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TWR-S08UNIV TWR-S08UNIV NXP USA Inc. TWRUNIVQSG.pdf Description: TOWER SYST TWR-RS08DC/TWR-S08DC
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1323XDSK 1323XDSK NXP USA Inc. Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
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1323XDSK-BDM 1323XDSK-BDM NXP USA Inc. MC1323x.pdf Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+18586.79 грн
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MCIMX50EVK MCIMX50EVK NXP USA Inc. IMX50EVKFS.pdf Description: I.MX50 EVAL BRD
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX50
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A8
Contents: Board(s)
Type: MPU
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+42761.56 грн
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MC13850EPR2 MC13850EPR2 NXP USA Inc. MC13850.pdf Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.4GHz
P1dB: 2.2dBm
Noise Figure: 1.85dB
Current - Supply: 9.9mA
Gain: 13dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC13852EPR2 MC13852EPR2 NXP USA Inc. MC13852.pdf Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Noise Figure: 1.2dB
Package / Case: 8-UFDFN Exposed Pad
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 900MHz
P1dB: 9.6dBm
Current - Supply: 5.5mA
Gain: 18.3dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
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MRF8P20165WHSR5 MRF8P20165WHSR5 NXP USA Inc. MRF8P20165WH.pdf Description: FET RF 2CH 65V 2.01GHZ NI780S4
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MC9S08GW32CLK MC9S08GW32CLK NXP USA Inc. MC9S08GW64.pdf Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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MMA6805AKW NXP USA Inc. Description: ACCELEROMETER 16QFN
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MMA6555KW MMA6555KW NXP USA Inc. Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tray
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
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MMA6823AKW MMA6823AKW NXP USA Inc. Description: ACCELEROMETER 50G SPI 16QFN
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MCIMX534AVV8CR2 MCIMX534AVV8CR2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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MCIMX536AVV8CR2 MCIMX536AVV8CR2 NXP USA Inc. Description: IC MPU 529FBGA
Part Status: Obsolete
Supplier Device Package: 529-FBGA (19x19)
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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MCIMX537CVV8CR2 MCIMX537CVV8CR2 NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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MRF8P20140WHR3 MRF8P20140WHR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16dB
Power - Output: 24W
Configuration: Dual
Frequency: 1.88GHz ~ 1.91GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
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MRF8P20165WHSR3 MRF8P20165WHSR3 NXP USA Inc. MRF8P20165WH.pdf Description: FET RF 2CH 65V 2.01GHZ NI780S4
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P3041DS-PA NXP USA Inc. P3041DSFS.pdf Description: P3041 EVAL BRD
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DEMO9S12XHY256 DEMO9S12XHY256 NXP USA Inc. Description: MC9S12XHY256 EVAL BRD
Part Status: Active
Type: MCU 16-Bit
Utilized IC / Part: MC9S12XHY256
Core Processor: HCS12X
Contents: Board(s), LCD
Mounting Type: Fixed
Packaging: Box
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TRK-MPC5604P TRK-MPC5604P NXP USA Inc. MPC5604P.pdf Description: STARTERTRAK MPC5604P EVAL BRD
Part Status: Active
Platform: StarterTRAK
Utilized IC / Part: MPC5604P
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+11489.27 грн
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TRK-MPC5634M TRK-MPC5634M NXP USA Inc. MPC5634M.pdf Description: STARTERTRAK MPC5634M EVAL BRD
Platform: StarterTRAK
Utilized IC / Part: MPC5634M
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
1+12524.90 грн
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DSPAUDIOEVMMB1E NXP USA Inc. Description: DSP563XX EVAL BRD
Utilized IC / Part: DSP563xx
Contents: Board(s)
Type: DSP
Mounting Type: Fixed
Packaging: Box
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MX50EBOOKDC1 MX50EBOOKDC1 NXP USA Inc. IMX50FS.pdf Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Utilized IC / Part: i.MX50
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LFDA8451 NXP USA Inc. TWRMECHFS.pdf Description: MMA8451 DEVICE ADPTR BRD
Accessory Type: Adapter Board
For Use With/Related Products: Freescale Tower System, MMA8451Q
Packaging: Box
Part Status: Obsolete
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MC13850-470EVK NXP USA Inc. MC13850.pdf Description: IC MC13850_470_EVK
Packaging: Box
Frequency: 470MHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: MC13850
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MC13850-900HEVK NXP USA Inc. MC13850.pdf Description: IC MC13850_900_HIIP3_EVK
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MC13851-2400EVK NXP USA Inc. MC13851.pdf Description: IC MC13851 EVB 2400MHZ
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MC13852-434EVK NXP USA Inc. MC13852.pdf Description: IC MC13852 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13852
Packaging: Box
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MC13917-1900EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_1900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1.9GHz
For Use With/Related Products: MC13917
Packaging: Box
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MC13917-350EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_350_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 350MHz
For Use With/Related Products: MC13917
Packaging: Box
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MC13917-434EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13917
Packaging: Box
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MC13917-900EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 900MHz
For Use With/Related Products: MC13917
Packaging: Box
Part Status: Obsolete
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MCIMX535DVV1CR2 MCIMX535DVV1CR2 NXP USA Inc. IMX53CEC.pdf Description: IC MPU I.MX53 1.0GHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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PSMN3R7-25YLC,115 PSMN3R7-25YLC,115 NXP USA Inc. PSMN3R7-25YLC.pdf Description: MOSFET N-CH 25V 97A LFPAK56
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 64W (Tc)
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PSMN3R7-30YLC,115 PSMN3R7-30YLC,115 NXP USA Inc. Description: MOSFET N-CH 30V 100A LFPAK56
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
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PESD5V0L6UAS,118 PESD5V0L6UAS,118 NXP USA Inc. Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
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PESD3V3L1UA,115 PESD3V3L1UA,115 NXP USA Inc. PESD3V3L1UA_UB_UL.pdf Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PBSS2540E,115 PBSS2540E,115 NXP USA Inc. PBSS2540E.pdf Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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PMF290XN,115 PMF290XN,115 NXP USA Inc. Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
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BLF6G27LS-50BN,112 NXP USA Inc. Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
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P80C31SFAA,512 P80C31SFAA,512 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C51RA2FA,512 P87C51RA2FA,512 NXP USA Inc. P87C51RA2_RB2_RC2_RD2.pdf Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C552SFAA,512 P87C552SFAA,512 NXP USA Inc. Description: IC MCU 8BIT 8KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
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P87LPC764FDH,512 P87LPC764FDH,512 NXP USA Inc. P87LPC764.pdf Description: IC MCU 8BIT 4KB OTP 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9321FDH,512 P89LPC9321FDH,512 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC933HDH,512 P89LPC933HDH,512 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC983FDH,529 P89LPC983FDH,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC985FA,529 P89LPC985FA,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
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P89LPC985FDH,529 P89LPC985FDH,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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PCF7900NHN/C0K,112 PCF7900NHN/C0K,112 NXP USA Inc. PCF7900NHN_C0K_cm_118.html Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PCF7900VHN/C0L,112 PCF7900VHN/C0L,112 NXP USA Inc. Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PJF7992ATW/C1C,512 PJF7992ATW/C1C,512 NXP USA Inc. Description: IMMOBIL BASESTATION IC 20HTSSOP
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TDA8595J/N2S,112 TDA8595J/N2S,112 NXP USA Inc. TDA8595.pdf Description: IC AMP CLASS AB QUAD 64W DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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ASC8848ET,557 ASC8848ET,557 NXP USA Inc. Description: IC IP CAMERA MPU SXGA 484TFBGA
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ASC8849ET,557 ASC8849ET,557 NXP USA Inc. Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8850ET,557 ASC8850ET,557 NXP USA Inc. Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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LPC1765FET100,551 LPC1765FET100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1774FBD208,551 LPC1774FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 128KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
1+1087.06 грн
10+829.74 грн
36+757.44 грн
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LPC1776FBD208,551 LPC1776FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
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LPC1776FET180,551 LPC1776FET180,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
на замовлення 82 шт:
термін постачання 21-31 дні (днів)
1+935.95 грн
10+710.82 грн
25+663.21 грн
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LPC1778FBD144,551 LPC1778FBD144,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
DigiKey Programmable: Not Verified
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TWR-S08UNIV TWRUNIVQSG.pdf
TWR-S08UNIV
Виробник: NXP USA Inc.
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
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1323XDSK
1323XDSK
Виробник: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
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1323XDSK-BDM MC1323x.pdf
1323XDSK-BDM
Виробник: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+18586.79 грн
В кошику  од. на суму  грн.
MCIMX50EVK IMX50EVKFS.pdf
MCIMX50EVK
Виробник: NXP USA Inc.
Description: I.MX50 EVAL BRD
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX50
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A8
Contents: Board(s)
Type: MPU
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+42761.56 грн
В кошику  од. на суму  грн.
MC13850EPR2 MC13850.pdf
MC13850EPR2
Виробник: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.4GHz
P1dB: 2.2dBm
Noise Figure: 1.85dB
Current - Supply: 9.9mA
Gain: 13dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC13852EPR2 MC13852.pdf
MC13852EPR2
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Noise Figure: 1.2dB
Package / Case: 8-UFDFN Exposed Pad
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 900MHz
P1dB: 9.6dBm
Current - Supply: 5.5mA
Gain: 18.3dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
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MRF8P20165WHSR5 MRF8P20165WH.pdf
MRF8P20165WHSR5
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
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MC9S08GW32CLK MC9S08GW64.pdf
MC9S08GW32CLK
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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MMA6805AKW
Виробник: NXP USA Inc.
Description: ACCELEROMETER 16QFN
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MMA6555KW
MMA6555KW
Виробник: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tray
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
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MMA6823AKW
MMA6823AKW
Виробник: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
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MCIMX534AVV8CR2
MCIMX534AVV8CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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MCIMX536AVV8CR2
MCIMX536AVV8CR2
Виробник: NXP USA Inc.
Description: IC MPU 529FBGA
Part Status: Obsolete
Supplier Device Package: 529-FBGA (19x19)
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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MCIMX537CVV8CR2 IMX53IEC.pdf
MCIMX537CVV8CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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MRF8P20140WHR3
MRF8P20140WHR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16dB
Power - Output: 24W
Configuration: Dual
Frequency: 1.88GHz ~ 1.91GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
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MRF8P20165WHSR3 MRF8P20165WH.pdf
MRF8P20165WHSR3
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
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P3041DS-PA P3041DSFS.pdf
Виробник: NXP USA Inc.
Description: P3041 EVAL BRD
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DEMO9S12XHY256
DEMO9S12XHY256
Виробник: NXP USA Inc.
Description: MC9S12XHY256 EVAL BRD
Part Status: Active
Type: MCU 16-Bit
Utilized IC / Part: MC9S12XHY256
Core Processor: HCS12X
Contents: Board(s), LCD
Mounting Type: Fixed
Packaging: Box
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TRK-MPC5604P MPC5604P.pdf
TRK-MPC5604P
Виробник: NXP USA Inc.
Description: STARTERTRAK MPC5604P EVAL BRD
Part Status: Active
Platform: StarterTRAK
Utilized IC / Part: MPC5604P
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11489.27 грн
В кошику  од. на суму  грн.
TRK-MPC5634M MPC5634M.pdf
TRK-MPC5634M
Виробник: NXP USA Inc.
Description: STARTERTRAK MPC5634M EVAL BRD
Platform: StarterTRAK
Utilized IC / Part: MPC5634M
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+12524.90 грн
В кошику  од. на суму  грн.
DSPAUDIOEVMMB1E
Виробник: NXP USA Inc.
Description: DSP563XX EVAL BRD
Utilized IC / Part: DSP563xx
Contents: Board(s)
Type: DSP
Mounting Type: Fixed
Packaging: Box
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MX50EBOOKDC1 IMX50FS.pdf
MX50EBOOKDC1
Виробник: NXP USA Inc.
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Utilized IC / Part: i.MX50
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LFDA8451 TWRMECHFS.pdf
Виробник: NXP USA Inc.
Description: MMA8451 DEVICE ADPTR BRD
Accessory Type: Adapter Board
For Use With/Related Products: Freescale Tower System, MMA8451Q
Packaging: Box
Part Status: Obsolete
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MC13850-470EVK MC13850.pdf
Виробник: NXP USA Inc.
Description: IC MC13850_470_EVK
Packaging: Box
Frequency: 470MHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: MC13850
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MC13850-900HEVK MC13850.pdf
Виробник: NXP USA Inc.
Description: IC MC13850_900_HIIP3_EVK
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MC13851-2400EVK MC13851.pdf
Виробник: NXP USA Inc.
Description: IC MC13851 EVB 2400MHZ
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MC13852-434EVK MC13852.pdf
Виробник: NXP USA Inc.
Description: IC MC13852 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13852
Packaging: Box
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MC13917-1900EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917_1900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1.9GHz
For Use With/Related Products: MC13917
Packaging: Box
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MC13917-350EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917_350_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 350MHz
For Use With/Related Products: MC13917
Packaging: Box
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MC13917-434EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13917
Packaging: Box
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MC13917-900EVK MBC13917.pdf
Виробник: NXP USA Inc.
Description: IC MC13917_900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 900MHz
For Use With/Related Products: MC13917
Packaging: Box
Part Status: Obsolete
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MCIMX535DVV1CR2 IMX53CEC.pdf
MCIMX535DVV1CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
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PSMN3R7-25YLC,115 PSMN3R7-25YLC.pdf
PSMN3R7-25YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 97A LFPAK56
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 64W (Tc)
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PSMN3R7-30YLC,115
PSMN3R7-30YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
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PESD5V0L6UAS,118
PESD5V0L6UAS,118
Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
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PESD3V3L1UA,115 PESD3V3L1UA_UB_UL.pdf
PESD3V3L1UA,115
Виробник: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PBSS2540E,115 PBSS2540E.pdf
PBSS2540E,115
Виробник: NXP USA Inc.
Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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PMF290XN,115
PMF290XN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
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BLF6G27LS-50BN,112
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
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P80C31SFAA,512 80C31_80C32.pdf
P80C31SFAA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C51RA2FA,512 P87C51RA2_RB2_RC2_RD2.pdf
P87C51RA2FA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C552SFAA,512
P87C552SFAA,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
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P87LPC764FDH,512 P87LPC764.pdf
P87LPC764FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9321FDH,512 P89LPC9321.pdf
P89LPC9321FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC933HDH,512 P89LPC933_934_935_936.pdf
P89LPC933HDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC983FDH,529 P89LPC980_982_983_985.pdf
P89LPC983FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC985FA,529 P89LPC980_982_983_985.pdf
P89LPC985FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
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P89LPC985FDH,529 P89LPC980_982_983_985.pdf
P89LPC985FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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PCF7900NHN/C0K,112 PCF7900NHN_C0K_cm_118.html
PCF7900NHN/C0K,112
Виробник: NXP USA Inc.
Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PCF7900VHN/C0L,112
PCF7900VHN/C0L,112
Виробник: NXP USA Inc.
Description: RF TX IC UHF 315/434MHZ 16VFQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: UHF
Data Interface: PCB, Surface Mount
Power - Output: 6dBm
Applications: General Purpose
Current - Transmitting: 7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
DigiKey Programmable: Not Verified
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PJF7992ATW/C1C,512
PJF7992ATW/C1C,512
Виробник: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
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TDA8595J/N2S,112 TDA8595.pdf
TDA8595J/N2S,112
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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ASC8848ET,557
ASC8848ET,557
Виробник: NXP USA Inc.
Description: IC IP CAMERA MPU SXGA 484TFBGA
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ASC8849ET,557
ASC8849ET,557
Виробник: NXP USA Inc.
Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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ASC8850ET,557
ASC8850ET,557
Виробник: NXP USA Inc.
Description: IC IP CAMERA MPU SXGA 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
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LPC1765FET100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1765FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1774FBD208,551 LPC178X_7X.pdf
LPC1774FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1087.06 грн
10+829.74 грн
36+757.44 грн
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LPC1776FBD208,551 LPC178X_7X.pdf
LPC1776FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
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LPC1776FET180,551 LPC178X_7X.pdf
LPC1776FET180,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 141
DigiKey Programmable: Not Verified
на замовлення 82 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+935.95 грн
10+710.82 грн
25+663.21 грн
В кошику  од. на суму  грн.
LPC1778FBD144,551 LPC178X_7X.pdf
LPC1778FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
DigiKey Programmable: Not Verified
товару немає в наявності
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