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550-10-388M26-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 388 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-400M20-000152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 400 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-400M20-000166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 400 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-420M26-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 420 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-420M26-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 420 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-432M31-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-432M31-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-456M26-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 456 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-456M26-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 456 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-478M26-131152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-478M26-131166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-480M29-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 480 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-480M29-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 480 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-500M30-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 500 (30 x 30)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-500M30-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 500 (30 x 30)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-504M29-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-504M29-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
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550-10-520M31-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 520 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-520M31-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
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550-10-560M33-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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В кошику  од. на суму  грн.
550-10-560M33-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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550-10-576M30-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
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550-10-576M30-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
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550-10-600M35-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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550-10-600M35-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
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550-10-652M35-001152 Preci-Dip Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152 Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
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550-10-652M35-001166 Preci-Dip Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166 Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
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550-80-037-10-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 37 (10 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
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550-80-056-09-041101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (9 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
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550-80-068-10-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-068-11-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-068-11-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
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В кошику  од. на суму  грн.
550-80-069-11-001101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-069-11-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-072-11-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-084-10-031101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-084-13-081101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-100-15-001101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-114-13-062101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-121-13-061101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-124-13-041101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 124 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-132-13-041101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-132-14-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-133-14-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-144-12-000101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-144-15-081101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-145-15-001101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-149-15-063101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-169-17-101101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-191-18-091101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 191 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-225-18-091101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-80-241-18-071101 Preci-Dip Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101 Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 241 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-80-296-19-131135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
550-80-361-18-101135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
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550-80-381-18-101135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
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В кошику  од. на суму  грн.
558-10-192M16-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
558-10-192M16-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
558-10-255M16-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
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В кошику  од. на суму  грн.
558-10-255M16-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
558-10-256M16-000101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
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В кошику  од. на суму  грн.
550-10-388M26-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 388 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-400M20-000152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 400 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-400M20-000166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 400 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-420M26-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 420 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-420M26-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 420 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-432M31-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-432M31-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 432 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-456M26-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 456 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-456M26-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 456 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-478M26-131152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-478M26-131166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-480M29-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 480 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-480M29-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 480 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-500M30-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 500 (30 x 30)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-500M30-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 500 (30 x 30)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-504M29-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-504M29-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-520M31-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 520 (31 x 31)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-520M31-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
товару немає в наявності
В кошику  од. на суму  грн.
550-10-560M33-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-560M33-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-10-576M30-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-10-576M30-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
товару немає в наявності
В кошику  од. на суму  грн.
550-10-600M35-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-600M35-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-652M35-001152 Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152
Виробник: Preci-Dip
Description: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-10-652M35-001166 Default.aspx?c=12&i=1382&p=315&pdf=1&dsku=550-10-NNNMXX-XXX166
Виробник: Preci-Dip
Description: BGA PIN ADAPTER 1.27MM SMD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-80-037-10-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 37 (10 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-056-09-041101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (9 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-068-10-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-068-11-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-068-11-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-80-069-11-001101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-069-11-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-072-11-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-084-10-031101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-084-13-081101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-100-15-001101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-114-13-062101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-121-13-061101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-124-13-041101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 124 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-132-13-041101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-132-14-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-133-14-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-144-12-000101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-144-15-081101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-145-15-001101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-149-15-063101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-169-17-101101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-191-18-091101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 191 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
550-80-225-18-091101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-80-241-18-071101 Default.aspx?c=12&i=1352&p=304&pdf=1&dsku=550-PP-NNN-XX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 241 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
550-80-296-19-131135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-361-18-101135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
550-80-381-18-101135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Виробник: Preci-Dip
Description: PGA SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
558-10-192M16-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
558-10-192M16-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Виробник: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
558-10-255M16-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
товару немає в наявності
В кошику  од. на суму  грн.
558-10-255M16-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Виробник: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
558-10-256M16-000101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Виробник: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
товару немає в наявності
В кошику  од. на суму  грн.
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