Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36599) > Сторінка 171 з 610
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
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MRF8S9220HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 1.6 A Voltage - Test: 28 V Voltage - Rated: 70 V Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 19.4dB Power - Output: 65W Frequency: 960MHz Mounting Type: Chassis Mount Package / Case: SOT-957A Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | ||||||||||||||
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MSC8144SVT1000A | NXP USA Inc. |
 Description: IC DSP QUAD 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MSC8144SVT800A | NXP USA Inc. |
Description: IC DSP QUAD 800MHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MSC8144TVT1000A | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MSC8144TVT800A | NXP USA Inc. |
Description: IC DSP QUAD 800MHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MSC8144VT1000A | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MSC8144VT800A | NXP USA Inc. |
Description: IC DSP QUAD 800MHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MSC8156EVM | NXP USA Inc. |
Description: MSC8156 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PPC8306CVMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||
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PPC8306SCVMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||
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PPC8306SVMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||
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PPC8306VMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||
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PPC8309CVMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||
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PPC8309VMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||||||||||||||
| RDMMA845X | NXP USA Inc. |
Description: KIT FOR LFSTBUSB/E845X Packaging: Box Interface: I2C, USB Contents: Board(s), Cable(s) Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8451, MMA8452, MMA8453 Supplied Contents: Board(s), Cable(s) Sensing Range: ±2g, 4g, 8g |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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S912XDP512F0MAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 119 |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||||||||||||||
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S912XDP512F0MAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912XDQ256F1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912XEQ384J3CAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||||||||||||||
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S9S08AW16AE0MLC | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 22 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
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S9S08DN16F1MLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete Number of I/O: 25 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S9S08DN60F1MLF | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete Number of I/O: 39 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S9S08LG16J0CLH | NXP USA Inc. |
Description: IC MCU 8BIT 18KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 18KB (18K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||
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S9S08LG32J0VLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 69 |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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S9S08QD4J1MSCR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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S9S08SG16E1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||
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S9S12C64J2CFAE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Part Status: Not For New Designs Supplier Device Package: 48-LQFP (7x7) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal DigiKey Programmable: Not Verified Number of I/O: 31 Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
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S9S12XS128J1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP |
на замовлення 410 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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SPC5516EAMMG66 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA DigiKey Programmable: Not Verified Number of I/O: 144 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Dual-Core Data Converters: A/D 40x12b Core Processor: e200z0, e200z1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||
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SPC5517EAMMG66 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA DigiKey Programmable: Not Verified Number of I/O: 144 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Dual-Core Data Converters: A/D 40x12b Core Processor: e200z0, e200z1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 80K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5517GAMMG66 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA Core Size: 32-Bit Dual-Core Data Converters: A/D 40x12b Core Processor: e200z0, e200z1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 80K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 144 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||
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SPC5534MVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA DigiKey Programmable: Not Verified Number of I/O: 192 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Single-Core Data Converters: A/D 34x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||||
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TWR-MCF51AG | NXP USA Inc. |
Description: TOWER SYSTEM MCF51AG EVAL BRD Platform: Tower System Utilized IC / Part: MCF51AG Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TWR-S08JE128 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08JE Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| TWR-S08JE128-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Utilized IC / Part: MC9S08JE Platform: Tower System |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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TWR-WIFI-G1011MI | NXP USA Inc. | Description: TOWER WIFI MOD- GAINSPAN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PK40X256VMD100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PK40X256VLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144LQFP |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||
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PK60N256VMD100 | NXP USA Inc. | Description: IC MCU 32B 256KB FLASH 144MAPBGA |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
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SPC5634MF1MLQ80 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP Program Memory Size: 1.5MB (1.5M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 32x12b Core Processor: e200z3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 94K x 8 |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SPC5634MF1MMG80 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA Program Memory Size: 1.5MB (1.5M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 208-BGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 208-BGA (17x17) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 34x12b Core Processor: e200z3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 94K x 8 |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||
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S9S08SG16E1MTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP Number of I/O: 16 Part Status: Active Supplier Device Package: 20-TSSOP Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) Peripherals: LVD, POR, PWM, WDT DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||
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S9S08SG4E2VTGR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||
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MC9S08QB8CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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MRF8S23120HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Package / Case: SOT-957A Packaging: Tape & Reel (TR) Current - Test: 800 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 16dB Power - Output: 28W Frequency: 2.3GHz Mounting Type: Chassis Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
MRF8S23120HSR3 | NXP USA Inc. | Description: FET RF 65V 2.3GHZ NI-780S |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
MRFE6VP61K25HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 133 V Supplier Device Package: NI-1230S Technology: LDMOS Gain: 24dB Power - Output: 1250W Configuration: Dual Frequency: 230MHz Mounting Type: Chassis Mount Package / Case: NI-1230S Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPXV2050GP | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP Part Status: Active Maximum Pressure: 29.01PSI (200kPa) Port Style: Barbed Supplier Device Package: 8-SOP Applications: Board Mount Port Size: Male - 0.13" (3.17mm) Tube Voltage - Supply: 10V ~ 16V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±0.3% Pressure Type: Vented Gauge Operating Pressure: 7.25PSI (50kPa) Output: 0 mV ~ 40 mV (10V) Mounting Type: Surface Mount Output Type: Wheatstone Bridge Package / Case: 8-SMD, Gull Wing, Side Port Features: Temperature Compensated Packaging: Tray |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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MPVZ5150GC7U | NXP USA Inc. |
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP Maximum Pressure: 58.02PSI (400kPa) Port Style: Barbless Supplier Device Package: 8-DIP Applications: Board Mount Port Size: Male - 0.13" (3.17mm) Tube Voltage - Supply: 4.75V ~ 5.25V Termination Style: PC Pin Operating Temperature: -40°C ~ 125°C Pressure Type: Vented Gauge Operating Pressure: 21.76PSI (150kPa) Output: 0.2 V ~ 4.7 V Mounting Type: Through Hole Output Type: Analog Voltage Package / Case: 8-DIP (0.550", 13.97mm), Top Port Features: Temperature Compensated Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPVZ7025DP | NXP USA Inc. |
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP Maximum Pressure: ±29.01PSI (±200kPa) Port Style: Barbed Supplier Device Package: 8-SOP Applications: Board Mount Port Size: Male - 0.13" (3.3mm) Tube, Dual Voltage - Supply: 4.75V ~ 5.25V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±5% Pressure Type: Differential Operating Pressure: ±3.63PSI (±25kPa) Output: 0.2 V ~ 4.7 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Features: Temperature Compensated Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TWR-ADCDAC-LTC | NXP USA Inc. |
Description: EVAL BOARD FOR LTC1859 LTC2498 Secondary Attributes: For use with Freescale Tower System Contents: Board(s), Cable(s) Part Status: Active Embedded: No Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters Supplied Contents: Board(s), Cable(s) Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471 Type: Data Acquisition Function: ADC, DAC Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| TRK-MPC5604B | NXP USA Inc. |
Description: STARTERTRAK MPC5604B EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LPC1224FBD48/121,1 | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 48LQFP Number of I/O: 39 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 5464 шт: термін постачання 21-31 дні (днів) |
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LPC1224FBD64/101,1 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
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LPC1225FBD48/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC1225FBD64/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 1435 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD64/321,1 | NXP USA Inc. |
Description: IC MCU 32BIT 80KB FLASH 64LQFP Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 80KB (80K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
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LPC1226FBD48/301,1 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFP Number of I/O: 39 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 96KB (96K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 324 шт: термін постачання 21-31 дні (днів) |
|
| MRF8S9220HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| MSC8144SVT1000A |
|
Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| MSC8144SVT800A |
|
Виробник: NXP USA Inc.
Description: IC DSP QUAD 800MHZ 783FCBGA
Description: IC DSP QUAD 800MHZ 783FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| MSC8144TVT1000A |
|
Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| MSC8144TVT800A |
|
Виробник: NXP USA Inc.
Description: IC DSP QUAD 800MHZ 783FCBGA
Description: IC DSP QUAD 800MHZ 783FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| MSC8144VT1000A |
|
Виробник: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| MSC8144VT800A |
|
Виробник: NXP USA Inc.
Description: IC DSP QUAD 800MHZ 783FCBGA
Description: IC DSP QUAD 800MHZ 783FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| MSC8156EVM |
|
Виробник: NXP USA Inc.
Description: MSC8156 EVAL BRD
Description: MSC8156 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| PPC8306CVMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| PPC8306SCVMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| PPC8306SVMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| PPC8306VMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| PPC8309CVMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| PPC8309VMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
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| RDMMA845X |
Виробник: NXP USA Inc.
Description: KIT FOR LFSTBUSB/E845X
Packaging: Box
Interface: I2C, USB
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Description: KIT FOR LFSTBUSB/E845X
Packaging: Box
Interface: I2C, USB
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
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| S912XDP512F0MAG |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
товару немає в наявності
Мінімальне замовлення: 300 шт
В кошику
од. на суму грн.
| S912XDP512F0MAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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В кошику
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| S912XDQ256F1MAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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В кошику
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| S912XEQ384J3CAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 300 шт
В кошику
од. на суму грн.
| S9S08AW16AE0MLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| S9S08DN16F1MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
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В кошику
од. на суму грн.
| S9S08DN60F1MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
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В кошику
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| S9S08LG16J0CLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 18KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| S9S08LG32J0VLK |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 761.73 грн |
| 10+ | 576.37 грн |
| 80+ | 477.19 грн |
| S9S08QD4J1MSCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 149.07 грн |
| S9S08SG16E1CTJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| S9S12C64J2CFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Number of I/O: 31
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Number of I/O: 31
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| S9S12XS128J1MAA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Description: IC MCU 16BIT 128KB FLASH 80QFP
на замовлення 410 шт:
термін постачання 21-31 дні (днів)
| SPC5516EAMMG66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| SPC5517EAMMG66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
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| SPC5517GAMMG66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
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Мінімальне замовлення: 90 шт
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| SPC5534MVM80 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
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Мінімальне замовлення: 450 шт
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| TWR-MCF51AG |
|
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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| TWR-S08JE128 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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| TWR-S08JE128-KIT |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
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| TWR-WIFI-G1011MI |
Виробник: NXP USA Inc.
Description: TOWER WIFI MOD- GAINSPAN
Description: TOWER WIFI MOD- GAINSPAN
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| PK40X256VMD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144BGA
Description: IC MCU 32BIT 256KB FLASH 144BGA
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| PK40X256VLQ100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Description: IC MCU 32BIT 256KB FLASH 144LQFP
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Мінімальне замовлення: 90 шт
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| PK60N256VMD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Description: IC MCU 32B 256KB FLASH 144MAPBGA
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Мінімальне замовлення: 160 шт
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| SPC5634MF1MLQ80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2483.58 грн |
| 10+ | 1942.23 грн |
| 25+ | 1829.97 грн |
| SPC5634MF1MMG80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
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Мінімальне замовлення: 90 шт
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| S9S08SG16E1MTJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 2500 шт
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| S9S08SG4E2VTGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
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Мінімальне замовлення: 2500 шт
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| MC9S08QB8CTGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5000+ | 123.60 грн |
| MRF8S23120HR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
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| MRF8S23120HSR3 |
Виробник: NXP USA Inc.
Description: FET RF 65V 2.3GHZ NI-780S
Description: FET RF 65V 2.3GHZ NI-780S
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| MRFE6VP61K25HR6 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 300 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 150+ | 22057.31 грн |
| MRFE6VP61K25HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 50+ | 21447.93 грн |
| MRFE6VP61K25HSR6 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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| MPXV2050GP |
|
Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
на замовлення 109 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1363.06 грн |
| 10+ | 1039.09 грн |
| 25+ | 984.40 грн |
| MPVZ5150GC7U |
|
Виробник: NXP USA Inc.
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
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| MPVZ7025DP |
|
Виробник: NXP USA Inc.
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Maximum Pressure: ±29.01PSI (±200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±5%
Pressure Type: Differential
Operating Pressure: ±3.63PSI (±25kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Features: Temperature Compensated
Packaging: Tray
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Maximum Pressure: ±29.01PSI (±200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±5%
Pressure Type: Differential
Operating Pressure: ±3.63PSI (±25kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Features: Temperature Compensated
Packaging: Tray
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| TWR-ADCDAC-LTC |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR LTC1859 LTC2498
Secondary Attributes: For use with Freescale Tower System
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: No
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Type: Data Acquisition
Function: ADC, DAC
Packaging: Box
Description: EVAL BOARD FOR LTC1859 LTC2498
Secondary Attributes: For use with Freescale Tower System
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: No
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Type: Data Acquisition
Function: ADC, DAC
Packaging: Box
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| TRK-MPC5604B |
|
Виробник: NXP USA Inc.
Description: STARTERTRAK MPC5604B EVAL BRD
Description: STARTERTRAK MPC5604B EVAL BRD
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| LPC1224FBD48/121,1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 5464 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 311.51 грн |
| 10+ | 229.46 грн |
| 25+ | 211.77 грн |
| 100+ | 180.50 грн |
| 250+ | 171.80 грн |
| 500+ | 171.39 грн |
| LPC1224FBD64/101,1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| LPC1225FBD48/301,1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| LPC1225FBD64/301,1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 1435 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 445.57 грн |
| 10+ | 329.60 грн |
| 25+ | 304.78 грн |
| 160+ | 253.74 грн |
| 320+ | 245.40 грн |
| 640+ | 238.53 грн |
| 1120+ | 230.05 грн |
| LPC1225FBD64/321,1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| LPC1226FBD48/301,1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 324 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 547.08 грн |
| 10+ | 406.98 грн |
| 25+ | 377.16 грн |
| 100+ | 323.16 грн |
| 250+ | 308.48 грн |