Продукція > 043
| Назва | Виробник | Інформація | Доступність | Ціна | ||||||||||||||||||
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| 0430451822 | Molex | Description: CONN HEADER R/A 18POS 3MM Features: Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole, Right Angle Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 720 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430451823 | Molex | Description: CONN HEADER R/A 18POS 3MM Features: Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole, Right Angle Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 720 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430451824 | Molex | Description: CONN HEADER VERT 18POS 3MM Features: Board Guide, Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 3388 шт: термін постачання 21-31 дні (днів) |
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| 0430451825 | Molex | Description: CONN HEADER VERT 18POS 3MM Features: Board Guide, Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 720 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430451826 | Molex | Description: CONN HEADER VERT 18POS 3MM Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Kinked Pin, Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 18 Mounting Type: Through Hole Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Guide, Board Lock Packaging: Tray Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black | на замовлення 1150 шт: термін постачання 21-31 дні (днів) |
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| 0430451827 | Molex | Description: CONN HEADER VERT 18POS 3MM Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 18 Mounting Type: Through Hole Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Guide Packaging: Tray Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 | на замовлення 1438 шт: термін постачання 21-31 дні (днів) |
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| 0430451828 | Molex | Description: CONN HEADER VERT 18POS 3MM Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 2137 шт: термін постачання 21-31 дні (днів) |
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| 0430451829 | Molex | Description: CONN HEADER VERT 18POS 3MM Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 722 шт: термін постачання 21-31 дні (днів) |
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| 0430451886 | Molex | Description: MICROFIT 3.0 VERT TH DR 18CKT TI Packaging: Bulk Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Material Flammability Rating: UL94 V-0 Pitch - Mating: 0.118" (3.00mm) Contact Shape: Square Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 2880 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 237 шт: термін постачання 21-31 дні (днів) |
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| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 1296 шт: термін постачання 21-31 дні (днів) |
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| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 1 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 236 шт: термін постачання 21-31 дні (днів) |
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| 0430452000 | Molex | Headers & Wire Housings MICRO-FIT 3.0 HDR 02X10P RA | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | товару немає в наявності | Мінімальне замовлення: 648 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452000 | Molex | Description: CONN HEADER R/A 20POS 3MM Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Alloy Material Flammability Rating: UL94 V-0 Number of Positions: 20 Mounting Type: Through Hole, Right Angle Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tray Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 | на замовлення 707 шт: термін постачання 21-31 дні (днів) |
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| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | товару немає в наявності | Мінімальне замовлення: 648 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452000 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 1296 шт: термін постачання 21-31 дні (днів) |
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| 0430452001 | Molex | Description: CONN HEADER R/A 20POS 3MM Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Number of Rows: 2 Number of Positions: 20 Mounting Type: Through Hole, Right Angle Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tray Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin | на замовлення 619 шт: термін постачання 21-31 дні (днів) |
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| 0430452002 | Molex | Description: CONN HEADER R/A 20POS 3MM Features: Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 1142 шт: термін постачання 21-31 дні (днів) |
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| 0430452006 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Board Lock Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 1010 шт: термін постачання 21-31 дні (днів) |
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| 0430452006 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Shape: Square Contact Finish - Post: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Surface Mount, Right Angle Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tape & Reel (TR) | на замовлення 200 шт: термін постачання 21-31 дні (днів) |
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| 0430452007 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Surface Mount, Right Angle Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Cut Tape (CT) | на замовлення 4383 шт: термін постачання 21-31 дні (днів) |
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| 0430452007 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Surface Mount, Right Angle Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tape & Reel (TR) Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin | на замовлення 4340 шт: термін постачання 21-31 дні (днів) |
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| 0430452008 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Board Lock Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452008 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Board Lock Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452009 | Molex | Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R | товару немає в наявності | Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452009 | Molex | Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R | на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| 0430452009 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 1600 шт: термін постачання 21-31 дні (днів) |
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| 0430452009 | Molex | Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R | на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| 0430452009 | Molex | Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452009 | Molex | Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R | на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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| 0430452009 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 1787 шт: термін постачання 21-31 дні (днів) |
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| 0430452009 | Molex | Conn Wire to Board HDR 20 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R | на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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| 0430452010 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452011 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 600 шт: термін постачання 21-31 дні (днів) |
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| 0430452011 | Molex | Description: CONN HEADER SMD R/A 20POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 833 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 8453 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Description: CONN HEADER VERT 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Kinked Pin, Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Through Hole Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 600V Connector Type: Header Features: Board Guide Packaging: Tray | на замовлення 3803 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Headers & Wire Housings MICRO-FIT 3.0 HDR 02X10P VT | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 6797 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 497 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | товару немає в наявності | Мінімальне замовлення: 1296 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 8452 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 2922 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 2916 шт: термін постачання 21-31 дні (днів) |
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| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | товару немає в наявності | Мінімальне замовлення: 87 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452012 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 6797 шт: термін постачання 21-31 дні (днів) |
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| 0430452013 | Molex | Description: CONN HEADER VERT 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Kinked Pin, Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Through Hole Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Guide Packaging: Tray | на замовлення 3442 шт: термін постачання 21-31 дні (днів) |
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| 0430452014 | Molex | Description: CONN HEADER VERT 20POS 3MM Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 2653 шт: термін постачання 21-31 дні (днів) |
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| 0430452015 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Board Lock Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452016 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Board Lock Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452017 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Board Lock Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | товару немає в наявності | Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452018 | Molex | 0430452018 Connector Header & PCB Receptacles Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit - Arrow.com | на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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| 0430452018 | Molex | 0430452018 Connector Header & PCB Receptacles Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit - Arrow.com | на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| 0430452018 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 5845 шт: термін постачання 21-31 дні (днів) |
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| 0430452018 | Molex | 0430452018 Connector Header & PCB Receptacles Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit - Arrow.com | товару немає в наявності | Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452018 | Molex | 0430452018 Connector Header & PCB Receptacles Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit - Arrow.com | на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| 0430452018 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 5800 шт: термін постачання 21-31 дні (днів) |
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| 0430452018 | Molex | 0430452018 Connector Header & PCB Receptacles Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit - Arrow.com | на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| 0430452018 | Molex | 0430452018 Connector Header & PCB Receptacles Wire to Board HDR 20 POS 3mm Solder ST Top Entry SMD Micro-Fit - Arrow.com | на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R | на замовлення 16000 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R | на замовлення 522 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Description: CONN HEADER SMD 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Surface Mount Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) | на замовлення 272 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452019 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R | на замовлення 522 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R | на замовлення 16000 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Description: CONN HEADER SMD 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Surface Mount Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Solder Retention Packaging: Tape & Reel (TR) | на замовлення 200 шт: термін постачання 21-31 дні (днів) |
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| 0430452019 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452020 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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| 0430452020 | Molex | Description: CONN HEADER SMD 20POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 936 шт: термін постачання 21-31 дні (днів) |
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| 0430452021 | Molex | Description: CONN HEADER R/A 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Through Hole, Right Angle Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tray | на замовлення 2286 шт: термін постачання 21-31 дні (днів) |
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| 0430452022 | Molex | Headers & Wire Housings Microfit 3.0 RA PTH w/clip 15Au DR 20Ckt | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452022 | Molex | Description: CONN HEADER R/A 20POS 3MM Features: Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 552 шт: термін постачання 21-31 дні (днів) |
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| 0430452023 | Molex | Description: CONN HEADER R/A 20POS 3MM Features: Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 509 шт: термін постачання 21-31 дні (днів) |
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| 0430452024 | Molex | Description: CONN HEADER VERT 20POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.390" (9.91mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Kinked Pin, Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 20 Mounting Type: Through Hole Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Guide, Board Lock Packaging: Tray | на замовлення 390 шт: термін постачання 21-31 дні (днів) |
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| 0430452025 | Molex | Description: CONN HEADER VERT 20POS 3MM Features: Board Guide, Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 708 шт: термін постачання 21-31 дні (днів) |
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| 0430452026 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 2790 шт: термін постачання 21-31 дні (днів) |
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| 0430452026 | Molex | Description: CONN HEADER VERT 20POS 3MM Features: Board Guide, Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 686 шт: термін постачання 21-31 дні (днів) |
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| 0430452026 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 2790 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452026 | Molex | Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 1844 шт: термін постачання 21-31 дні (днів) |
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| 0430452027 | Molex | Description: CONN HEADER VERT 20POS 3MM Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 995 шт: термін постачання 21-31 дні (днів) |
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| 0430452028 | Molex | Description: CONN HEADER VERT 20POS 3MM Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 4276 шт: термін постачання 21-31 дні (днів) |
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| 0430452029 | Molex | Description: CONN HEADER VERT 20POS 3MM Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Through Hole Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) | на замовлення 468 шт: термін постачання 21-31 дні (днів) |
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| 0430452037 | Molex, LLC | Description: MICROFIT 3.0 V SMT /NAIL DR 30AU | товару немає в наявності | Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452091 | Molex | Description: MICROFIT3.0 DR VRT TH STR SN 20C | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||||||
| 0430452101 | Molex | Description: MICROFIT3.0 VERT TH 15AU 20CKT S | товару немає в наявності | Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 837 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 397 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Description: CONN HEADER R/A 22POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 22 Mounting Type: Through Hole, Right Angle Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tray | на замовлення 1097 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 836 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 287 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 287 шт: термін постачання 21-31 дні (днів) |
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| 0430452200 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Tray | на замовлення 397 шт: термін постачання 21-31 дні (днів) |
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| 0430452201 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | товару немає в наявності | Мінімальне замовлення: 15 шт В кошику од. на суму грн. | ||||||||||||||||||
| 0430452201 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 816 шт: термін постачання 21-31 дні (днів) |
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| 0430452201 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 192 шт: термін постачання 21-31 дні (днів) |
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| 0430452201 | Molex | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray | на замовлення 816 шт: термін постачання 21-31 дні (днів) |
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| 0430452201 | MOLEX | Conn Wire to Board HDR 22Power POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 Tray 0430452201 MOLEX Z MX-0430452201 кількість в упаковці: 13 шт | на замовлення 13 шт: термін постачання 28-31 дні (днів) |
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