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TX-7090-EAE-106C-100M000000 Microchip Technology TX-709.pdf Description: XTAL OSC TCXO 100.0000MHZ HCMOS
Packaging: Strip
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: HCMOS
Function: Low-G Sensitivity
Type: TCXO
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±1ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.120" (3.05mm)
Frequency: 100 MHz
Base Resonator: Crystal
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DSA6151JL1B-025.0000VAO DSA6151JL1B-025.0000VAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSA6151JL1B-016.0000VAO DSA6151JL1B-016.0000VAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA6151JL1B-016.0000TVAO DSA6151JL1B-016.0000TVAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA6151JL1B-011.2896TVAO DSA6151JL1B-011.2896TVAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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DSA6151JL1B-027.0000TVAO DSA6151JL1B-027.0000TVAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSA6151JL1B-011.2896VAO DSA6151JL1B-011.2896VAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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DSA6151JL1B-025.0000TVAO DSA6151JL1B-025.0000TVAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSA6151JL1B-027.0000VAO DSA6151JL1B-027.0000VAO Microchip Technology DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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ATSAMA5D28C-D1G-CUR ATSAMA5D28C-D1G-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: BGA GREEN, IND TEMP,MRLC,1GBIT D
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 1.8V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + HSIC (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: AES, ARM TZ, Cryptography, Secure Fusebox, Secure JTAG, Secure RTC, SHA, TRNG
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SMC, SPI, UART/USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+1974.61 грн
Мінімальне замовлення: 1000
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ATSAMA5D28C-D1G-CUR ATSAMA5D28C-D1G-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: BGA GREEN, IND TEMP,MRLC,1GBIT D
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 1.8V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + HSIC (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: AES, ARM TZ, Cryptography, Secure Fusebox, Secure JTAG, Secure RTC, SHA, TRNG
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SMC, SPI, UART/USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+2453.48 грн
25+1968.62 грн
100+1901.48 грн
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ATSAMA5D28C-LD1G-CUR ATSAMA5D28C-LD1G-CUR Microchip Technology SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf Description: IC MPU SAMA5D2 500MHZ 289LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+1341.25 грн
Мінімальне замовлення: 1000
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ATSAMA5D28C-LD1G-CUR ATSAMA5D28C-LD1G-CUR Microchip Technology SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf Description: IC MPU SAMA5D2 500MHZ 289LFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+1666.43 грн
25+1336.83 грн
100+1291.57 грн
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2N2920A Microchip Technology 2N2920(A).pdf Description: DUAL SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-78-6 Metal Can
Mounting Type: Through Hole
Transistor Type: 2 NPN (Dual)
Operating Temperature: -65°C ~ 200°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 60V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Supplier Device Package: TO-78-6
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2N2920 2N2920 Microchip Technology 2N2920(A).pdf Description: TRANS 2NPN 60V 0.03A TO-78
Packaging: Bulk
Package / Case: TO-78-6 Metal Can
Mounting Type: Through Hole
Transistor Type: 2 NPN (Dual)
Operating Temperature: 200°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 60V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Supplier Device Package: TO-78-6
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ATMEGA406-1AAU ATMEGA406-1AAU Microchip Technology Atmel-2548-8-bit-AVR-Microcontroller-Battery-Management-ATmega406_Datasheet-Summary.pdf description Description: IC MCU 8BIT 40KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 1MHz
Program Memory Size: 40KB (20K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 25V
Connectivity: I2C
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 18
DigiKey Programmable: Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+623.91 грн
25+550.63 грн
100+498.46 грн
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VVC1-F2F-16M0000000 Microchip Technology vvc1.pdf Description: VVC1-F2F-16M0000000
Packaging: Tape & Reel (TR)
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2N2907 2N2907 Microchip Technology 8896-lds-0059-pdf.pdf Description: TRANS PNP 60V 0.6A TO-18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
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JANTX1N6326 JANTX1N6326 Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 12V 500MW DO35
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
Qualification: MIL-PRF-19500/533
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
1+946.22 грн
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1N3291A Microchip Technology 8551-coe-47-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 150A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 200 µA @ 400 V
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1N3291AR Microchip Technology 8551-coe-47-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 150A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
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AT93C46A-10TU-2.7-T AT93C46A-10TU-2.7-T Microchip Technology AT93C46A.pdf Description: IC EEPROM 1KBIT 3-WIRE 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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MXLPLAD6.5KP43Ae3 MXLPLAD6.5KP43Ae3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1001BE1-016.0000T DSC1001BE1-016.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Supplier Device Package: 4-CDFN (5x3.2)
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DSC1001BE1-012.0000T DSC1001BE1-012.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC1001BE1-014.7456T DSC1001BE1-014.7456T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
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DSC1001BE1-014.3182T DSC1001BE1-014.3182T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.3182MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.3182 MHz
Base Resonator: MEMS
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DSC1101BE1-012.0000T DSC1101BE1-012.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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PIC16F15255T-I/SO PIC16F15255T-I/SO Microchip Technology PIC16F15254-55-28-Pin-Microcontroller-Data-Sheet.pdf Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
1600+65.89 грн
Мінімальне замовлення: 1600
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PIC16F15255T-I/SO PIC16F15255T-I/SO Microchip Technology PIC16F15254-55-28-Pin-Microcontroller-Data-Sheet.pdf Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
5+78.79 грн
25+69.80 грн
100+63.45 грн
Мінімальне замовлення: 5
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PIC16F15255T-I/SS PIC16F15255T-I/SS Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F15255T-I/SS PIC16F15255T-I/SS Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
на замовлення 1092 шт:
термін постачання 21-31 дні (днів)
5+75.60 грн
25+66.27 грн
100+59.93 грн
Мінімальне замовлення: 5
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PIC16F15255-E/STX PIC16F15255-E/STX Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 14KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
на замовлення 728 шт:
термін постачання 21-31 дні (днів)
5+76.40 грн
25+67.68 грн
100+61.34 грн
Мінімальне замовлення: 5
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PIC16F15255-E/SS PIC16F15255-E/SS Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
на замовлення 705 шт:
термін постачання 21-31 дні (днів)
4+80.38 грн
25+71.21 грн
100+64.16 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F15255-E/SO PIC16F15255-E/SO Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
на замовлення 648 шт:
термін постачання 21-31 дні (днів)
4+85.95 грн
25+75.44 грн
100+68.39 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F15255-E/SP PIC16F15255-E/SP Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 14KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
на замовлення 349 шт:
термін постачання 21-31 дні (днів)
2+159.96 грн
25+141.01 грн
100+127.61 грн
Мінімальне замовлення: 2
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PIC18LF14K22-I/ML PIC18LF14K22-I/ML Microchip Technology 40001365F.pdf Description: IC MCU 8BIT 16KB FLASH 20QFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 1887 шт:
термін постачання 21-31 дні (днів)
2+175.08 грн
25+154.80 грн
100+140.12 грн
Мінімальне замовлення: 2
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MX1N8182US/TR MX1N8182US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
100+2184.70 грн
Мінімальне замовлення: 100
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MX1N8182US/TR MX1N8182US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
1+2352.41 грн
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1N8182USE3/TR 1N8182USE3/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8182USE3/TR 1N8182USE3/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MV1N8182US/TR MV1N8182US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MV1N8182US/TR MV1N8182US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MS1N8182US/TR MS1N8182US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MS1N8182US/TR MS1N8182US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8170US/TR 1N8170US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.76A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85.3V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8170US/TR 1N8170US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.76A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85.3V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8171US/TR 1N8171US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.6A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 93.7V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8171US/TR 1N8171US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.6A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 93.7V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8174US/TR 1N8174US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.2A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 86.5V
Voltage - Clamping (Max) @ Ipp: 125V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8174US/TR 1N8174US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.2A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 86.5V
Voltage - Clamping (Max) @ Ipp: 125V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8175US/TR 1N8175US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.09A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8175US/TR 1N8175US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.09A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8173US/TR 1N8173US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.32A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8173US/TR 1N8173US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.32A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8177US/TR 1N8177US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 890mA
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 114V
Voltage - Clamping (Max) @ Ipp: 168V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8177US/TR 1N8177US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 890mA
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 114V
Voltage - Clamping (Max) @ Ipp: 168V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8172US/TR 1N8172US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.45A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8172US/TR 1N8172US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.45A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8179US/TR 1N8179US/TR Microchip Technology 1N8149-1N8182.pdf Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 720mA
Voltage - Reverse Standoff (Typ): 120V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 138V
Voltage - Clamping (Max) @ Ipp: 208V
Power - Peak Pulse: 150W
Power Line Protection: No
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TX-7090-EAE-106C-100M000000 TX-709.pdf
Виробник: Microchip Technology
Description: XTAL OSC TCXO 100.0000MHZ HCMOS
Packaging: Strip
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: HCMOS
Function: Low-G Sensitivity
Type: TCXO
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±1ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.120" (3.05mm)
Frequency: 100 MHz
Base Resonator: Crystal
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DSA6151JL1B-025.0000VAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-025.0000VAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSA6151JL1B-016.0000VAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-016.0000VAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA6151JL1B-016.0000TVAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-016.0000TVAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA6151JL1B-011.2896TVAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-011.2896TVAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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DSA6151JL1B-027.0000TVAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-027.0000TVAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSA6151JL1B-011.2896VAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-011.2896VAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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DSA6151JL1B-025.0000TVAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-025.0000TVAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSA6151JL1B-027.0000VAO DSA61xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006222.pdf
DSA6151JL1B-027.0000VAO
Виробник: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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ATSAMA5D28C-D1G-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D28C-D1G-CUR
Виробник: Microchip Technology
Description: BGA GREEN, IND TEMP,MRLC,1GBIT D
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 1.8V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + HSIC (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: AES, ARM TZ, Cryptography, Secure Fusebox, Secure JTAG, Secure RTC, SHA, TRNG
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SMC, SPI, UART/USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+1974.61 грн
Мінімальне замовлення: 1000
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ATSAMA5D28C-D1G-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D28C-D1G-CUR
Виробник: Microchip Technology
Description: BGA GREEN, IND TEMP,MRLC,1GBIT D
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 1.8V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + HSIC (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: AES, ARM TZ, Cryptography, Secure Fusebox, Secure JTAG, Secure RTC, SHA, TRNG
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SMC, SPI, UART/USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2453.48 грн
25+1968.62 грн
100+1901.48 грн
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ATSAMA5D28C-LD1G-CUR SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf
ATSAMA5D28C-LD1G-CUR
Виробник: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+1341.25 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
ATSAMA5D28C-LD1G-CUR SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf
ATSAMA5D28C-LD1G-CUR
Виробник: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289LFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1666.43 грн
25+1336.83 грн
100+1291.57 грн
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2N2920A 2N2920(A).pdf
Виробник: Microchip Technology
Description: DUAL SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-78-6 Metal Can
Mounting Type: Through Hole
Transistor Type: 2 NPN (Dual)
Operating Temperature: -65°C ~ 200°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 60V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Supplier Device Package: TO-78-6
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2N2920 2N2920(A).pdf
2N2920
Виробник: Microchip Technology
Description: TRANS 2NPN 60V 0.03A TO-78
Packaging: Bulk
Package / Case: TO-78-6 Metal Can
Mounting Type: Through Hole
Transistor Type: 2 NPN (Dual)
Operating Temperature: 200°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 60V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Supplier Device Package: TO-78-6
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ATMEGA406-1AAU description Atmel-2548-8-bit-AVR-Microcontroller-Battery-Management-ATmega406_Datasheet-Summary.pdf
ATMEGA406-1AAU
Виробник: Microchip Technology
Description: IC MCU 8BIT 40KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 1MHz
Program Memory Size: 40KB (20K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 25V
Connectivity: I2C
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 18
DigiKey Programmable: Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+623.91 грн
25+550.63 грн
100+498.46 грн
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VVC1-F2F-16M0000000 vvc1.pdf
Виробник: Microchip Technology
Description: VVC1-F2F-16M0000000
Packaging: Tape & Reel (TR)
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2N2907 8896-lds-0059-pdf.pdf
2N2907
Виробник: Microchip Technology
Description: TRANS PNP 60V 0.6A TO-18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
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JANTX1N6326 10924-lds-0193-datasheet
JANTX1N6326
Виробник: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
Qualification: MIL-PRF-19500/533
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+946.22 грн
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1N3291A 8551-coe-47-datasheet
Виробник: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 150A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 200 µA @ 400 V
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1N3291AR 8551-coe-47-datasheet
Виробник: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 150A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
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AT93C46A-10TU-2.7-T AT93C46A.pdf
AT93C46A-10TU-2.7-T
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT 3-WIRE 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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MXLPLAD6.5KP43Ae3 129479-rf01083-datasheet
MXLPLAD6.5KP43Ae3
Виробник: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1001BE1-016.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE1-016.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Supplier Device Package: 4-CDFN (5x3.2)
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DSC1001BE1-012.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE1-012.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC1001BE1-014.7456T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE1-014.7456T
Виробник: Microchip Technology
Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
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DSC1001BE1-014.3182T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE1-014.3182T
Виробник: Microchip Technology
Description: MEMS OSC XO 14.3182MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.3182 MHz
Base Resonator: MEMS
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DSC1101BE1-012.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101BE1-012.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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PIC16F15255T-I/SO PIC16F15254-55-28-Pin-Microcontroller-Data-Sheet.pdf
PIC16F15255T-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1600+65.89 грн
Мінімальне замовлення: 1600
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PIC16F15255T-I/SO PIC16F15254-55-28-Pin-Microcontroller-Data-Sheet.pdf
PIC16F15255T-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+78.79 грн
25+69.80 грн
100+63.45 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16F15255T-I/SS PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15255T-I/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F15255T-I/SS PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15255T-I/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
на замовлення 1092 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+75.60 грн
25+66.27 грн
100+59.93 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16F15255-E/STX PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15255-E/STX
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
на замовлення 728 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+76.40 грн
25+67.68 грн
100+61.34 грн
Мінімальне замовлення: 5
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PIC16F15255-E/SS PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15255-E/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
на замовлення 705 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+80.38 грн
25+71.21 грн
100+64.16 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F15255-E/SO PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15255-E/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
на замовлення 648 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+85.95 грн
25+75.44 грн
100+68.39 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F15255-E/SP PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15255-E/SP
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
на замовлення 349 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+159.96 грн
25+141.01 грн
100+127.61 грн
Мінімальне замовлення: 2
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PIC18LF14K22-I/ML 40001365F.pdf
PIC18LF14K22-I/ML
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 20QFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 1887 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+175.08 грн
25+154.80 грн
100+140.12 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MX1N8182US/TR 1N8149-1N8182.pdf
MX1N8182US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
100+2184.70 грн
Мінімальне замовлення: 100
В кошику  од. на суму  грн.
MX1N8182US/TR 1N8149-1N8182.pdf
MX1N8182US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2352.41 грн
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1N8182USE3/TR 1N8149-1N8182.pdf
1N8182USE3/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8182USE3/TR 1N8149-1N8182.pdf
1N8182USE3/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MV1N8182US/TR 1N8149-1N8182.pdf
MV1N8182US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MV1N8182US/TR 1N8149-1N8182.pdf
MV1N8182US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MS1N8182US/TR 1N8149-1N8182.pdf
MS1N8182US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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MS1N8182US/TR 1N8149-1N8182.pdf
MS1N8182US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 510mA
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 294V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8170US/TR 1N8149-1N8182.pdf
1N8170US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.76A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85.3V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8170US/TR 1N8149-1N8182.pdf
1N8170US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.76A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85.3V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8171US/TR 1N8149-1N8182.pdf
1N8171US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.6A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 93.7V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8171US/TR 1N8149-1N8182.pdf
1N8171US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.6A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 93.7V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
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1N8174US/TR 1N8149-1N8182.pdf
1N8174US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.2A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 86.5V
Voltage - Clamping (Max) @ Ipp: 125V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8174US/TR 1N8149-1N8182.pdf
1N8174US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.2A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 86.5V
Voltage - Clamping (Max) @ Ipp: 125V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
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1N8175US/TR 1N8149-1N8182.pdf
1N8175US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.09A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 150W
Power Line Protection: No
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1N8175US/TR 1N8149-1N8182.pdf
1N8175US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.09A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
В кошику  од. на суму  грн.
1N8173US/TR 1N8149-1N8182.pdf
1N8173US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.32A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
В кошику  од. на суму  грн.
1N8173US/TR 1N8149-1N8182.pdf
1N8173US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.32A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
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1N8177US/TR 1N8149-1N8182.pdf
1N8177US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 890mA
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 114V
Voltage - Clamping (Max) @ Ipp: 168V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
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1N8177US/TR 1N8149-1N8182.pdf
1N8177US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 890mA
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 114V
Voltage - Clamping (Max) @ Ipp: 168V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
В кошику  од. на суму  грн.
1N8172US/TR 1N8149-1N8182.pdf
1N8172US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.45A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
В кошику  од. на суму  грн.
1N8172US/TR 1N8149-1N8182.pdf
1N8172US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1.45A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
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1N8179US/TR 1N8149-1N8182.pdf
1N8179US/TR
Виробник: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 720mA
Voltage - Reverse Standoff (Typ): 120V
Supplier Device Package: A, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 138V
Voltage - Clamping (Max) @ Ipp: 208V
Power - Peak Pulse: 150W
Power Line Protection: No
товару немає в наявності
В кошику  од. на суму  грн.
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