DEV BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PIC24F
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Description: PIC24F LCD CURIOSITY DEV BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PIC24F
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5888.12 грн |
| DM240415-2 |
Виробник: Microchip Technology
Description: ACCESSORY DEVELOPMENT START KIT
Description: ACCESSORY DEVELOPMENT START KIT
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| MA240040 |
|
Виробник: Microchip Technology
Description: PIC24FJ128GL306 GP PIM
Packaging: Bulk
For Use With/Related Products: PIC24FJ128GL306
Accessory Type: Plug-In Module (PIM)
Part Status: Active
Description: PIC24FJ128GL306 GP PIM
Packaging: Bulk
For Use With/Related Products: PIC24FJ128GL306
Accessory Type: Plug-In Module (PIM)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3064.41 грн |
| PIC24FJ1024GA610-E/BG |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| PIC24FJ1024GA610-E/PT |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| PIC24FJ1024GB610-E/BG |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| PIC24FJ1024GB610-E/PT |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| PIC24FJ128GA610-E/BG |
Виробник: Microchip Technology
Description: IC MCU 16BIT 128KB FLSH 121TFBGA
Description: IC MCU 16BIT 128KB FLSH 121TFBGA
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| MXPLAD15KP60Ae3 |
|
Виробник: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC PLAD
Description: TVS DIODE 60VWM 96.8VC PLAD
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| ATTINY261-15MD |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| ATTINY261-15MD |
|
Виробник: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| AC244049 |
Виробник: Microchip Technology
Description: PIC12F752 PROCESSOR EXT PAK
Description: PIC12F752 PROCESSOR EXT PAK
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| AC244050 |
Виробник: Microchip Technology
Description: PIC12HV752 PROCESSOR EXT PAK
Description: PIC12HV752 PROCESSOR EXT PAK
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| SW500024 |
Виробник: Microchip Technology
Description: CCS C COMPILER IDE
Description: CCS C COMPILER IDE
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PIC32MZ1025DAK169-V/HF |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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| PIC32MZ1025DAK169T-V/HF |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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| PIC32MZ1025DAK176-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1334.66 грн |
| 25+ | 1179.47 грн |
| PIC32MZ1025DAK176T-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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| PIC32MZ1025DAL169-V/HF |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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| PIC32MZ1025DAL169T-V/HF |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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| PIC32MZ1025DAL176-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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| PIC32MZ1025DAL176T-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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| PIC32MZ1025DAR169-V/6J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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| PIC32MZ1025DAR169T-V/6J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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| PIC32MZ1025DAR176-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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од. на суму грн.
| PIC32MZ1025DAR176T-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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од. на суму грн.
| PIC32MZ1025DAS176-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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од. на суму грн.
| PIC32MZ1025DAS176T-V/2J |
|
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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| CDLL5250/TR |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Description: VOLTAGE REGULATOR
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| CDLL5250A/TR |
|
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Description: VOLTAGE REGULATOR
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В кошику
од. на суму грн.
| CDLL5250B/TR |
|
Виробник: Microchip Technology
Description: DIODE ZENER 20V DO-213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 15 V
Description: DIODE ZENER 20V DO-213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 15 V
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| CDLL5250BE3 |
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Description: VOLTAGE REGULATOR
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| CDLL5250BE3/TR |
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Description: VOLTAGE REGULATOR
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| 2N1701 |
Виробник: Microchip Technology
Description: NPN TRANSISTOR
Description: NPN TRANSISTOR
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