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84-537-21-7 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: CONN SOCKET PLCC ZIF 84POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 84 (4 x 21)
Type: PLCC, ZIF (ZIP)
Features: Closed Frame
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1110832 1110832 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: 538 ZIF TEST SCKT INSERT PLATES
Packaging: Bulk
Features: 7 Plates
Color: Black
For Use With/Related Products: PLCC Sockets
Accessory Type: Insert Plate
Body Material: Polyphenylene Sulfide (PPS), Glass Filled
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+9478.67 грн
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24-516-11S Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
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24-516-11M Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
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28-516-11S Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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40-516-11S Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+1602.90 грн
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24-526-11 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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40-526-11 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
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24-3574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-6574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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24-3572-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3572-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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24-3572-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
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24-3573-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3573-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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24-3574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3574-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3575-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-6571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-6572-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
24-6572-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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24-6572-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
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24-6573-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-6574-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-6575-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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44-3573-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 44 (2 x 22)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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28-3574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
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В кошику  од. на суму  грн.
28-6572-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
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В кошику  од. на суму  грн.
28-6573-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
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24-3570-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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24-3570-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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24-3570-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
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24-3571-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
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24-3573-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
24-6570-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
24-6570-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
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24-6571-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
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24-6573-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
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В кошику  од. на суму  грн.
24-6573-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
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В кошику  од. на суму  грн.
28-3571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3571-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3572-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
28-3572-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
28-3572-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3573-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-3573-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
товару немає в наявності
В кошику  од. на суму  грн.
28-3574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3574-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
товару немає в наявності
В кошику  од. на суму  грн.
28-3574-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
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В кошику  од. на суму  грн.
28-6571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-6572-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-6572-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
28-6572-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
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В кошику  од. на суму  грн.
28-6573-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
28-6574-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3575-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
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В кошику  од. на суму  грн.
84-537-21-7 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PLCC ZIF 84POS GOLD
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 84 (4 x 21)
Type: PLCC, ZIF (ZIP)
Features: Closed Frame
товару немає в наявності
В кошику  од. на суму  грн.
1110832 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
1110832
Виробник: Aries Electronics
Description: 538 ZIF TEST SCKT INSERT PLATES
Packaging: Bulk
Features: 7 Plates
Color: Black
For Use With/Related Products: PLCC Sockets
Accessory Type: Insert Plate
Body Material: Polyphenylene Sulfide (PPS), Glass Filled
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9478.67 грн
В кошику  од. на суму  грн.
24-516-11S 516.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
24-516-11M 516.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
28-516-11S 516.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
40-516-11S 516.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1602.90 грн
В кошику  од. на суму  грн.
24-526-11 10018-low-profile-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
40-526-11 10018-low-profile-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-3574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-3572-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3572-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-3572-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товару немає в наявності
В кошику  од. на суму  грн.
24-3573-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3573-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-3574-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3574-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3574-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3575-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6572-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
24-6572-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-6572-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товару немає в наявності
В кошику  од. на суму  грн.
24-6573-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6574-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
44-3573-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 44 (2 x 22)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
28-6572-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
28-6573-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3570-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3570-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-3570-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товару немає в наявності
В кошику  од. на суму  грн.
24-3571-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
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В кошику  од. на суму  грн.
24-3573-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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24-6570-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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24-6570-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
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24-6571-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
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24-6573-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
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24-6573-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
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28-3571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
28-3571-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
28-3572-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
28-3572-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
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В кошику  од. на суму  грн.
28-3572-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
28-3573-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
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В кошику  од. на суму  грн.
28-3573-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
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В кошику  од. на суму  грн.
28-3574-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
28-3574-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
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В кошику  од. на суму  грн.
28-3574-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
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28-6571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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В кошику  од. на суму  грн.
28-6572-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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В кошику  од. на суму  грн.
28-6572-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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В кошику  од. на суму  грн.
28-6572-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
28-6573-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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В кошику  од. на суму  грн.
28-6574-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
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24-3575-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
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