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LPC1224FBD48/121,1 LPC1224FBD48/121,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 6085 шт:
термін постачання 21-31 дні (днів)
1+346.13 грн
10+255.19 грн
25+235.53 грн
80+203.48 грн
250+202.51 грн
В кошику  од. на суму  грн.
LPC1224FBD64/101,1 LPC1224FBD64/101,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
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LPC1225FBD48/301,1 LPC1225FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LPC1225FBD64/301,1 LPC1225FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 797 шт:
термін постачання 21-31 дні (днів)
1+397.35 грн
10+295.84 грн
25+272.25 грн
160+219.67 грн
320+219.04 грн
640+216.64 грн
В кошику  од. на суму  грн.
LPC1225FBD64/321,1 LPC1225FBD64/321,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 80KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
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LPC1226FBD48/301,1 LPC1226FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+477.48 грн
10+249.15 грн
В кошику  од. на суму  грн.
LPC1226FBD64/301,1 LPC1226FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
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LPC1227FBD48/301,1 LPC1227FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LPC1227FBD64/301,1 LPC1227FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 184 шт:
термін постачання 21-31 дні (днів)
1+475.00 грн
10+312.15 грн
25+300.03 грн
160+257.32 грн
В кошику  од. на суму  грн.
TWR-MCF51AG-KIT TWR-MCF51AG-KIT NXP USA Inc. MCF51AG128FS.pdf Description: TOWER SYSTEM MCF51AG EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51AG
Platform: Tower System
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JN5139/001,531 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5139/001,518 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5139/Z01,531 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5148/001,515 JN5148/001,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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JN5148/001,518 JN5148/001,518 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
на замовлення 3806 шт:
термін постачання 21-31 дні (днів)
6+61.96 грн
10+42.72 грн
25+38.47 грн
100+31.72 грн
250+29.62 грн
500+28.36 грн
1000+26.87 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
4000+37.54 грн
8000+35.38 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NX3DV3899GU,115 NX3DV3899GU,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
4000+35.83 грн
8000+33.77 грн
12000+33.39 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 4728 шт:
термін постачання 21-31 дні (днів)
7+49.57 грн
10+33.73 грн
25+30.23 грн
100+24.84 грн
250+23.14 грн
500+22.12 грн
1000+21.41 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 9859 шт:
термін постачання 21-31 дні (днів)
5+79.30 грн
10+55.21 грн
25+49.93 грн
100+41.37 грн
250+38.75 грн
500+37.43 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 3925 шт:
термін постачання 21-31 дні (днів)
9+38.00 грн
13+25.93 грн
25+23.20 грн
100+18.95 грн
250+17.60 грн
500+16.79 грн
1000+16.05 грн
Мінімальне замовлення: 9
В кошику  од. на суму  грн.
NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
5+66.09 грн
10+44.07 грн
25+39.14 грн
Мінімальне замовлення: 5
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Packaging: Cut Tape (CT)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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PBSS3515E,135 PBSS3515E,135 NXP USA Inc. DS_568_PBSS3515E.pdf Description: TRANS PNP 15V 0.5A SC-75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
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BGX885N,112 BGX885N,112 NXP USA Inc. BGX885N.pdf Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 860MHz
RF Type: General Purpose
Voltage - Supply: 26V
Gain: 17.3dB
Current - Supply: 240mA
Noise Figure: 8dB
Test Frequency: 750MHz
Supplier Device Package: SFM9
Part Status: Obsolete
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EM773FHN33,551 EM773FHN33,551 NXP USA Inc. EM773.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
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LPC1342FBD48,151 LPC1342FBD48,151 NXP USA Inc. ?attachment_id=20293&download_file=7ikekx37reof99 Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+444.44 грн
10+327.66 грн
25+302.54 грн
80+261.49 грн
250+245.60 грн
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LPC1768FET100,551 LPC1768FET100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1590 шт:
термін постачання 21-31 дні (днів)
1+724.48 грн
10+560.51 грн
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LPC2420FET208,551 LPC2420FET208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 126 шт:
термін постачання 21-31 дні (днів)
1+1059.87 грн
10+806.71 грн
25+753.36 грн
126+644.74 грн
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MPT612FBD48,151 MPT612FBD48,151 NXP USA Inc. MPT612.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
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PCA8576CH/Q900,157 PCA8576CH/Q900,157 NXP USA Inc. PCA8576C.pdf Description: IC DRVR 7 SEGMENT 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 64-LQFP (10x10)
Current - Supply: 120 µA
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BGO807CE/FC0,112 BGO807CE/FC0,112 NXP USA Inc. Description: IC AMP CATV SOT115X
Packaging: Tube
Package / Case: SOT-115X
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115X
Number of Circuits: 1
Current - Supply: 190 mA
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CGD1046HI,112 CGD1046HI,112 NXP USA Inc. CGD1046HI.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
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PCF8523TS/1,112 PCF8523TS/1,112 NXP USA Inc. PCF8523.pdf Description: IC RTC CLK/CALENDAR I2C 14TSSOP
Packaging: Tube
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Voltage - Supply, Battery: 1.8V ~ 5.5V
Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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74AHC240D,118 74AHC240D,118 NXP USA Inc. 74AHC%28T%29240.pdf Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC240PW,118 74AHC240PW,118 NXP USA Inc. 74AHC%28T%29240.pdf Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
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74AHC241D,118 74AHC241D,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC241PW,118 74AHC241PW,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74AHCT241PW,118 74AHCT241PW,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74AVC16T245BQ,518 74AVC16T245BQ,518 NXP USA Inc. 74AVC16T245_Rev02.pdf Description: IC TRANSLATOR BIDIR 60HUQFNU
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74AVCH16T245BQ,518 74AVCH16T245BQ,518 NXP USA Inc. 74AVCH16T245_Rev02.pdf Description: IC TRNSLTR BIDIRECTIONAL 60HUQFN
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74AVCH16T245DGV,11 74AVCH16T245DGV,11 NXP USA Inc. 74AVCH16T245_Rev_Feb2017.pdf Description: IC TRANSLATION TXRX 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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74AVCH20T245DGV:11 74AVCH20T245DGV:11 NXP USA Inc. 74AVCH20T245_Rev_Feb2017.pdf Description: IC TRANSLATOR BIDIR 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 10
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
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74CBTLV16211DGV:11 74CBTLV16211DGV:11 NXP USA Inc. 74CBTLV16211_Rev_Feb2017.pdf Description: IC BUS SWITCH 12 X 1:1 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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74LVC16244ABQ,518 74LVC16244ABQ,518 NXP USA Inc. 74LVC_LVCH16244A.pdf Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVC16245ABQ,518 74LVC16245ABQ,518 NXP USA Inc. 74LVC_LVCH16245A_Rev09.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVC16374ABQ,518 74LVC16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVCH16244ABQ,518 74LVCH16244ABQ,518 NXP USA Inc. 74LVC(H)16244A_Rev9.pdf Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVCH16245ABQ,518 74LVCH16245ABQ,518 NXP USA Inc. 74LVC_LVCH16245A_Rev09.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 60-HUQFNU (4x6)
Part Status: Obsolete
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74LVCH16374ABQ,518 74LVCH16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVT16244BBQ,518 74LVT16244BBQ,518 NXP USA Inc. 74LVT_LVTH16244B_Rev08.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVT16245BBQ,518 74LVT16245BBQ,518 NXP USA Inc. 74LVT_LVTH16245B_Rev07.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16244BBQ,518 74LVTH16244BBQ,518 NXP USA Inc. 74LVT_LVTH16244B_Rev08.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVTH16245BBQ,518 74LVTH16245BBQ,518 NXP USA Inc. 74LVT_LVTH16245B_Rev07.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16374ABQ,518 74LVTH16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 120 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 3 pF
Supplier Device Package: 60-HXQFN (4x6)
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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LPC1224FBD48/121,1 LPC122X.pdf
LPC1224FBD48/121,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 6085 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+346.13 грн
10+255.19 грн
25+235.53 грн
80+203.48 грн
250+202.51 грн
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LPC1224FBD64/101,1 LPC122X.pdf
LPC1224FBD64/101,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
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LPC1225FBD48/301,1 LPC122X.pdf
LPC1225FBD48/301,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LPC1225FBD64/301,1 LPC122X.pdf
LPC1225FBD64/301,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 797 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+397.35 грн
10+295.84 грн
25+272.25 грн
160+219.67 грн
320+219.04 грн
640+216.64 грн
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LPC1225FBD64/321,1 LPC122X.pdf
LPC1225FBD64/321,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
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LPC1226FBD48/301,1 LPC122X.pdf
LPC1226FBD48/301,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+477.48 грн
10+249.15 грн
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LPC1226FBD64/301,1 LPC122X.pdf
LPC1226FBD64/301,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
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LPC1227FBD48/301,1 LPC122X.pdf
LPC1227FBD48/301,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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LPC1227FBD64/301,1 LPC122X.pdf
LPC1227FBD64/301,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 184 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+475.00 грн
10+312.15 грн
25+300.03 грн
160+257.32 грн
В кошику  од. на суму  грн.
TWR-MCF51AG-KIT MCF51AG128FS.pdf
TWR-MCF51AG-KIT
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51AG
Platform: Tower System
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JN5139/001,531 JN5139-001_Z01.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5139/001,518 JN5139-001_Z01.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5139/Z01,531 JN5139-001_Z01.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5148/001,515 JN5148-001.pdf
JN5148/001,515
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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JN5148/001,518 JN5148-001.pdf
JN5148/001,518
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
на замовлення 3806 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.96 грн
10+42.72 грн
25+38.47 грн
100+31.72 грн
250+29.62 грн
500+28.36 грн
1000+26.87 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+37.54 грн
8000+35.38 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NX3DV3899GU,115 NX3DV3899.pdf
NX3DV3899GU,115
Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+35.83 грн
8000+33.77 грн
12000+33.39 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Виробник: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 4728 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+49.57 грн
10+33.73 грн
25+30.23 грн
100+24.84 грн
250+23.14 грн
500+22.12 грн
1000+21.41 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 9859 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+79.30 грн
10+55.21 грн
25+49.93 грн
100+41.37 грн
250+38.75 грн
500+37.43 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 3925 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+38.00 грн
13+25.93 грн
25+23.20 грн
100+18.95 грн
250+17.60 грн
500+16.79 грн
1000+16.05 грн
Мінімальне замовлення: 9
В кошику  од. на суму  грн.
NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+66.09 грн
10+44.07 грн
25+39.14 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Виробник: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Cut Tape (CT)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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PBSS3515E,135 DS_568_PBSS3515E.pdf
PBSS3515E,135
Виробник: NXP USA Inc.
Description: TRANS PNP 15V 0.5A SC-75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
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BGX885N,112 BGX885N.pdf
BGX885N,112
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 860MHz
RF Type: General Purpose
Voltage - Supply: 26V
Gain: 17.3dB
Current - Supply: 240mA
Noise Figure: 8dB
Test Frequency: 750MHz
Supplier Device Package: SFM9
Part Status: Obsolete
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EM773FHN33,551 EM773.pdf
EM773FHN33,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
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LPC1342FBD48,151 ?attachment_id=20293&download_file=7ikekx37reof99
LPC1342FBD48,151
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+444.44 грн
10+327.66 грн
25+302.54 грн
80+261.49 грн
250+245.60 грн
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LPC1768FET100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1768FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1590 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+724.48 грн
10+560.51 грн
В кошику  од. на суму  грн.
LPC2420FET208,551 LPC2420_60.pdf
LPC2420FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 126 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1059.87 грн
10+806.71 грн
25+753.36 грн
126+644.74 грн
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MPT612FBD48,151 MPT612.pdf
MPT612FBD48,151
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
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PCA8576CH/Q900,157 PCA8576C.pdf
PCA8576CH/Q900,157
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 64-LQFP (10x10)
Current - Supply: 120 µA
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BGO807CE/FC0,112
BGO807CE/FC0,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115X
Packaging: Tube
Package / Case: SOT-115X
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115X
Number of Circuits: 1
Current - Supply: 190 mA
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CGD1046HI,112 CGD1046HI.pdf
CGD1046HI,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
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PCF8523TS/1,112 PCF8523.pdf
PCF8523TS/1,112
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 14TSSOP
Packaging: Tube
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Voltage - Supply, Battery: 1.8V ~ 5.5V
Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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74AHC240D,118 74AHC%28T%29240.pdf
74AHC240D,118
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC240PW,118 74AHC%28T%29240.pdf
74AHC240PW,118
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
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74AHC241D,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHC241D,118
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
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74AHC241PW,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHC241PW,118
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74AHCT241PW,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241PW,118
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74AVC16T245BQ,518 74AVC16T245_Rev02.pdf
74AVC16T245BQ,518
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 60HUQFNU
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74AVCH16T245BQ,518 74AVCH16T245_Rev02.pdf
74AVCH16T245BQ,518
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 60HUQFN
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74AVCH16T245DGV,11 74AVCH16T245_Rev_Feb2017.pdf
74AVCH16T245DGV,11
Виробник: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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74AVCH20T245DGV:11 74AVCH20T245_Rev_Feb2017.pdf
74AVCH20T245DGV:11
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 10
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
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74CBTLV16211DGV:11 74CBTLV16211_Rev_Feb2017.pdf
74CBTLV16211DGV:11
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 12 X 1:1 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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74LVC16244ABQ,518 74LVC_LVCH16244A.pdf
74LVC16244ABQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVC16245ABQ,518 74LVC_LVCH16245A_Rev09.pdf
74LVC16245ABQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVC16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVC16374ABQ,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVCH16244ABQ,518 74LVC(H)16244A_Rev9.pdf
74LVCH16244ABQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVCH16245ABQ,518 74LVC_LVCH16245A_Rev09.pdf
74LVCH16245ABQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 60-HUQFNU (4x6)
Part Status: Obsolete
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74LVCH16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVCH16374ABQ,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LVT16244BBQ,518 74LVT_LVTH16244B_Rev08.pdf
74LVT16244BBQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVT16245BBQ,518 74LVT_LVTH16245B_Rev07.pdf
74LVT16245BBQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16244BBQ,518 74LVT_LVTH16244B_Rev08.pdf
74LVTH16244BBQ,518
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVTH16245BBQ,518 74LVT_LVTH16245B_Rev07.pdf
74LVTH16245BBQ,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVTH16374ABQ,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 120 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 3 pF
Supplier Device Package: 60-HXQFN (4x6)
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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