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546-87-365-17-091147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 365POS GOLD
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546-87-391-18-101147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 391POS GOLD
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546-87-403-19-111147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 403POS GOLD
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546-87-419-19-111147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 419POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 419 (19 x 19)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Bronze
Part Status: Active
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546-87-420-19-111147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 420POS GOLD
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546-87-447-20-121147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 447POS GOLD
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546-87-463-19-101147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 463POS GOLD
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546-87-503-22-131147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 503POS GOLD
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546-87-528-21-121147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 528POS GOLD
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546-87-529-21-121147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 529POS GOLD
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546-87-545-17-000147 Preci-Dip Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147 Description: CONN SOCKET PGA 545POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 545 (17 x 17)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Bronze
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550-10-037-10-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-056-09-041101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (9 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-068-10-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-068-11-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-068-11-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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550-10-069-11-001101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-069-11-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-072-11-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-084-10-031101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (10 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-084-13-081101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-100-15-001101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-114-13-062101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-121-13-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-124-13-041101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-132-13-041101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-132-14-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-133-14-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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550-10-144-12-000101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-144-15-081101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-145-15-001101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-149-15-063101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-169-17-101101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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550-10-191-18-091101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 191 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
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550-10-192M16-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-192M16-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-225-18-091101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
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550-10-241-18-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 241 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
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550-10-255M16-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-255M16-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-256M16-000152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-256M16-000166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-256M20-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
550-10-256M20-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
550-10-272M20-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 272 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-272M20-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 272 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-292M20-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 292 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-292M20-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 292 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
550-10-296-19-131135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-10-352M26-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 352 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-352M26-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 352 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-356M26-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-356M26-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-357M19-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-357M19-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-360M19-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-360M19-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-361-18-101135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-10-381-18-101135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 381 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-388M26-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
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В кошику  од. на суму  грн.
546-87-365-17-091147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 365POS GOLD
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В кошику  од. на суму  грн.
546-87-391-18-101147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 391POS GOLD
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В кошику  од. на суму  грн.
546-87-403-19-111147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 403POS GOLD
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В кошику  од. на суму  грн.
546-87-419-19-111147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 419POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 419 (19 x 19)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Bronze
Part Status: Active
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В кошику  од. на суму  грн.
546-87-420-19-111147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 420POS GOLD
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В кошику  од. на суму  грн.
546-87-447-20-121147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 447POS GOLD
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В кошику  од. на суму  грн.
546-87-463-19-101147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 463POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
546-87-503-22-131147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 503POS GOLD
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В кошику  од. на суму  грн.
546-87-528-21-121147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 528POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
546-87-529-21-121147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 529POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
546-87-545-17-000147 Default.aspx?c=12&i=1342&p=299&pdf=1&dsku=546-PP-NNN-XX-XXX147
Виробник: Preci-Dip
Description: CONN SOCKET PGA 545POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 545 (17 x 17)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Bronze
товару немає в наявності
В кошику  од. на суму  грн.
550-10-037-10-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-056-09-041101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (9 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-068-10-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-068-11-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-068-11-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-069-11-001101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-069-11-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-072-11-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-084-10-031101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (10 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-084-13-081101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-100-15-001101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-114-13-062101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-121-13-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-124-13-041101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-132-13-041101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-132-14-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-133-14-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-144-12-000101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-144-15-081101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-145-15-001101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-149-15-063101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-169-17-101101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-191-18-091101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 191 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-192M16-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-192M16-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-225-18-091101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-241-18-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 241 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-255M16-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-255M16-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-256M16-000152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-256M16-000166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-256M20-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-256M20-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-272M20-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 272 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-272M20-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 272 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-292M20-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 292 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-292M20-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 292 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-296-19-131135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-352M26-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 352 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-352M26-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 352 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-356M26-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-356M26-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-357M19-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-357M19-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 357 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-360M19-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-360M19-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-361-18-101135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
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550-10-381-18-101135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 381 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-388M26-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
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