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JANTXV1N6309US Microchip Technology Description: DIODE ZENER 2.4V 500MW MELF
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JANS1N6310US Microchip Technology Description: DIODE ZENER 2.7V 500MW MELF
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JANS1N6311 Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 3V 500MW DO35
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JANTXV1N6311 Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 3V 500MW DO35
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JANS1N6311DUS JANS1N6311DUS Microchip Technology 11083-lds-0193-1.pdf Description: DIODE ZENER 3V 500MW SQ-MELF
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 1 V
Qualification: MIL-PRF-19500/533
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JAN1N4126-1 JAN1N4126-1 Microchip Technology 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf Description: DIODE ZENER 51V DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 51 V
Impedance (Max) (Zzt): 300 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 38.8 V
Qualification: MIL-PRF-19500/435
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1N4448/TR 1N4448/TR Microchip Technology Description: DIODE GEN PURP 75V 200MA DO35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-35
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 100
Voltage Coupled to Current - Reverse Leakage @ Vr: 20
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TC33370VAT TC33370VAT Microchip Technology TCSIS00089-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 25 W
на замовлення 1316 шт:
термін постачання 21-31 дні (днів)
188+112.81 грн
Мінімальне замовлення: 188
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TC33371VAT TC33371VAT Microchip Technology TCSIS00089-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 30 W
на замовлення 1387 шт:
термін постачання 21-31 дні (днів)
188+112.81 грн
Мінімальне замовлення: 188
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TC33372VAT TC33372VAT Microchip Technology TCSIS00089-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 60 W
на замовлення 1390 шт:
термін постачання 21-31 дні (днів)
158+133.96 грн
Мінімальне замовлення: 158
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TC33373VAT TC33373VAT Microchip Technology TCSIS00089-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 75 W
на замовлення 1311 шт:
термін постачання 21-31 дні (днів)
149+141.71 грн
Мінімальне замовлення: 149
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MXLSMBJ28A MXLSMBJ28A Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MXLSMBJ28Ae3 MXLSMBJ28Ae3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MXSMBJ28A MXSMBJ28A Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MXSMBJ28Ae3 MXSMBJ28Ae3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MASMBJ28Ae3 MASMBJ28Ae3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-214AA (SMBJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG22CA MASMCG22CA Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 22VWM 35.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 42.2A
Voltage - Reverse Standoff (Typ): 22V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 24.4V
Voltage - Clamping (Max) @ Ipp: 35.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N4977C JAN1N4977C Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 62V 5W E AXIAL
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93LC56-I/SL 93LC56-I/SL Microchip Technology MCHPS00073-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 2KBIT MICROWIRE 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 14-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Microwire
Access Time: 500 ns
Memory Organization: 128 x 16, 256 x 8
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK169-V/HF PIC32MZ1064DAK169-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK169T-V/HF PIC32MZ1064DAK169T-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK176-V/2J PIC32MZ1064DAK176-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK176T-V/2J PIC32MZ1064DAK176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL169-V/HF PIC32MZ1064DAL169-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
на замовлення 176 шт:
термін постачання 21-31 дні (днів)
1+1300.24 грн
25+1146.72 грн
100+1039.46 грн
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PIC32MZ1064DAL169T-V/HF PIC32MZ1064DAL169T-V/HF Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAL176-V/2J PIC32MZ1064DAL176-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL176T-V/2J PIC32MZ1064DAL176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169-V/6J PIC32MZ1064DAR169-V/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169T-V/6J PIC32MZ1064DAR169T-V/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR176-V/2J PIC32MZ1064DAR176-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAR176T-V/2J PIC32MZ1064DAR176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAS176T-V/2J PIC32MZ1064DAS176T-V/2J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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AT91SAM7X128C-CUR AT91SAM7X128C-CUR Microchip Technology Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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AT91SAM7X128C-CUR AT91SAM7X128C-CUR Microchip Technology Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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SY89250VMG-TR SY89250VMG-TR Microchip Technology sy89250v.pdf Description: IC RCVR/BUFFER PECL/ECL 8-MLF
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad, 8-MLF®
Mounting Type: Surface Mount
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-MLF® (2x2)
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
75+295.48 грн
Мінімальне замовлення: 75
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MIC6315-42D3UY-TR MIC6315-42D3UY-TR Microchip Technology MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+31.10 грн
Мінімальне замовлення: 3000
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MIC6315-42D3UY-TR MIC6315-42D3UY-TR Microchip Technology MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 6725 шт:
термін постачання 21-31 дні (днів)
8+41.12 грн
25+32.88 грн
100+29.95 грн
Мінімальне замовлення: 8
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SPNY801037 Microchip Technology Description: IC ETHERNET CONTROLLER SMD
Packaging: Tray
DigiKey Programmable: Not Verified
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SPNY801039 Microchip Technology Description: IC ETHERNET CONTROLLER SMD
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SPNY801049 Microchip Technology Description: IC ETHERNET CONTROLLER SMD
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SPNY801068 Microchip Technology Description: IC ETHERNET SWITCH SMD
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MX574EBH20M0000 Microchip Technology MX574EBH20M0000.pdf Description: OSC 20MHZ LVCMOS
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MX574EBH20M0000-TR Microchip Technology MX574EBH20M0000.pdf Description: 20MHZ LVCMOS
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MXRT100KP260CA MXRT100KP260CA Microchip Technology 77294-mrt100kp-pdf Description: TVS DIODE 260VWM 512VC CASE 5A
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ATSAMD51J20A-AU-EFP ATSAMD51J20A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
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ATSAMD51J20A-AUT-EFP ATSAMD51J20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAMD51J20A-AUT-EFP ATSAMD51J20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J20A-AU-EFP ATSAME53J20A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64TQFP
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PIC32MZ1025W104132-I/NX PIC32MZ1025W104132-I/NX Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
2+316.63 грн
Мінімальне замовлення: 2
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ATSAM4C16CA-AUR ATSAM4C16CA-AUR Microchip Technology SAM4C-Series-DS60001717.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
на замовлення 2939 шт:
термін постачання 21-31 дні (днів)
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ATSAM4CMS32CA-AUR ATSAM4CMS32CA-AUR Microchip Technology Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
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ATSAM4CMS32CA-AUR ATSAM4CMS32CA-AUR Microchip Technology Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
на замовлення 3950 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
1N5811E3 1N5811E3 Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
1+625.03 грн
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1N5811E3/TR 1N5811E3/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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1N5811USE3/TR 1N5811USE3/TR Microchip Technology Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
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JAN1N5811/TR JAN1N5811/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JAN1N5811US/TR JAN1N5811US/TR Microchip Technology Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JANHCE1N5811 Microchip Technology Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JANKCE1N5811 Microchip Technology Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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JANS1N5811/TR JANS1N5811/TR Microchip Technology 123509-lds-0168-datasheet Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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JANTXV1N6309US
Виробник: Microchip Technology
Description: DIODE ZENER 2.4V 500MW MELF
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JANS1N6310US
Виробник: Microchip Technology
Description: DIODE ZENER 2.7V 500MW MELF
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JANS1N6311 10924-lds-0193-datasheet
Виробник: Microchip Technology
Description: DIODE ZENER 3V 500MW DO35
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JANTXV1N6311 10924-lds-0193-datasheet
Виробник: Microchip Technology
Description: DIODE ZENER 3V 500MW DO35
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JANS1N6311DUS 11083-lds-0193-1.pdf
JANS1N6311DUS
Виробник: Microchip Technology
Description: DIODE ZENER 3V 500MW SQ-MELF
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 1 V
Qualification: MIL-PRF-19500/533
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JAN1N4126-1 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf
JAN1N4126-1
Виробник: Microchip Technology
Description: DIODE ZENER 51V DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 51 V
Impedance (Max) (Zzt): 300 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 38.8 V
Qualification: MIL-PRF-19500/435
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1N4448/TR
1N4448/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 75V 200MA DO35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-35
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 100
Voltage Coupled to Current - Reverse Leakage @ Vr: 20
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TC33370VAT TCSIS00089-1.pdf?t.download=true&u=5oefqw
TC33370VAT
Виробник: Microchip Technology
Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 25 W
на замовлення 1316 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
188+112.81 грн
Мінімальне замовлення: 188
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TC33371VAT TCSIS00089-1.pdf?t.download=true&u=5oefqw
TC33371VAT
Виробник: Microchip Technology
Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 30 W
на замовлення 1387 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
188+112.81 грн
Мінімальне замовлення: 188
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TC33372VAT TCSIS00089-1.pdf?t.download=true&u=5oefqw
TC33372VAT
Виробник: Microchip Technology
Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 60 W
на замовлення 1390 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
158+133.96 грн
Мінімальне замовлення: 158
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TC33373VAT TCSIS00089-1.pdf?t.download=true&u=5oefqw
TC33373VAT
Виробник: Microchip Technology
Description: IC REG LINEAR HI VOLT SWITCHING
Packaging: Bulk
Package / Case: TO-220-5
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 74%
Frequency - Switching: 100kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 10V
Supplier Device Package: TO-220-5
Fault Protection: Current Limiting, Over Temperature, UVLO
Voltage - Start Up: 8.5 V
Part Status: Active
Power (Watts): 75 W
на замовлення 1311 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
149+141.71 грн
Мінімальне замовлення: 149
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MXLSMBJ28A 10560-msmb-datasheet
MXLSMBJ28A
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MXLSMBJ28Ae3 10560-msmb-datasheet
MXLSMBJ28Ae3
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MXSMBJ28A 10560-msmb-datasheet
MXSMBJ28A
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MXSMBJ28Ae3 10560-msmb-datasheet
MXSMBJ28Ae3
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: SMBJ (DO-214AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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MASMBJ28Ae3 10560-msmb-datasheet
MASMBJ28Ae3
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.2A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-214AA (SMBJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG22CA rf01001_rev_b_final-pd-000307351.pdf
MASMCG22CA
Виробник: Microchip Technology
Description: TVS DIODE 22VWM 35.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 42.2A
Voltage - Reverse Standoff (Typ): 22V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 24.4V
Voltage - Clamping (Max) @ Ipp: 35.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N4977C 10913-sa5-37-datasheet
JAN1N4977C
Виробник: Microchip Technology
Description: DIODE ZENER 62V 5W E AXIAL
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93LC56-I/SL MCHPS00073-1.pdf?t.download=true&u=5oefqw
93LC56-I/SL
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 14-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Microwire
Access Time: 500 ns
Memory Organization: 128 x 16, 256 x 8
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK169-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK169-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK169T-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK169T-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAK176-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK176-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAK176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAK176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL169-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL169-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
на замовлення 176 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1300.24 грн
25+1146.72 грн
100+1039.46 грн
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PIC32MZ1064DAL169T-V/HF PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL169T-V/HF
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
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PIC32MZ1064DAL176-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL176-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAL176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAL176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169-V/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR169-V/6J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR169T-V/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR169T-V/6J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 640K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1064DAR176-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR176-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAR176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAR176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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PIC32MZ1064DAS176T-V/2J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1064DAS176T-V/2J
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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AT91SAM7X128C-CUR Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf
AT91SAM7X128C-CUR
Виробник: Microchip Technology
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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AT91SAM7X128C-CUR Atmel_32-bit-ARM7TDMI-Flash-Microcontroller_SAM7X512-256-128_Datasheet.pdf
AT91SAM7X128C-CUR
Виробник: Microchip Technology
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
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SY89250VMG-TR sy89250v.pdf
SY89250VMG-TR
Виробник: Microchip Technology
Description: IC RCVR/BUFFER PECL/ECL 8-MLF
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad, 8-MLF®
Mounting Type: Surface Mount
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-MLF® (2x2)
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
75+295.48 грн
Мінімальне замовлення: 75
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MIC6315-42D3UY-TR MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf
MIC6315-42D3UY-TR
Виробник: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+31.10 грн
Мінімальне замовлення: 3000
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MIC6315-42D3UY-TR MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf
MIC6315-42D3UY-TR
Виробник: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 4.2V
Supplier Device Package: SOT-143
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 6725 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+41.12 грн
25+32.88 грн
100+29.95 грн
Мінімальне замовлення: 8
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SPNY801037
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
Packaging: Tray
DigiKey Programmable: Not Verified
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SPNY801039
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
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SPNY801049
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
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SPNY801068
Виробник: Microchip Technology
Description: IC ETHERNET SWITCH SMD
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MX574EBH20M0000 MX574EBH20M0000.pdf
Виробник: Microchip Technology
Description: OSC 20MHZ LVCMOS
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MX574EBH20M0000-TR MX574EBH20M0000.pdf
Виробник: Microchip Technology
Description: 20MHZ LVCMOS
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MXRT100KP260CA 77294-mrt100kp-pdf
MXRT100KP260CA
Виробник: Microchip Technology
Description: TVS DIODE 260VWM 512VC CASE 5A
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ATSAMD51J20A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J20A-AU-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
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ATSAMD51J20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAMD51J20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J20A-AUT-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J20A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-AU-EFP
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
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PIC32MZ1025W104132-I/NX PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
PIC32MZ1025W104132-I/NX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+316.63 грн
Мінімальне замовлення: 2
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ATSAM4C16CA-AUR SAM4C-Series-DS60001717.pdf
ATSAM4C16CA-AUR
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
на замовлення 2939 шт:
термін постачання 21-31 дні (днів)
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ATSAM4CMS32CA-AUR Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf
ATSAM4CMS32CA-AUR
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
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ATSAM4CMS32CA-AUR Atmel-11203-32-bit-Cortex-M4-Microcontroller-SAM4CM32-SAM4CM16-SAM4CM8-SAM4CM4.pdf
ATSAM4CMS32CA-AUR
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
на замовлення 3950 шт:
термін постачання 21-31 дні (днів)
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1N5811E3 123509-lds-0168-datasheet
1N5811E3
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+625.03 грн
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1N5811E3/TR 123509-lds-0168-datasheet
1N5811E3/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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1N5811USE3/TR
1N5811USE3/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
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JAN1N5811/TR 123509-lds-0168-datasheet
JAN1N5811/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JAN1N5811US/TR
JAN1N5811US/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JANHCE1N5811
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JANKCE1N5811
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
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JANS1N5811/TR 123509-lds-0168-datasheet
JANS1N5811/TR
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Qualification: MIL-PRF-19500/477
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