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APT68GA60LD40 APT68GA60LD40 Microchip Technology 123666-apt68ga60b2d40-apt68ga60ld40-datasheet Description: IGBT 600V 121A 520W TO-264
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APT75F50B2 APT75F50B2 Microchip Technology 7244-apt75f50b2-apt75f50l-datasheet Description: MOSFET N-CH 500V 75A T-MAX
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 37A, 10V
Power Dissipation (Max): 1040W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: T-MAX™ [B2]
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 290 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11600 pF @ 25 V
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APT75F50L APT75F50L Microchip Technology 7244-apt75f50b2-apt75f50l-datasheet Description: MOSFET N-CH 500V 75A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 37A, 10V
Power Dissipation (Max): 1040W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 290 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11600 pF @ 25 V
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APT77N60BC6 APT77N60BC6 Microchip Technology 77173-apt77n60bc6-apt77n60sc6-datasheet Description: MOSFET N-CH 600V 77A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 77A (Tc)
Rds On (Max) @ Id, Vgs: 41mOhm @ 44.4A, 10V
Power Dissipation (Max): 481W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 2.96mA
Supplier Device Package: TO-247 [B]
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13600 pF @ 25 V
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APT80F60J APT80F60J Microchip Technology 123471-apt80f60j-datasheet Description: MOSFET N-CH 600V 84A ISOTOP
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APT84F50L APT84F50L Microchip Technology 7299-apt84f50b2m-apt84f50l-datasheet Description: MOSFET N-CH 500V 84A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 42A, 10V
Power Dissipation (Max): 1135W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 340 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13500 pF @ 25 V
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USB2514B-AEZC USB2514B-AEZC Microchip Technology 00001692C.pdf Description: IC USB 2.0 4PORT HUB CTLR 36QFN
Packaging: Tray
Package / Case: 36-VFQFN Exposed Pad
Function: Hub Controller
Interface: USB
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 70mA
Protocol: USB
Supplier Device Package: 36-QFN (6x6)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 5546 шт:
термін постачання 21-31 дні (днів)
2+168.99 грн
25+135.08 грн
100+124.83 грн
Мінімальне замовлення: 2
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USB2241-AEZG-06 USB2241-AEZG-06 Microchip Technology 00001979A.pdf Description: IC CONTROLLER USB 36QFN
Packaging: Tray
Package / Case: 36-VFQFN Exposed Pad
Function: Controller
Interface: Serial
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 135mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 36-QFN (6x6)
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
2+185.48 грн
25+147.49 грн
100+133.97 грн
Мінімальне замовлення: 2
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24C00T-E/MNY 24C00T-E/MNY Microchip Technology 24AA00-24LC00-24C00-Data-Sheet-20001178J.pdf Description: IC EEPROM 128BIT I2C 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128bit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 4ms
Memory Interface: I2C
Access Time: 3.5 µs
Memory Organization: 16 x 8
DigiKey Programmable: Not Verified
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24LCS52T-I/MNY 24LCS52T-I/MNY Microchip Technology 21166K.pdf Description: IC EEPROM 2KBIT I2C 400KHZ 8TDFN
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25AA040AT-I/MNY 25AA040AT-I/MNY Microchip Technology 21827H.pdf Description: IC EEPROM 4KBIT SPI 10MHZ 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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25LC040AT-E/MNY 25LC040AT-E/MNY Microchip Technology 21827H.pdf Description: IC EEPROM 4KBIT SPI 10MHZ 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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25LC040AT-I/MNY 25LC040AT-I/MNY Microchip Technology 21827H.pdf Description: IC EEPROM 4KBIT SPI 10MHZ 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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93C46CT-E/MNY 93C46CT-E/MNY Microchip Technology 20001749K.pdf Description: IC EEPROM 1KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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93C56AT-E/MNY 93C56AT-E/MNY Microchip Technology 21794G.pdf Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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93C56BT-E/MNY 93C56BT-E/MNY Microchip Technology filehandler.aspx?ddocname=en013939 Description: IC EEPROM 2K SPI 2MHZ 8TDFN
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93C56CT-E/MNY 93C56CT-E/MNY Microchip Technology 21794G.pdf Description: IC EEPROM 2KBIT SPI 3MHZ 8TDFN
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93C66AT-E/MNY 93C66AT-E/MNY Microchip Technology 21795E.pdf Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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93C66BT-E/MNY 93C66BT-E/MNY Microchip Technology 21795E.pdf Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 256 x 16
DigiKey Programmable: Not Verified
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93C66CT-E/MNY 93C66CT-E/MNY Microchip Technology filehandler.aspx?ddocname=en011819 Description: IC EEPROM 4KBIT 3MHZ 8TDFN
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93C76CT-E/MNY 93C76CT-E/MNY Microchip Technology 21796M.pdf Description: IC EEPROM 8KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 1K x 8, 512 x 16
DigiKey Programmable: Not Verified
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93C86CT-E/MNY 93C86CT-E/MNY Microchip Technology 21797L.pdf Description: IC EEPROM 16KBIT SPI 3MHZ 8TDFN
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93LC46CT-E/MNY 93LC46CT-E/MNY Microchip Technology 20001749K.pdf Description: IC EEPROM 1KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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93LC56AT-E/MNY 93LC56AT-E/MNY Microchip Technology 21794G.pdf Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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93LC56BT-E/MNY 93LC56BT-E/MNY Microchip Technology 21794G.pdf Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 128 x 16
DigiKey Programmable: Not Verified
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93LC66AT-E/MNY 93LC66AT-E/MNY Microchip Technology 21795E.pdf Description: IC EEPROM 4KBIT SPI 2MHZ 8TDFN
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93LC66BT-E/MNY 93LC66BT-E/MNY Microchip Technology 21795E.pdf Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 16
DigiKey Programmable: Not Verified
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93LC66CT-E/MNY 93LC66CT-E/MNY Microchip Technology 21795E.pdf Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 512 x 8, 256 x 16
DigiKey Programmable: Not Verified
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93LC76CT-E/MNY 93LC76CT-E/MNY Microchip Technology 21796M.pdf Description: IC EEPROM 8KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: Microwire
Memory Organization: 1K x 8, 512 x 16
DigiKey Programmable: Not Verified
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93LC86CT-E/MNY 93LC86CT-E/MNY Microchip Technology 21797L.pdf Description: IC EEPROM 16KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: Microwire
Memory Organization: 2K x 8, 1K x 16
DigiKey Programmable: Not Verified
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AC164347 Microchip Technology Description: SOCKET MODULE PM3 UNIV 144LQFP
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AC164351 AC164351 Microchip Technology Description: SOCKET MODULE MPLAB PM3 121BGA
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AC164355 AC164355 Microchip Technology AC164355_Web.pdf Description: SOCKET MODULE PM3 36VLAP 5X5
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BK0011 Microchip Technology Description: LITERATURE MPLAB PROGRAMMING
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DSPIC33FJ16GS402T-50I/MM DSPIC33FJ16GS402T-50I/MM Microchip Technology filehandler.aspx?ddocname=en540501 Description: IC MCU 16BIT 16KB FLASH 28QFN
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DSPIC33FJ16GS402T-50I/SO DSPIC33FJ16GS402T-50I/SO Microchip Technology filehandler.aspx?ddocname=en540501 Description: IC MCU 16BIT 16KB FLASH 28SOIC
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DSPIC33FJ16GS404T-50I/ML DSPIC33FJ16GS404T-50I/ML Microchip Technology filehandler.aspx?ddocname=en540501 Description: IC MCU 16BIT 16KB FLASH 44QFN
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DSPIC33FJ16GS404T-50I/TL DSPIC33FJ16GS404T-50I/TL Microchip Technology filehandler.aspx?ddocname=en540501 Description: IC MCU 16BIT 16KB FLASH 44VTLA
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DSPIC33FJ16GS502T-50I/MM DSPIC33FJ16GS502T-50I/MM Microchip Technology 70000318g.pdf Description: IC MCU 16BIT 16KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50 MIPs
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 16x10b; D/A 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Number of I/O: 21
DigiKey Programmable: Not Verified
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DSPIC33FJ16GS502T-50I/SO DSPIC33FJ16GS502T-50I/SO Microchip Technology 70000318g.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50 MIPs
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 16x10b; D/A 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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DSPIC33FJ16GS504T-50I/ML DSPIC33FJ16GS504T-50I/ML Microchip Technology 70000318g.pdf Description: IC MCU 16BIT 16KB FLASH 44QFN
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DSPIC33FJ16GS504T-50I/TL DSPIC33FJ16GS504T-50I/TL Microchip Technology 70000318g.pdf Description: IC MCU 16BIT 16KB FLASH 44VTLA
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DSPIC33FJ32GS406T-50I/MR DSPIC33FJ32GS406T-50I/MR Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 32KB FLASH 64QFN
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DSPIC33FJ32GS406T-50I/PT DSPIC33FJ32GS406T-50I/PT Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 32KB FLASH 64TQFP
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DSPIC33FJ32GS606T-50I/MR DSPIC33FJ32GS606T-50I/MR Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 32KB FLASH 64QFN
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DSPIC33FJ32GS608T-50I/PT DSPIC33FJ32GS608T-50I/PT Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 32KB FLASH 80TQFP
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DSPIC33FJ32GS610T-50I/PF DSPIC33FJ32GS610T-50I/PF Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 32KB FLASH 100TQFP
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DSPIC33FJ32GS610T-50I/PT DSPIC33FJ32GS610T-50I/PT Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 32KB FLASH 100TQFP
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DSPIC33FJ64GS406T-50I/PT DSPIC33FJ64GS406T-50I/PT Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 64KB FLASH 64TQFP
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DSPIC33FJ64GS606T-50I/MR DSPIC33FJ64GS606T-50I/MR Microchip Technology 70000591f.pdf Description: IC MCU 16BIT 64KB FLASH 64VQFN
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DSPIC33FJ64GS610T-50I/PF DSPIC33FJ64GS610T-50I/PF Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 64KB FLASH 100TQFP
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DSPIC33FJ64GS610T-50I/PT DSPIC33FJ64GS610T-50I/PT Microchip Technology filehandler.aspx?ddocname=en547103 Description: IC MCU 16BIT 64KB FLASH 100TQFP
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MCP1703RT-5002E/MB MCP1703RT-5002E/MB Microchip Technology 22049f.pdf Description: IC REG LINEAR 5V 250MA SOT89-3
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MCP2021P-330E/MD MCP2021P-330E/MD Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021P-330E/SN MCP2021P-330E/SN Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021P-500E/MD MCP2021P-500E/MD Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021P-500E/SN MCP2021P-500E/SN Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021PT-330E/MD MCP2021PT-330E/MD Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021PT-330E/SN MCP2021PT-330E/SN Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021PT-500E/MD MCP2021PT-500E/MD Microchip Technology 20002018H.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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APT68GA60LD40 123666-apt68ga60b2d40-apt68ga60ld40-datasheet
APT68GA60LD40
Виробник: Microchip Technology
Description: IGBT 600V 121A 520W TO-264
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APT75F50B2 7244-apt75f50b2-apt75f50l-datasheet
APT75F50B2
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 75A T-MAX
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 37A, 10V
Power Dissipation (Max): 1040W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: T-MAX™ [B2]
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 290 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11600 pF @ 25 V
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APT75F50L 7244-apt75f50b2-apt75f50l-datasheet
APT75F50L
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 75A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 37A, 10V
Power Dissipation (Max): 1040W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 290 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11600 pF @ 25 V
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APT77N60BC6 77173-apt77n60bc6-apt77n60sc6-datasheet
APT77N60BC6
Виробник: Microchip Technology
Description: MOSFET N-CH 600V 77A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 77A (Tc)
Rds On (Max) @ Id, Vgs: 41mOhm @ 44.4A, 10V
Power Dissipation (Max): 481W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 2.96mA
Supplier Device Package: TO-247 [B]
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13600 pF @ 25 V
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APT80F60J 123471-apt80f60j-datasheet
APT80F60J
Виробник: Microchip Technology
Description: MOSFET N-CH 600V 84A ISOTOP
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APT84F50L 7299-apt84f50b2m-apt84f50l-datasheet
APT84F50L
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 84A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 42A, 10V
Power Dissipation (Max): 1135W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 340 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13500 pF @ 25 V
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USB2514B-AEZC 00001692C.pdf
USB2514B-AEZC
Виробник: Microchip Technology
Description: IC USB 2.0 4PORT HUB CTLR 36QFN
Packaging: Tray
Package / Case: 36-VFQFN Exposed Pad
Function: Hub Controller
Interface: USB
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 70mA
Protocol: USB
Supplier Device Package: 36-QFN (6x6)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 5546 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+168.99 грн
25+135.08 грн
100+124.83 грн
Мінімальне замовлення: 2
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USB2241-AEZG-06 00001979A.pdf
USB2241-AEZG-06
Виробник: Microchip Technology
Description: IC CONTROLLER USB 36QFN
Packaging: Tray
Package / Case: 36-VFQFN Exposed Pad
Function: Controller
Interface: Serial
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 135mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 36-QFN (6x6)
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+185.48 грн
25+147.49 грн
100+133.97 грн
Мінімальне замовлення: 2
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24C00T-E/MNY 24AA00-24LC00-24C00-Data-Sheet-20001178J.pdf
24C00T-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 128BIT I2C 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128bit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 4ms
Memory Interface: I2C
Access Time: 3.5 µs
Memory Organization: 16 x 8
DigiKey Programmable: Not Verified
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24LCS52T-I/MNY 21166K.pdf
24LCS52T-I/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT I2C 400KHZ 8TDFN
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25AA040AT-I/MNY 21827H.pdf
25AA040AT-I/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT SPI 10MHZ 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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25LC040AT-E/MNY 21827H.pdf
25LC040AT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT SPI 10MHZ 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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25LC040AT-I/MNY 21827H.pdf
25LC040AT-I/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT SPI 10MHZ 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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93C46CT-E/MNY 20001749K.pdf
93C46CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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93C56AT-E/MNY 21794G.pdf
93C56AT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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93C56BT-E/MNY filehandler.aspx?ddocname=en013939
93C56BT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2K SPI 2MHZ 8TDFN
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93C56CT-E/MNY 21794G.pdf
93C56CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT SPI 3MHZ 8TDFN
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93C66AT-E/MNY 21795E.pdf
93C66AT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
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93C66BT-E/MNY 21795E.pdf
93C66BT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 256 x 16
DigiKey Programmable: Not Verified
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93C66CT-E/MNY filehandler.aspx?ddocname=en011819
93C66CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT 3MHZ 8TDFN
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93C76CT-E/MNY 21796M.pdf
93C76CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 8KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 2ms
Memory Interface: Microwire
Memory Organization: 1K x 8, 512 x 16
DigiKey Programmable: Not Verified
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93C86CT-E/MNY 21797L.pdf
93C86CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT SPI 3MHZ 8TDFN
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93LC46CT-E/MNY 20001749K.pdf
93LC46CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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93LC56AT-E/MNY 21794G.pdf
93LC56AT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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93LC56BT-E/MNY 21794G.pdf
93LC56BT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 128 x 16
DigiKey Programmable: Not Verified
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93LC66AT-E/MNY 21795E.pdf
93LC66AT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT SPI 2MHZ 8TDFN
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93LC66BT-E/MNY 21795E.pdf
93LC66BT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 16
DigiKey Programmable: Not Verified
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93LC66CT-E/MNY 21795E.pdf
93LC66CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 512 x 8, 256 x 16
DigiKey Programmable: Not Verified
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93LC76CT-E/MNY 21796M.pdf
93LC76CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 8KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: Microwire
Memory Organization: 1K x 8, 512 x 16
DigiKey Programmable: Not Verified
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93LC86CT-E/MNY 21797L.pdf
93LC86CT-E/MNY
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: Microwire
Memory Organization: 2K x 8, 1K x 16
DigiKey Programmable: Not Verified
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AC164347
Виробник: Microchip Technology
Description: SOCKET MODULE PM3 UNIV 144LQFP
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AC164351
AC164351
Виробник: Microchip Technology
Description: SOCKET MODULE MPLAB PM3 121BGA
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AC164355 AC164355_Web.pdf
AC164355
Виробник: Microchip Technology
Description: SOCKET MODULE PM3 36VLAP 5X5
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BK0011
Виробник: Microchip Technology
Description: LITERATURE MPLAB PROGRAMMING
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DSPIC33FJ16GS402T-50I/MM filehandler.aspx?ddocname=en540501
DSPIC33FJ16GS402T-50I/MM
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 28QFN
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DSPIC33FJ16GS402T-50I/SO filehandler.aspx?ddocname=en540501
DSPIC33FJ16GS402T-50I/SO
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 28SOIC
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DSPIC33FJ16GS404T-50I/ML filehandler.aspx?ddocname=en540501
DSPIC33FJ16GS404T-50I/ML
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 44QFN
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DSPIC33FJ16GS404T-50I/TL filehandler.aspx?ddocname=en540501
DSPIC33FJ16GS404T-50I/TL
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 44VTLA
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DSPIC33FJ16GS502T-50I/MM 70000318g.pdf
DSPIC33FJ16GS502T-50I/MM
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50 MIPs
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 16x10b; D/A 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Number of I/O: 21
DigiKey Programmable: Not Verified
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DSPIC33FJ16GS502T-50I/SO 70000318g.pdf
DSPIC33FJ16GS502T-50I/SO
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50 MIPs
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 16x10b; D/A 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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DSPIC33FJ16GS504T-50I/ML 70000318g.pdf
DSPIC33FJ16GS504T-50I/ML
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 44QFN
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DSPIC33FJ16GS504T-50I/TL 70000318g.pdf
DSPIC33FJ16GS504T-50I/TL
Виробник: Microchip Technology
Description: IC MCU 16BIT 16KB FLASH 44VTLA
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DSPIC33FJ32GS406T-50I/MR filehandler.aspx?ddocname=en547103
DSPIC33FJ32GS406T-50I/MR
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 64QFN
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DSPIC33FJ32GS406T-50I/PT filehandler.aspx?ddocname=en547103
DSPIC33FJ32GS406T-50I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 64TQFP
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DSPIC33FJ32GS606T-50I/MR filehandler.aspx?ddocname=en547103
DSPIC33FJ32GS606T-50I/MR
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 64QFN
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DSPIC33FJ32GS608T-50I/PT filehandler.aspx?ddocname=en547103
DSPIC33FJ32GS608T-50I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 80TQFP
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DSPIC33FJ32GS610T-50I/PF filehandler.aspx?ddocname=en547103
DSPIC33FJ32GS610T-50I/PF
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 100TQFP
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DSPIC33FJ32GS610T-50I/PT filehandler.aspx?ddocname=en547103
DSPIC33FJ32GS610T-50I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 100TQFP
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DSPIC33FJ64GS406T-50I/PT filehandler.aspx?ddocname=en547103
DSPIC33FJ64GS406T-50I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 64TQFP
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DSPIC33FJ64GS606T-50I/MR 70000591f.pdf
DSPIC33FJ64GS606T-50I/MR
Виробник: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 64VQFN
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DSPIC33FJ64GS610T-50I/PF filehandler.aspx?ddocname=en547103
DSPIC33FJ64GS610T-50I/PF
Виробник: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 100TQFP
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DSPIC33FJ64GS610T-50I/PT filehandler.aspx?ddocname=en547103
DSPIC33FJ64GS610T-50I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 100TQFP
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MCP1703RT-5002E/MB 22049f.pdf
MCP1703RT-5002E/MB
Виробник: Microchip Technology
Description: IC REG LINEAR 5V 250MA SOT89-3
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MCP2021P-330E/MD 20002018H.pdf
MCP2021P-330E/MD
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021P-330E/SN 20002018H.pdf
MCP2021P-330E/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021P-500E/MD 20002018H.pdf
MCP2021P-500E/MD
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021P-500E/SN 20002018H.pdf
MCP2021P-500E/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021PT-330E/MD 20002018H.pdf
MCP2021PT-330E/MD
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021PT-330E/SN 20002018H.pdf
MCP2021PT-330E/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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MCP2021PT-500E/MD 20002018H.pdf
MCP2021PT-500E/MD
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-DFN (4x4)
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Active
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