Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (276206) > Сторінка 1830 з 4604
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AVR16EB32T-E/RXB | Microchip Technology |
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT ADPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: AVR Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, IrDA, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Number of I/O: 27 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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AVR16EB32T-E/RXB | Microchip Technology |
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT ADPackaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: AVR Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, IrDA, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Number of I/O: 27 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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LXS201-23-1 | Microchip Technology |
Description: DIODE SCHOTTKY NON HERMETIC SMT Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: Schottky - Single Operating Temperature: -55°C ~ 125°C Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz Voltage - Peak Reverse (Max): 3V Supplier Device Package: SOT-23-3 Current - Max: 1 A Power Dissipation (Max): 250 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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LXS201-23-1/TR | Microchip Technology |
Description: DIODE SCHOTTKY NON HERMETIC SMT Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: Schottky - Single Operating Temperature: -55°C ~ 125°C Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz Voltage - Peak Reverse (Max): 3V Supplier Device Package: SOT-23-3 Current - Max: 1 A Power Dissipation (Max): 250 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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JANKCA2N3636 | Microchip Technology |
Description: TRANS PNP 175V 1A TO39Packaging: Tape & Reel (TR) Package / Case: TO-205AD, TO-39-3 Metal Can Mounting Type: Through Hole Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA Current - Collector Cutoff (Max): 10µA DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V Supplier Device Package: TO-39 (TO-205AD) Grade: Military Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 175 V Power - Max: 1 W Qualification: MIL-PRF-19500/357 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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JANKCA2N3634 | Microchip Technology |
Description: TRANS PNP 140V 1A TO39Packaging: Tape & Reel (TR) Package / Case: TO-205AD, TO-39-3 Metal Can Mounting Type: Through Hole Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA Current - Collector Cutoff (Max): 10µA DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V Supplier Device Package: TO-39 (TO-205AD) Grade: Military Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 140 V Power - Max: 1 W Qualification: MIL-PRF-19500/357 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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JANKCA2N3635 | Microchip Technology |
Description: TRANS PNP 140V 1A TO39Packaging: Tape & Reel (TR) Package / Case: TO-205AD, TO-39-3 Metal Can Mounting Type: Through Hole Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA Current - Collector Cutoff (Max): 10µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V Supplier Device Package: TO-39 (TO-205AD) Grade: Military Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 140 V Power - Max: 1 W Qualification: MIL-PRF-19500/357 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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UZ5114HR2 | Microchip Technology |
Description: VOLTAGE REGULATOR Tolerance: ±5% Packaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 140 V Impedance (Max) (Zzt): 230 Ohms Supplier Device Package: B, Axial Power - Max: 5 W Current - Reverse Leakage @ Vr: 5 µA @ 106 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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PIC32CK1025GC01064-I/3ZB | Microchip Technology |
Description: M33 1MB/256 64 TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 50 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| PIC32CK2051GC01064-I/3ZB | Microchip Technology |
Description: M33 2MB/512 64 TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 50 |
на замовлення 144 шт: термін постачання 21-31 дні (днів) |
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PIC32CK1025GC01100-I/4SB | Microchip Technology |
Description: M33 1MB/256 100 TQFPPackaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 72 |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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| PIC32CK2051GC01100-I/4SB | Microchip Technology |
Description: M33 2MB/512 100 TQFPPackaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 72 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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PIC32CK2051GC01064-I/3ZB-SL3 | Microchip Technology |
Description: M33 2MB/512 64 TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 50 |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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PIC32CK2051GC01100-I/4SB-SL3 | Microchip Technology |
Description: M33 2MB/512 100 TQFPPackaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 72 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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PIC32CK1025GC01144-I/4KB | Microchip Technology |
Description: M33 1MB/256 144 TQFPPackaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 144-TQFP (16x16) Number of I/O: 108 |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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| PIC32CK2051GC01144-I/4KB | Microchip Technology |
Description: M33 2MB/512 144 TQFPPackaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 144-TQFP (16x16) Number of I/O: 108 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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PIC32CK2051GC01144-I/4KB-SL3 | Microchip Technology |
Description: M33 2MB/512 144 TQFPPackaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 144-TQFP (16x16) Number of I/O: 108 |
на замовлення 87 шт: термін постачання 21-31 дні (днів) |
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EV44P93A | Microchip Technology |
Description: PIC32CK GC01 CURIOSITY ULTRAPackaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: PIC32 Utilized IC / Part: PIC32CK GC01 Platform: Curiosity Ultra |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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| CEC1736-S0-I/2ZW-PROTO2 | Microchip Technology |
Description: 2-CHANNEL PFR WITH 4MB FLASH ANDPackaging: Tray Package / Case: 84-WFBGA Mounting Type: Surface Mount RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.465V Controller Series: CEC173X Program Memory Type: OTP (1kB) Core Processor: ARM® Cortex®-M4F Supplier Device Package: 84-WFBGA (7x7) Number of I/O: 71 |
на замовлення 532 шт: термін постачання 21-31 дні (днів) |
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EEC1727-I/2GW | Microchip Technology |
Description: EMBEDDED CONTROLLER, 416KB SRAM,Packaging: Tray Package / Case: 68-WFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 416K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.135V ~ 3.465V Controller Series: EEC1727 Program Memory Type: OTP (512B) Applications: Embedded Controller Core Processor: ARM® Cortex®-M4F Supplier Device Package: 68-WFBGA (6x6) Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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EEC1727-I/2GW-TR | Microchip Technology |
Description: EMBEDDED CONTROLLER, 416KB SRAM,Packaging: Tape & Reel (TR) Package / Case: 68-WFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 416K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.135V ~ 3.465V Controller Series: EEC1727 Program Memory Type: OTP (512B) Applications: Embedded Controller Core Processor: ARM® Cortex®-M4F Supplier Device Package: 68-WFBGA (6x6) Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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EEC1727-I/2GW-TR | Microchip Technology |
Description: EMBEDDED CONTROLLER, 416KB SRAM,Packaging: Cut Tape (CT) Package / Case: 68-WFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 416K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.135V ~ 3.465V Controller Series: EEC1727 Program Memory Type: OTP (512B) Applications: Embedded Controller Core Processor: ARM® Cortex®-M4F Supplier Device Package: 68-WFBGA (6x6) Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| CEC1736-S0-I/2HW-PROTO2 | Microchip Technology |
Description: MICROCONTROLLERPackaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.465V Controller Series: CEC173X Program Memory Type: OTP (1kB) Applications: Real Time Platform Root Core Processor: ARM® Cortex®-M4F Supplier Device Package: 64-VFBGA (5.5x5.5) Number of I/O: 52 |
на замовлення 358 шт: термін постачання 21-31 дні (днів) |
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DSPIC33AK512MPS506-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 23x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Grade: Automotive Number of I/O: 45 Qualification: AEC-Q100 |
на замовлення 393 шт: термін постачання 21-31 дні (днів) |
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| DSPIC33AK256MPS505T-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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DSPIC33AK256MPS505-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
на замовлення 302 шт: термін постачання 21-31 дні (днів) |
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| DSPIC33AK256MPS506-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS506T-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS506-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS505-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS505-E/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS508-E/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS505-E/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS508T-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS508-E/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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DSPIC33AK512MPS505-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
на замовлення 555 шт: термін постачання 21-31 дні (днів) |
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| DSPIC33AK256MPS505-E/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS508-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS506-E/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS508T-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS505T-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS506-E/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS506-E/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS505T-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS506-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS505T-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS506-E/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS508-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS505-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS505-E/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS506T-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK256MPS506T-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| DSPIC33AK512MPS506T-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
|
MPF200TLS-FCSG325I | Microchip Technology |
Description: IC FPGA 170 I/O 325FPGAPackaging: Tray Package / Case: 325-LFBGA, FC Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.08V Number of Logic Elements/Cells: 192000 Supplier Device Package: 325-FCBGA (11x14.5) Total RAM Bits: 13619200 Number of I/O: 170 DigiKey Programmable: Not Verified |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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|
M2GL050-FCSG325 | Microchip Technology |
Description: IC FPGA 200 I/O 324CSBGAPackaging: Tray Package / Case: 325-TFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 2.625V Number of Logic Elements/Cells: 56340 Supplier Device Package: 325-FCBGA (11x11) Total RAM Bits: 1869824 Number of I/O: 200 DigiKey Programmable: Not Verified |
на замовлення 176 шт: термін постачання 21-31 дні (днів) |
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|
LM2576WU | Microchip Technology |
Description: IC REG BUCK ADJ 3A TO263-5Packaging: Tube Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 3A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 52kHz Voltage - Input (Max): 40V Topology: Buck Supplier Device Package: TO-263-5 Synchronous Rectifier: No Voltage - Output (Max): 37V Voltage - Input (Min): 4V Voltage - Output (Min/Fixed): 1.23V |
на замовлення 535 шт: термін постачання 21-31 дні (днів) |
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|
MP6KE20A | Microchip Technology |
Description: TVS DIODE 17.1VWM 27.7VC T18Packaging: Bulk Package / Case: T-18, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 22A Voltage - Reverse Standoff (Typ): 17.1V Supplier Device Package: T-18 Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 27.7V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| 2N5386 | Microchip Technology |
Description: TRANS PNP 80V 12A TO-61 Packaging: Bulk Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud Mounting Type: Stud Mount Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Supplier Device Package: TO-61 Current - Collector (Ic) (Max): 12 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 50 W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| JANTX1N6148A | Microchip Technology |
Description: TVS DIODE 13.7VWM 25.1VC C AXIALPackaging: Bulk Package / Case: G, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 59.8A Voltage - Reverse Standoff (Typ): 13.7V Supplier Device Package: C, Axial Bidirectional Channels: 1 Voltage - Breakdown (Min): 17.1V Voltage - Clamping (Max) @ Ipp: 25.1V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/516 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
|
DSC1103CE2-200.0000T | Microchip Technology |
Description: MEMS OSC XO 200.0000MHZ LVDS SMDPackaging: Strip Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVDS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 200 MHz Base Resonator: MEMS |
товару немає в наявності |
В кошику од. на суму грн. |
| AVR16EB32T-E/RXB |
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Виробник: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
товару немає в наявності
В кошику
од. на суму грн.
| AVR16EB32T-E/RXB |
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Виробник: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
товару немає в наявності
В кошику
од. на суму грн.
| LXS201-23-1 |
Виробник: Microchip Technology
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
товару немає в наявності
В кошику
од. на суму грн.
| LXS201-23-1/TR |
Виробник: Microchip Technology
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
товару немає в наявності
В кошику
од. на суму грн.
| JANKCA2N3636 |
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Виробник: Microchip Technology
Description: TRANS PNP 175V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 175 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Description: TRANS PNP 175V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 175 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
товару немає в наявності
В кошику
од. на суму грн.
| JANKCA2N3634 |
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Виробник: Microchip Technology
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
товару немає в наявності
В кошику
од. на суму грн.
| JANKCA2N3635 |
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Виробник: Microchip Technology
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
товару немає в наявності
В кошику
од. на суму грн.
| UZ5114HR2 |
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
товару немає в наявності
В кошику
од. на суму грн.
| PIC32CK1025GC01064-I/3ZB |
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Виробник: Microchip Technology
Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
товару немає в наявності
В кошику
од. на суму грн.
| PIC32CK2051GC01064-I/3ZB |
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Виробник: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
на замовлення 144 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 373.89 грн |
| 25+ | 326.94 грн |
| 100+ | 296.90 грн |
| PIC32CK1025GC01100-I/4SB |
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Виробник: Microchip Technology
Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
на замовлення 260 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 251.34 грн |
| PIC32CK2051GC01100-I/4SB |
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Виробник: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 403.55 грн |
| 25+ | 352.71 грн |
| PIC32CK2051GC01064-I/3ZB-SL3 |
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Виробник: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 333.30 грн |
| 25+ | 291.67 грн |
| 100+ | 265.15 грн |
| PIC32CK2051GC01100-I/4SB-SL3 |
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Виробник: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 366.87 грн |
| 25+ | 320.33 грн |
| PIC32CK1025GC01144-I/4KB |
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Виробник: Microchip Technology
Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
на замовлення 53 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 322.37 грн |
| PIC32CK2051GC01144-I/4KB |
![]() |
Виробник: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 492.54 грн |
| 25+ | 430.70 грн |
| PIC32CK2051GC01144-I/4KB-SL3 |
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Виробник: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
на замовлення 87 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 465.22 грн |
| 25+ | 407.04 грн |
| EV44P93A |
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Виробник: Microchip Technology
Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8388.75 грн |
| CEC1736-S0-I/2ZW-PROTO2 |
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Виробник: Microchip Technology
Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
на замовлення 532 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 949.95 грн |
| 25+ | 762.63 грн |
| 100+ | 735.99 грн |
| EEC1727-I/2GW |
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Виробник: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tray
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tray
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 577.62 грн |
| 25+ | 463.65 грн |
| 100+ | 448.55 грн |
| EEC1727-I/2GW-TR |
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Виробник: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tape & Reel (TR)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tape & Reel (TR)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 473.91 грн |
| EEC1727-I/2GW-TR |
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Виробник: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Cut Tape (CT)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Cut Tape (CT)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 588.55 грн |
| 25+ | 471.98 грн |
| 100+ | 456.36 грн |
| CEC1736-S0-I/2HW-PROTO2 |
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Виробник: Microchip Technology
Description: MICROCONTROLLER
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
Description: MICROCONTROLLER
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
на замовлення 358 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 825.06 грн |
| 25+ | 661.46 грн |
| 100+ | 639.42 грн |
| DSPIC33AK512MPS506-I/PT |
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Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 23x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 45
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 23x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 45
Qualification: AEC-Q100
на замовлення 393 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 216.22 грн |
| 25+ | 189.57 грн |
| 100+ | 172.04 грн |
| DSPIC33AK256MPS505T-I/M7 |
Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| DSPIC33AK256MPS505-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
на замовлення 302 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 206.85 грн |
| 25+ | 181.12 грн |
| 100+ | 164.90 грн |
| DSPIC33AK512MPS506T-I/M7 |
Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| DSPIC33AK256MPS508T-I/PT |
Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
товару немає в наявності
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од. на суму грн.
| DSPIC33AK512MPS505-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
на замовлення 555 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 211.53 грн |
| 25+ | 185.03 грн |
| 100+ | 168.79 грн |
| DSPIC33AK512MPS508T-I/PT |
Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| DSPIC33AK512MPS505T-I/PT |
Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| DSPIC33AK256MPS505T-I/PT |
Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| DSPIC33AK512MPS505T-I/M7 |
Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| DSPIC33AK256MPS506T-I/M7 |
Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| DSPIC33AK256MPS506T-I/PT |
Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| DSPIC33AK512MPS506T-I/PT |
Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
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| MPF200TLS-FCSG325I |
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Виробник: Microchip Technology
Description: IC FPGA 170 I/O 325FPGA
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 192000
Supplier Device Package: 325-FCBGA (11x14.5)
Total RAM Bits: 13619200
Number of I/O: 170
DigiKey Programmable: Not Verified
Description: IC FPGA 170 I/O 325FPGA
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 192000
Supplier Device Package: 325-FCBGA (11x14.5)
Total RAM Bits: 13619200
Number of I/O: 170
DigiKey Programmable: Not Verified
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 43853.81 грн |
| M2GL050-FCSG325 |
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Виробник: Microchip Technology
Description: IC FPGA 200 I/O 324CSBGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56340
Supplier Device Package: 325-FCBGA (11x11)
Total RAM Bits: 1869824
Number of I/O: 200
DigiKey Programmable: Not Verified
Description: IC FPGA 200 I/O 324CSBGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56340
Supplier Device Package: 325-FCBGA (11x11)
Total RAM Bits: 1869824
Number of I/O: 200
DigiKey Programmable: Not Verified
на замовлення 176 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5865.18 грн |
| 25+ | 5272.18 грн |
| 100+ | 5135.12 грн |
| LM2576WU |
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Виробник: Microchip Technology
Description: IC REG BUCK ADJ 3A TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
Description: IC REG BUCK ADJ 3A TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
на замовлення 535 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 118.65 грн |
| 25+ | 95.19 грн |
| 100+ | 86.25 грн |
| MP6KE20A |
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Виробник: Microchip Technology
Description: TVS DIODE 17.1VWM 27.7VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 22A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 17.1VWM 27.7VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 22A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| 2N5386 |
Виробник: Microchip Technology
Description: TRANS PNP 80V 12A TO-61
Packaging: Bulk
Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-61
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 50 W
Description: TRANS PNP 80V 12A TO-61
Packaging: Bulk
Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-61
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 50 W
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| JANTX1N6148A |
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Виробник: Microchip Technology
Description: TVS DIODE 13.7VWM 25.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.8A
Voltage - Reverse Standoff (Typ): 13.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Description: TVS DIODE 13.7VWM 25.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.8A
Voltage - Reverse Standoff (Typ): 13.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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| DSC1103CE2-200.0000T |
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Виробник: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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