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DSC6001JI2B-007.3728 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6011JL2B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JA1B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI2B-033.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 33.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33 MHz
Base Resonator: MEMS
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DSC6001JA3B-004.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6003JI2B-004.5000 DSC6003JI2B-004.5000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6001JE1B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6001JI3B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6003JI2B-012.0000 DSC6003JI2B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001JA3B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI1B-080.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC6003JL3B-007.3728 DSC6003JL3B-007.3728 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6001MA2B-020.0000 DSC6001MA2B-020.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6013JI2B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI1B-035.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 35.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 35 MHz
Base Resonator: MEMS
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DSC6011JI1B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6003JI1B-004.5000 DSC6003JI1B-004.5000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6003JL3B-004.0960 DSC6003JL3B-004.0960 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.0960MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.096 MHz
Base Resonator: MEMS
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DSC6011JI1B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JL2B-027.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001JI3B-003K200 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 3.2000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.2 kHz
Base Resonator: MEMS
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DSC6011JE3B-003K898 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 3.8980KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.898 kHz
Base Resonator: MEMS
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DSC6011JA2B-016K384 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 16.3840KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 kHz
Base Resonator: MEMS
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DSC6001JE2B-020.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001JA3B-024.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6003JI2B-001.0000 DSC6003JI2B-001.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6003MA3B-032K768 DSC6003MA3B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6011JI2B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6003MI2B-014.0000 DSC6003MI2B-014.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 14.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14 MHz
Base Resonator: MEMS
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DSC6011JI2B-720K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 720.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 720 kHz
Base Resonator: MEMS
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DSC6011JI2B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6003JA3B-020K000 DSC6003JA3B-020K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 20.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 kHz
Base Resonator: MEMS
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ATA6574-GNQW0-VAO Microchip Technology Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6574-GNQW0-VAO Microchip Technology Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
2+176.21 грн
10+106.14 грн
25+89.61 грн
100+66.59 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ATA6574-GNQW1-VAO Microchip Technology Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6574-GNQW1-VAO Microchip Technology Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
2+176.21 грн
10+106.14 грн
25+89.61 грн
100+66.59 грн
Мінімальне замовлення: 2
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EV16R67A Microchip Technology Description: ATAB6574A - CAN PN DEV BOARD
Packaging: Bulk
Function: CANbus
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATA657x
Secondary Attributes: CAN Interface(s)
Embedded: Yes, MCU
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+7472.96 грн
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ATA6503T-4BWVAO Microchip Technology ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
6+60.55 грн
25+49.19 грн
100+44.18 грн
Мінімальне замовлення: 6
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ATA6503T-4BWVAO Microchip Technology ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
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ATA6501T-4CWVAO Microchip Technology ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-VDFN (2x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
6+58.22 грн
25+47.03 грн
100+42.76 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
ATA6501T-4CWVAO Microchip Technology ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-VDFN (2x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
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JAN1N5526B-1 JAN1N5526B-1 Microchip Technology 1N5518B_1N5546B-1.pdf Description: DIODE ZENER 6.8V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Qualification: MIL-PRF-19500/437
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BZV55C13 BZV55C13 Microchip Technology 8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 13V DO213AA
Tolerance: ±6.54%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
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SAMA7D65D2G-V/4UB-SL3 Microchip Technology SAMA7D6-Series-Data-Sheet-DS60001851.pdf Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tray
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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PL671-00DC Microchip Technology Description: IC SS CLOCK GENERATOR DIE
Packaging: Box
Package / Case: Die
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 200MHz
Type: Spread Spectrum Clock Generator
Input: Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.63V
Ratio - Input:Output: 1:3
Differential - Input:Output: No/No
Supplier Device Package: Die
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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SY10E158JC SY10E158JC Microchip Technology MCRLS02751-1.pdf?t.download=true&u=5oefqw Description: IC MULTIPLEXER 5 X 2:1 28PLCC
Packaging: Bulk
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Circuit: 5 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: -4.2V ~ -5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 28-PLCC (11.48x11.48)
на замовлення 850 шт:
термін постачання 21-31 дні (днів)
43+518.05 грн
Мінімальне замовлення: 43
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MCP2542FDT-H/SN MCP2542FDT-H/SN Microchip Technology MCP2542FD-MCP2542WFD-4WFD-Data-Sheet-DS20005514C.pdf Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 200 mV
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MCP2542FDT-H/SN MCP2542FDT-H/SN Microchip Technology MCP2542FD-MCP2542WFD-4WFD-Data-Sheet-DS20005514C.pdf Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 200 mV
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ATA6286N-PNPW 19 ATA6286N-PNPW 19 Microchip Technology Description: RF TX IC ASK/FSK 433MHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 433MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 6dBm
Applications: TPM (Tire Pressure Monitor)
Data Rate (Max): 20kbps
Current - Transmitting: 8.5mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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ATA6286N-PNPW 19 ATA6286N-PNPW 19 Microchip Technology Description: RF TX IC ASK/FSK 433MHZ 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 433MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 6dBm
Applications: TPM (Tire Pressure Monitor)
Data Rate (Max): 20kbps
Current - Transmitting: 8.5mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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CD4468 CD4468 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Supplier Device Package: Die
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ATMEGA324A-CU ATMEGA324A-CU Microchip Technology Atmel-42714-ATmega324A_Datasheet.pdf Description: IC MCU 8BIT 32KB FLASH 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-VFBGA (5x5)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA324P-15MT ATMEGA324P-15MT Microchip Technology ATmega164%2C324%2C644P%20Summary.pdf Description: IC MCU 8BIT 32KB FLASH 44VQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Grade: Automotive
Number of I/O: 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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RTPF-DEV-KIT-CG-1-ES Microchip Technology RT_PolarFire_Development_Kit_User_Guide.pdf Description: RT POLARFIRE DEV KIT CG PROTO
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: RTPF500T
Platform: Radiation-Tolerant PolarFire SoC FPGA
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RTPF-DEV-KIT-CB-1-ES Microchip Technology RT_PolarFire_Development_Kit_User_Guide.pdf Description: RT POLARFIRE DEV KIT CB PROTO
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: RTPF500T
Platform: Radiation-Tolerant PolarFire SoC FPGA
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MIC9130BM MIC9130BM Microchip Technology MCRLS03318-1.pdf?t.download=true&u=5oefqw Description: TELECOM DC-TO-DC CONTROLLER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-SOIC
на замовлення 52548 шт:
термін постачання 21-31 дні (днів)
192+112.41 грн
Мінімальне замовлення: 192
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APT100GT120JR APT100GT120JR Microchip Technology 123463-apt100gt120jr-b-pdf.pdf Description: IGBT MOD 1200V 123A 570W ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: ISOTOP®
IGBT Type: NPT
Current - Collector (Ic) (Max): 123 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 570 W
Current - Collector Cutoff (Max): 100 µA
Input Capacitance (Cies) @ Vce: 6.7 nF @ 25 V
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DSC6001JI2B-007.3728 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6011JL2B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JA1B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI2B-033.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 33.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33 MHz
Base Resonator: MEMS
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DSC6001JA3B-004.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6003JI2B-004.5000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-004.5000
Виробник: Microchip Technology
Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6001JE1B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6001JI3B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6003JI2B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-012.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001JA3B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI1B-080.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC6003JL3B-007.3728 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JL3B-007.3728
Виробник: Microchip Technology
Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6001MA2B-020.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001MA2B-020.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6013JI2B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI1B-035.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 35.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 35 MHz
Base Resonator: MEMS
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DSC6011JI1B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6003JI1B-004.5000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI1B-004.5000
Виробник: Microchip Technology
Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6003JL3B-004.0960 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JL3B-004.0960
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0960MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.096 MHz
Base Resonator: MEMS
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DSC6011JI1B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JL2B-027.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001JI3B-003K200 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 3.2000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.2 kHz
Base Resonator: MEMS
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DSC6011JE3B-003K898 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 3.8980KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.898 kHz
Base Resonator: MEMS
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DSC6011JA2B-016K384 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 16.3840KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 kHz
Base Resonator: MEMS
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DSC6001JE2B-020.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001JA3B-024.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6003JI2B-001.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-001.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6003MA3B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-032K768
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6011JI2B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6003MI2B-014.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI2B-014.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 14.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14 MHz
Base Resonator: MEMS
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DSC6011JI2B-720K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 720.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 720 kHz
Base Resonator: MEMS
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DSC6011JI2B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6003JA3B-020K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JA3B-020K000
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 kHz
Base Resonator: MEMS
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ATA6574-GNQW0-VAO
Виробник: Microchip Technology
Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6574-GNQW0-VAO
Виробник: Microchip Technology
Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+176.21 грн
10+106.14 грн
25+89.61 грн
100+66.59 грн
Мінімальне замовлення: 2
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ATA6574-GNQW1-VAO
Виробник: Microchip Technology
Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6574-GNQW1-VAO
Виробник: Microchip Technology
Description: CAN TRX 5MBit/s w WD, wake-up
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V, 4.7V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+176.21 грн
10+106.14 грн
25+89.61 грн
100+66.59 грн
Мінімальне замовлення: 2
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EV16R67A
Виробник: Microchip Technology
Description: ATAB6574A - CAN PN DEV BOARD
Packaging: Bulk
Function: CANbus
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATA657x
Secondary Attributes: CAN Interface(s)
Embedded: Yes, MCU
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7472.96 грн
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ATA6503T-4BWVAO ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf
Виробник: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+60.55 грн
25+49.19 грн
100+44.18 грн
Мінімальне замовлення: 6
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ATA6503T-4BWVAO ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf
Виробник: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
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ATA6501T-4CWVAO ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf
Виробник: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-VDFN (2x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+58.22 грн
25+47.03 грн
100+42.76 грн
Мінімальне замовлення: 6
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ATA6501T-4CWVAO ATA650x-Mini-CAN-FD-System-Basis-Chip-DS20006909.pdf
Виробник: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO, 3.3V
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-VDFN (2x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
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JAN1N5526B-1 1N5518B_1N5546B-1.pdf
JAN1N5526B-1
Виробник: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Qualification: MIL-PRF-19500/437
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BZV55C13 8298-bzv55-c2v4-c75-pdf.pdf
BZV55C13
Виробник: Microchip Technology
Description: DIODE ZENER 13V DO213AA
Tolerance: ±6.54%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
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SAMA7D65D2G-V/4UB-SL3 SAMA7D6-Series-Data-Sheet-DS60001851.pdf
Виробник: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tray
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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PL671-00DC
Виробник: Microchip Technology
Description: IC SS CLOCK GENERATOR DIE
Packaging: Box
Package / Case: Die
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 200MHz
Type: Spread Spectrum Clock Generator
Input: Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.63V
Ratio - Input:Output: 1:3
Differential - Input:Output: No/No
Supplier Device Package: Die
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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SY10E158JC MCRLS02751-1.pdf?t.download=true&u=5oefqw
SY10E158JC
Виробник: Microchip Technology
Description: IC MULTIPLEXER 5 X 2:1 28PLCC
Packaging: Bulk
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Circuit: 5 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: -4.2V ~ -5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 28-PLCC (11.48x11.48)
на замовлення 850 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
43+518.05 грн
Мінімальне замовлення: 43
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MCP2542FDT-H/SN MCP2542FD-MCP2542WFD-4WFD-Data-Sheet-DS20005514C.pdf
MCP2542FDT-H/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 200 mV
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MCP2542FDT-H/SN MCP2542FD-MCP2542WFD-4WFD-Data-Sheet-DS20005514C.pdf
MCP2542FDT-H/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 200 mV
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ATA6286N-PNPW 19
ATA6286N-PNPW 19
Виробник: Microchip Technology
Description: RF TX IC ASK/FSK 433MHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 433MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 6dBm
Applications: TPM (Tire Pressure Monitor)
Data Rate (Max): 20kbps
Current - Transmitting: 8.5mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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ATA6286N-PNPW 19
ATA6286N-PNPW 19
Виробник: Microchip Technology
Description: RF TX IC ASK/FSK 433MHZ 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 433MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 6dBm
Applications: TPM (Tire Pressure Monitor)
Data Rate (Max): 20kbps
Current - Transmitting: 8.5mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
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CD4468
CD4468
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Supplier Device Package: Die
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ATMEGA324A-CU Atmel-42714-ATmega324A_Datasheet.pdf
ATMEGA324A-CU
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-VFBGA (5x5)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA324P-15MT ATmega164%2C324%2C644P%20Summary.pdf
ATMEGA324P-15MT
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44VQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Grade: Automotive
Number of I/O: 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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RTPF-DEV-KIT-CG-1-ES RT_PolarFire_Development_Kit_User_Guide.pdf
Виробник: Microchip Technology
Description: RT POLARFIRE DEV KIT CG PROTO
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: RTPF500T
Platform: Radiation-Tolerant PolarFire SoC FPGA
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RTPF-DEV-KIT-CB-1-ES RT_PolarFire_Development_Kit_User_Guide.pdf
Виробник: Microchip Technology
Description: RT POLARFIRE DEV KIT CB PROTO
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: RTPF500T
Platform: Radiation-Tolerant PolarFire SoC FPGA
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MIC9130BM MCRLS03318-1.pdf?t.download=true&u=5oefqw
MIC9130BM
Виробник: Microchip Technology
Description: TELECOM DC-TO-DC CONTROLLER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-SOIC
на замовлення 52548 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
192+112.41 грн
Мінімальне замовлення: 192
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APT100GT120JR 123463-apt100gt120jr-b-pdf.pdf
APT100GT120JR
Виробник: Microchip Technology
Description: IGBT MOD 1200V 123A 570W ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: ISOTOP®
IGBT Type: NPT
Current - Collector (Ic) (Max): 123 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 570 W
Current - Collector Cutoff (Max): 100 µA
Input Capacitance (Cies) @ Vce: 6.7 nF @ 25 V
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