Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15982) > Сторінка 16 з 267

Обрати Сторінку:   [  << Попередня Сторінка ]  1 11 12 13 14 15 16 17 18 19 20 21 26 52 78 104 130 156 182 208 234 260 267  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
24-6570-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
24-3575-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3575-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
28-3570-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3570-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
28-3570-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
28-3571-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
28-3573-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6570-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-6570-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6570-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
товару немає в наявності
В кошику  од. на суму  грн.
28-6571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-6571-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
28-6573-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-6573-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6572-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
32-6574-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
32-6570-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
36-6572-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 36POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
44-6571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
44-6571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 44POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6575-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
40-3574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
40-6574-18 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3570-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3570-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3570-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3571-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3572-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3572-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3572-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3573-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3573-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3573-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6570-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
32-6570-16 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6571-10 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-6571-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
24-6570-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
24-3575-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-3575-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6575-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
28-3570-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3570-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
28-3570-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
28-3571-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
28-3573-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6570-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-6570-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6570-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
товару немає в наявності
В кошику  од. на суму  грн.
28-6571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-6571-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
28-6573-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
28-6573-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Number of Positions or Pins (Grid): 28 (2 x 14)
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3574-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6572-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
32-6574-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-11 10001-universal-dip-zif-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
товару немає в наявності
В кошику  од. на суму  грн.
28-3575-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
28-6575-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
32-6570-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
36-6572-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
44-6571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
44-6571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 44POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6575-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
40-3574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
40-6574-18 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3570-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3570-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3570-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3571-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3572-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3572-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3572-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3573-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-3573-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
32-3573-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-3575-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6570-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
32-6570-16 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS
товару немає в наявності
В кошику  од. на суму  грн.
32-6571-10 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-6571-11 10019-universal-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS GLD
товару немає в наявності
В кошику  од. на суму  грн.
Обрати Сторінку:   [  << Попередня Сторінка ]  1 11 12 13 14 15 16 17 18 19 20 21 26 52 78 104 130 156 182 208 234 260 267  [ Наступна Сторінка >> ]