Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36383) > Сторінка 171 з 607
| Фото | Назва | Виробник | Інформація |
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SPC5516EAMMG66 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208MAPBGADigiKey Programmable: Not Verified Number of I/O: 144 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Dual-Core Data Converters: A/D 40x12b Core Processor: e200z0, e200z1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5517EAMMG66 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGADigiKey Programmable: Not Verified Number of I/O: 144 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Dual-Core Data Converters: A/D 40x12b Core Processor: e200z0, e200z1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 80K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5517GAMMG66 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGACore Size: 32-Bit Dual-Core Data Converters: A/D 40x12b Core Processor: e200z0, e200z1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 80K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 144 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5534MVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA DigiKey Programmable: Not Verified Number of I/O: 192 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Single-Core Data Converters: A/D 34x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||||||
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TWR-MCF51AG | NXP USA Inc. |
Description: TOWER SYSTEM MCF51AG EVAL BRDPlatform: Tower System Utilized IC / Part: MCF51AG Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TWR-S08JE128 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08JE Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| TWR-S08JE128-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Utilized IC / Part: MC9S08JE Platform: Tower System |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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TWR-WIFI-G1011MI | NXP USA Inc. | Description: TOWER WIFI MOD- GAINSPAN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PK40X256VMD100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PK40X256VLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144LQFP |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||||
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PK60N256VMD100 | NXP USA Inc. | Description: IC MCU 32B 256KB FLASH 144MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5634MF1MLQ80 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPProgram Memory Size: 1.5MB (1.5M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 32x12b Core Processor: e200z3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 94K x 8 |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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SPC5634MF1MMG80 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGAProgram Memory Size: 1.5MB (1.5M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 34x12b Core Processor: e200z3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 94K x 8 |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||||
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S9S08SG16E1MTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOPNumber of I/O: 16 Part Status: Active Supplier Device Package: 20-TSSOP Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) Peripherals: LVD, POR, PWM, WDT DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||||
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S9S08SG4E2VTGR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||||
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MC9S08QB8CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOPPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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MRF8S23120HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Package / Case: SOT-957A Packaging: Tape & Reel (TR) Current - Test: 800 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 16dB Power - Output: 28W Frequency: 2.3GHz Mounting Type: Chassis Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRF8S23120HSR3 | NXP USA Inc. | Description: FET RF 65V 2.3GHZ NI-780S |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRFE6VP61K25HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 133 V Supplier Device Package: NI-1230S Technology: LDMOS Gain: 24dB Power - Output: 1250W Configuration: Dual Frequency: 230MHz Mounting Type: Chassis Mount Package / Case: NI-1230S Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPXV2050GP | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" .04V 8SOPPart Status: Active Maximum Pressure: 29.01PSI (200kPa) Port Style: Barbed Supplier Device Package: 8-SOP Applications: Board Mount Port Size: Male - 0.13" (3.17mm) Tube Voltage - Supply: 10V ~ 16V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±0.3% Pressure Type: Vented Gauge Operating Pressure: 7.25PSI (50kPa) Output: 0 mV ~ 40 mV (10V) Mounting Type: Surface Mount Output Type: Wheatstone Bridge Package / Case: 8-SMD, Gull Wing, Side Port Features: Temperature Compensated Packaging: Tray |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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MPVZ5150GC7U | NXP USA Inc. |
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIPMaximum Pressure: 58.02PSI (400kPa) Port Style: Barbless Supplier Device Package: 8-DIP Applications: Board Mount Port Size: Male - 0.13" (3.17mm) Tube Voltage - Supply: 4.75V ~ 5.25V Termination Style: PC Pin Operating Temperature: -40°C ~ 125°C Pressure Type: Vented Gauge Operating Pressure: 21.76PSI (150kPa) Output: 0.2 V ~ 4.7 V Mounting Type: Through Hole Output Type: Analog Voltage Package / Case: 8-DIP (0.550", 13.97mm), Top Port Features: Temperature Compensated Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPVZ7025DP | NXP USA Inc. |
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOPMaximum Pressure: ±29.01PSI (±200kPa) Port Style: Barbed Supplier Device Package: 8-SOP Applications: Board Mount Port Size: Male - 0.13" (3.3mm) Tube, Dual Voltage - Supply: 4.75V ~ 5.25V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±5% Pressure Type: Differential Operating Pressure: ±3.63PSI (±25kPa) Output: 0.2 V ~ 4.7 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Features: Temperature Compensated Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TWR-ADCDAC-LTC | NXP USA Inc. |
Description: EVAL BOARD FOR LTC1859 LTC2498 Secondary Attributes: For use with Freescale Tower System Contents: Board(s), Cable(s) Part Status: Active Embedded: No Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters Supplied Contents: Board(s), Cable(s) Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471 Type: Data Acquisition Function: ADC, DAC Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| TRK-MPC5604B | NXP USA Inc. |
Description: STARTERTRAK MPC5604B EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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LPC1224FBD48/121,1 | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 48LQFPNumber of I/O: 39 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 5464 шт: термін постачання 21-31 дні (днів) |
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LPC1224FBD64/101,1 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||||
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LPC1225FBD48/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC1225FBD64/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 1435 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD64/321,1 | NXP USA Inc. |
Description: IC MCU 32BIT 80KB FLASH 64LQFPProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 80KB (80K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||||
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LPC1226FBD48/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFPNumber of I/O: 39 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 96KB (96K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 327 шт: термін постачання 21-31 дні (днів) |
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LPC1226FBD64/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 96KB (96K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||||
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LPC1227FBD48/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC1227FBD64/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 55 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
на замовлення 344 шт: термін постачання 21-31 дні (днів) |
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TWR-MCF51AG-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51AG EVAL BRDPlatform: Tower System Utilized IC / Part: MCF51AG Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| JN5139/001,531 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| JN5139/001,518 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| JN5139/Z01,531 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFNPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Sensitivity: -97dBm Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 3dBm Protocol: Zigbee® Current - Receiving: 37mA Data Rate (Max): 1Mbps Current - Transmitting: 38mA GPIO: 21 RF Family/Standard: 802.15.4 Serial Interfaces: SPI, UART DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||||||
| JN5139/Z01,518 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFNPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Sensitivity: -97dBm Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 3dBm Protocol: Zigbee® Current - Receiving: 37mA Data Rate (Max): 1Mbps Current - Transmitting: 38mA GPIO: 21 RF Family/Standard: 802.15.4 Serial Interfaces: SPI, UART DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | |||||||||||||||||
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JN5148/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56VFQFNSensitivity: -96.5dBm Package / Case: 56-VFQFN Packaging: Tape & Reel (TR) Part Status: Obsolete Serial Interfaces: I2C, JTAG, SPI, UART RF Family/Standard: 802.15.4 Modulation: O-QPSK GPIO: 21 Current - Transmitting: 15mA Data Rate (Max): 667kbps Current - Receiving: 17.5mA Protocol: Zigbee® Power - Output: 2.75dBm Voltage - Supply: 2V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: TxRx + MCU Memory Size: 128kB ROM, 128kB RAM Frequency: 2.4GHz DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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JN5148/001,518 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56HVQFNPart Status: Obsolete Serial Interfaces: I2C, JTAG, SPI, UART RF Family/Standard: 802.15.4 Modulation: O-QPSK GPIO: 21 Current - Transmitting: 15mA Data Rate (Max): 667kbps Current - Receiving: 17.5mA Protocol: Zigbee® Power - Output: 2.75dBm Voltage - Supply: 2V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: TxRx + MCU Memory Size: 128kB ROM, 128kB RAM Frequency: 2.4GHz Sensitivity: -96.5dBm Package / Case: 56-VFQFN Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTB0102GT,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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NX3DV2567GU,115 | NXP USA Inc. |
Description: IC ANLG SWITCH 4PDT 16XQFNPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: Networking On-State Resistance (Max): 700mOhm -3db Bandwidth: 160MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Switch Circuit: 4PDT Number of Channels: 1 |
на замовлення 4220 шт: термін постачання 21-31 дні (днів) |
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NTB0104GU12,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 12-XQFNPackaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 12-XFQFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 12-XQFN (2x1.7) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 18091 шт: термін постачання 21-31 дні (днів) |
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NTS0102GT,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||||||
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NX3DV2567GU,115 | NXP USA Inc. |
Description: IC ANLG SWITCH 4PDT 16XQFNPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: Networking On-State Resistance (Max): 700mOhm -3db Bandwidth: 160MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Switch Circuit: 4PDT Number of Channels: 1 |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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NX3DV3899GU,115 | NXP USA Inc. |
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFNPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 3.3Ohm -3db Bandwidth: 200MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 4pC Crosstalk: -90dB @ 1MHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:2 Channel-to-Channel Matching (ΔRon): 700mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 8pF Current - Leakage (IS(off)) (Max): 5nA Part Status: Active Number of Circuits: 2 |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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NX3L2467GU,115 | NXP USA Inc. |
Description: IC SWITCH DPDTX2 750MOHM 16XQFNCurrent - Leakage (IS(off)) (Max): 10nA Channel Capacitance (CS(off), CD(off)): 35pF Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel-to-Channel Matching (ΔRon): 70mOhm Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: DPDT Crosstalk: -90dB @ 100kHz Charge Injection: 15pC Voltage - Supply, Single (V+): 1.4V ~ 4.3V Supplier Device Package: 16-XQFN (1.8x2.6) -3db Bandwidth: 60MHz On-State Resistance (Max): 750mOhm Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-XFQFN Packaging: Tape & Reel (TR) Number of Circuits: 2 Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||
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NX5DV715HF,118 | NXP USA Inc. |
Description: IC VGA SWITCH 32HWQFNPackaging: Tape & Reel (TR) Features: Buffers, RGB Package / Case: 32-WFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 4Ohm (Typ) -3db Bandwidth: 600MHz Supplier Device Package: 32-HWQFN (3x6) Voltage - Supply, Single (V+): 2V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTB0102GT,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 16960 шт: термін постачання 21-31 дні (днів) |
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NTB0104GU12,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 12-XQFNPackaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 12-XFQFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 12-XQFN (2x1.7) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 18091 шт: термін постачання 21-31 дні (днів) |
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NTS0102GT,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1Features: Auto-Direction Sensing Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 4465 шт: термін постачання 21-31 дні (днів) |
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NX3L2467GU,115 | NXP USA Inc. |
Description: IC SWITCH DPDTX2 750MOHM 16XQFNPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 70mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Active Number of Circuits: 2 |
на замовлення 76 шт: термін постачання 21-31 дні (днів) |
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NX5DV715HF,118 | NXP USA Inc. |
Description: IC VGA SWITCH 32HWQFNFeatures: Buffers, RGB Packaging: Cut Tape (CT) Package / Case: 32-WFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 4Ohm (Typ) -3db Bandwidth: 600MHz Supplier Device Package: 32-HWQFN (3x6) Voltage - Supply, Single (V+): 2V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BGX885N,112 | NXP USA Inc. |
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9Part Status: Obsolete Supplier Device Package: SFM9 Test Frequency: 750MHz Noise Figure: 8dB Current - Supply: 240mA Gain: 17.3dB Voltage - Supply: 26V RF Type: General Purpose Frequency: 40MHz ~ 860MHz Mounting Type: Chassis Mount Package / Case: SOT-115D Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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EM773FHN33,551 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFNProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (32K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Packaging: Tray Number of I/O: 25 Part Status: Obsolete Supplier Device Package: 32-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: ARM® Cortex®-M0 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LPC1342FBD48,151 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 42 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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LPC1768FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGAPackaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
на замовлення 1747 шт: термін постачання 21-31 дні (днів) |
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LPC2420FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208TFBGANumber of I/O: 160 Part Status: Not For New Designs Supplier Device Package: 208-TFBGA (15x15) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16/32-Bit DigiKey Programmable: Not Verified Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM7® Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 82K x 8 Speed: 72MHz Mounting Type: Surface Mount Package / Case: 208-TFBGA Packaging: Tray |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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| SPC5516EAMMG66 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| SPC5517EAMMG66 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| SPC5517GAMMG66 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| SPC5534MVM80 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| TWR-MCF51AG |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| TWR-S08JE128 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| TWR-S08JE128-KIT |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
товару немає в наявності
В кошику
од. на суму грн.
| TWR-WIFI-G1011MI |
Виробник: NXP USA Inc.
Description: TOWER WIFI MOD- GAINSPAN
Description: TOWER WIFI MOD- GAINSPAN
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| PK40X256VMD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144BGA
Description: IC MCU 32BIT 256KB FLASH 144BGA
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| PK40X256VLQ100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Description: IC MCU 32BIT 256KB FLASH 144LQFP
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Мінімальне замовлення: 90 шт
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| PK60N256VMD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Description: IC MCU 32B 256KB FLASH 144MAPBGA
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Мінімальне замовлення: 160 шт
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| SPC5634MF1MLQ80 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1914.61 грн |
| 10+ | 1487.38 грн |
| 25+ | 1398.29 грн |
| SPC5634MF1MMG80 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
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Мінімальне замовлення: 90 шт
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| S9S08SG16E1MTJR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 2500 шт
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| S9S08SG4E2VTGR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
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Мінімальне замовлення: 2500 шт
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| MC9S08QB8CTGR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5000+ | 126.19 грн |
| MRF8S23120HR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
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| MRF8S23120HSR3 |
Виробник: NXP USA Inc.
Description: FET RF 65V 2.3GHZ NI-780S
Description: FET RF 65V 2.3GHZ NI-780S
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| MRFE6VP61K25HR6 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 150+ | 22111.48 грн |
| MRFE6VP61K25HSR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 50+ | 21897.84 грн |
| MRFE6VP61K25HSR6 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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| MPXV2050GP |
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Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
на замовлення 109 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1391.66 грн |
| 10+ | 1060.89 грн |
| 25+ | 1005.05 грн |
| MPVZ5150GC7U |
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Виробник: NXP USA Inc.
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
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| MPVZ7025DP |
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Виробник: NXP USA Inc.
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Maximum Pressure: ±29.01PSI (±200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±5%
Pressure Type: Differential
Operating Pressure: ±3.63PSI (±25kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Features: Temperature Compensated
Packaging: Tray
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Maximum Pressure: ±29.01PSI (±200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±5%
Pressure Type: Differential
Operating Pressure: ±3.63PSI (±25kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Features: Temperature Compensated
Packaging: Tray
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| TWR-ADCDAC-LTC |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR LTC1859 LTC2498
Secondary Attributes: For use with Freescale Tower System
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: No
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Type: Data Acquisition
Function: ADC, DAC
Packaging: Box
Description: EVAL BOARD FOR LTC1859 LTC2498
Secondary Attributes: For use with Freescale Tower System
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: No
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Type: Data Acquisition
Function: ADC, DAC
Packaging: Box
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| TRK-MPC5604B |
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Виробник: NXP USA Inc.
Description: STARTERTRAK MPC5604B EVAL BRD
Description: STARTERTRAK MPC5604B EVAL BRD
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| LPC1224FBD48/121,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 5464 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 318.05 грн |
| 10+ | 234.27 грн |
| 25+ | 216.22 грн |
| 100+ | 184.29 грн |
| 250+ | 175.40 грн |
| 500+ | 174.98 грн |
| LPC1224FBD64/101,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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Мінімальне замовлення: 160 шт
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| LPC1225FBD48/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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| LPC1225FBD64/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 1435 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 456.50 грн |
| 10+ | 338.04 грн |
| 25+ | 312.58 грн |
| 160+ | 260.25 грн |
| 320+ | 251.69 грн |
| 640+ | 244.64 грн |
| 1120+ | 235.94 грн |
| LPC1225FBD64/321,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| LPC1226FBD48/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 327 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 416.15 грн |
| 10+ | 223.45 грн |
| LPC1226FBD64/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| LPC1227FBD48/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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| LPC1227FBD64/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
на замовлення 344 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 461.25 грн |
| 10+ | 302.92 грн |
| 25+ | 291.18 грн |
| 160+ | 249.74 грн |
| 320+ | 246.98 грн |
| TWR-MCF51AG-KIT |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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| JN5139/001,531 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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| JN5139/001,518 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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| JN5139/Z01,531 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| JN5139/Z01,518 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| JN5148/001,515 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
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| JN5148/001,518 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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од. на суму грн.
| NTB0102GT,115 |
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Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5000+ | 22.06 грн |
| 10000+ | 20.77 грн |
| 15000+ | 20.53 грн |
| NX3DV2567GU,115 |
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Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
на замовлення 4220 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 69.62 грн |
| 10+ | 48.30 грн |
| 25+ | 43.61 грн |
| 100+ | 36.06 грн |
| 250+ | 33.74 грн |
| 500+ | 32.34 грн |
| 1000+ | 30.95 грн |
| NTB0104GU12,115 |
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Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 18091 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4000+ | 31.93 грн |
| 8000+ | 30.07 грн |
| 12000+ | 29.74 грн |
| NTS0102GT,115 |
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Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| NX3DV2567GU,115 |
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Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4000+ | 33.24 грн |
| NX3DV3899GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4000+ | 43.23 грн |
| 8000+ | 40.76 грн |
| 12000+ | 40.33 грн |
| NX3L2467GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 70mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: DPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-XQFN (1.8x2.6)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Number of Circuits: 2
Part Status: Active
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 70mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: DPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-XQFN (1.8x2.6)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Number of Circuits: 2
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| NX5DV715HF,118 |
![]() |
Виробник: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
товару немає в наявності
В кошику
од. на суму грн.
| NTB0102GT,115 |
![]() |
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 16960 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 7+ | 49.84 грн |
| 10+ | 33.83 грн |
| 25+ | 30.38 грн |
| 100+ | 24.94 грн |
| 250+ | 23.24 грн |
| 500+ | 22.21 грн |
| 1000+ | 21.02 грн |
| 2500+ | 20.48 грн |
| NTB0104GU12,115 |
![]() |
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 18091 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 68.83 грн |
| 10+ | 47.46 грн |
| 25+ | 42.79 грн |
| 100+ | 35.36 грн |
| 250+ | 33.07 грн |
| 500+ | 31.69 грн |
| 1000+ | 30.06 грн |
| NTS0102GT,115 |
![]() |
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 4465 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 9+ | 38.77 грн |
| 12+ | 26.06 грн |
| 25+ | 23.31 грн |
| 100+ | 19.03 грн |
| 250+ | 17.67 грн |
| 500+ | 16.86 грн |
| 1000+ | 15.92 грн |
| 2500+ | 15.35 грн |
| NX3L2467GU,115 |
![]() |
Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 63.29 грн |
| 10+ | 42.21 грн |
| 25+ | 37.48 грн |
| NX5DV715HF,118 |
![]() |
Виробник: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Cut Tape (CT)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Cut Tape (CT)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
товару немає в наявності
В кошику
од. на суму грн.
| BGX885N,112 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Part Status: Obsolete
Supplier Device Package: SFM9
Test Frequency: 750MHz
Noise Figure: 8dB
Current - Supply: 240mA
Gain: 17.3dB
Voltage - Supply: 26V
RF Type: General Purpose
Frequency: 40MHz ~ 860MHz
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Packaging: Bulk
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Part Status: Obsolete
Supplier Device Package: SFM9
Test Frequency: 750MHz
Noise Figure: 8dB
Current - Supply: 240mA
Gain: 17.3dB
Voltage - Supply: 26V
RF Type: General Purpose
Frequency: 40MHz ~ 860MHz
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| EM773FHN33,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC1342FBD48,151 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 425.65 грн |
| 10+ | 313.81 грн |
| 25+ | 289.75 грн |
| 80+ | 250.43 грн |
| 250+ | 235.22 грн |
| LPC1768FET100,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1747 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1015.06 грн |
| 10+ | 771.84 грн |
| 25+ | 720.45 грн |
| 100+ | 623.10 грн |
| 260+ | 596.89 грн |
| 520+ | 581.83 грн |
| 1040+ | 560.10 грн |
| LPC2420FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Number of I/O: 160
Part Status: Not For New Designs
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Number of I/O: 160
Part Status: Not For New Designs
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
на замовлення 126 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1015.06 грн |
| 10+ | 772.60 грн |
| 25+ | 721.51 грн |
| 126+ | 617.48 грн |

































