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DSC1001DL2-003.6864T DSC1001DL2-003.6864T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC LOW POWER 3.6864MHZ LVC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.6864 MHz
Base Resonator: MEMS
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DSC1001DL2-049.5000T DSC1001DL2-049.5000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 49.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.5 MHz
Base Resonator: MEMS
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DSC1001DL2-040.0000T DSC1001DL2-040.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC1001DL1-001.8432T DSC1001DL1-001.8432T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC1001DL2-045.1584T DSC1001DL2-045.1584T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 45.1584MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 45.1584 MHz
Base Resonator: MEMS
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DSC1001DL2-048.0000T DSC1001DL2-048.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 48.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 48 MHz
Base Resonator: MEMS
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DSC1001DL1-005.0196T DSC1001DL1-005.0196T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 5.0196MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5.0196 MHz
Base Resonator: MEMS
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DSC1001DL2-037.1250T DSC1001DL2-037.1250T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ LVCMOS
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001DL2-049.1520T DSC1001DL2-049.1520T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 49.1520MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.152 MHz
Base Resonator: MEMS
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DSC1001DL1-004.0960T DSC1001DL1-004.0960T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0960MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.096 MHz
Base Resonator: MEMS
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DSC1001DL1-004.0000T DSC1001DL1-004.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC1001DL2-072.0000T DSC1001DL2-072.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 72.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 72 MHz
Base Resonator: MEMS
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DSC1001DL2-033.3333T DSC1001DL2-033.3333T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 33.3333MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.3333 MHz
Base Resonator: MEMS
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DSC1001DL1-010.0000T DSC1001DL1-010.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1001DL2-033.3300T DSC1001DL2-033.3300T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC 33.33MHZ LVCMOS 25PPM 2
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33 MHz
Base Resonator: MEMS
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DSC1001DL1-033.3300T DSC1001DL1-033.3300T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33 MHz
Base Resonator: MEMS
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DSC1001DL1-007.3728T DSC1001DL1-007.3728T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC1001DL3-024.0000T DSC1001DL3-024.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001DL1-012.5000T DSC1001DL1-012.5000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.5 MHz
Base Resonator: MEMS
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DSC1001DL1-016.0000T DSC1001DL1-016.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001DL1-033.3333T DSC1001DL1-033.3333T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 33.3333MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.3333 MHz
Base Resonator: MEMS
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DSC1001DL2-012.2880T DSC1001DL2-012.2880T Microchip Technology Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
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DSC1001DL1-024.0000T DSC1001DL1-024.0000T Microchip Technology Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001DL2-012.5000T DSC1001DL2-012.5000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.5 MHz
Base Resonator: MEMS
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PIC32CM5164JH01100-I/PF-SL3 PIC32CM5164JH01100-I/PF-SL3 Microchip Technology PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf Description: TQFP100, 512KB FLASH, 48MHZ, TRA
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 20x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 84
DigiKey Programmable: Not Verified
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ATSAMA5D28B-CU ATSAMA5D28B-CU Microchip Technology SAMA5D2_Series_7-24-17.pdf Description: IC MPU SAMA5D2 500MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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PIC18F25K40T-I/SO PIC18F25K40T-I/SO Microchip Technology PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 3200 шт:
термін постачання 21-31 дні (днів)
1600+109.72 грн
Мінімальне замовлення: 1600
В кошику  од. на суму  грн.
PIC18F25K40T-I/SO PIC18F25K40T-I/SO Microchip Technology PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 4749 шт:
термін постачання 21-31 дні (днів)
3+131.83 грн
25+116.46 грн
100+105.65 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC18LF25K40T-I/SO PIC18LF25K40T-I/SO Microchip Technology PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF25K40T-I/SO PIC18LF25K40T-I/SO Microchip Technology PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC64GX1000-V/FCV PIC64GX1000-V/FCV Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-C/FCV PIC64GX1000-C/FCV Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-C/FCS PIC64GX1000-C/FCS Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
1+2577.10 грн
25+2067.89 грн
В кошику  од. на суму  грн.
PIC64GX1000-V/FCS PIC64GX1000-V/FCS Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
1+2863.16 грн
25+2298.25 грн
В кошику  од. на суму  грн.
PIC64GX1000-C/FCVP PIC64GX1000-C/FCVP Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-V/FCSP PIC64GX1000-V/FCSP Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-C/FCSP PIC64GX1000-C/FCSP Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-V/FCVP PIC64GX1000-V/FCVP Microchip Technology PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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SY100EL16VAZG-TR SY100EL16VAZG-TR Microchip Technology sy10-100el16va-vf.pdf Description: IC RCVR DIFF 3.3/5V 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 1
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-SOIC
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SY100EL16VAZG-TR SY100EL16VAZG-TR Microchip Technology sy10-100el16va-vf.pdf Description: IC RCVR DIFF 3.3/5V 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 1
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-SOIC
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ATMEGA164A-MCHR ATMEGA164A-MCHR Microchip Technology ATMEGA164A%20Datasheet.PDF Description: IC MCU 8BIT 16KB FLASH 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-QFN (5x5)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AVR16DU20-I/SS AVR16DU20-I/SS Microchip Technology AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 14
на замовлення 576 шт:
термін постачання 21-31 дні (днів)
5+81.85 грн
25+71.79 грн
100+65.44 грн
Мінімальне замовлення: 5
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MPLAD30KP130A/TR MPLAD30KP130A/TR Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130A MAPLAD30KP130A Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130Ae3 MAPLAD30KP130Ae3 Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130CA MAPLAD30KP130CA Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130CAe3 MAPLAD30KP130CAe3 Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD30KP130CAE3/TR MXPLAD30KP130CAE3/TR Microchip Technology Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD30KP130CA/TR MXPLAD30KP130CA/TR Microchip Technology Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ8110CA90144-I/LUX-SL3 Microchip Technology Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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PIC32CZ4010CA90176-I/5MX-SL3 Microchip Technology Description: CM7,4MB FLASH,CONNECTIVITY,176BG
Packaging: Tray
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PIC32CZ4010CA90144-I/LUX-SL3 Microchip Technology Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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PIC32CZ8110CA90176-I/5MX-SL3 Microchip Technology Description: CM7,8MB FLASH,CONNECTIVITY,176BG
Packaging: Tray
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JAN1N5809URS/TR JAN1N5809URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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JANTX1N5809URS/TR JANTX1N5809URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5809URS/TR JANTXV1N5809URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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1N5809URS/TR 1N5809URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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1N5809URS/TR 1N5809URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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JANS1N5809URS/TR JANS1N5809URS/TR Microchip Technology 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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RNBD350UE-I100 Microchip Technology RNBD350-Bluetooth-Low-Energy-Module-Data-Sheet-DS70005561.pdf Description: BLUETOOTH LE 5.2 RN MODULE, U.FL
Packaging: Tray
Package / Case: 30-SMD Module
Sensitivity: -108dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.2
Current - Receiving: 16mA ~ 20mA
Current - Transmitting: 22mA ~ 49mA
Antenna Type: Antenna Not Included, U.FL
Modulation: GFSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, UART
на замовлення 324 шт:
термін постачання 21-31 дні (днів)
1+422.19 грн
100+380.98 грн
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DSC1001DL2-003.6864T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-003.6864T
Виробник: Microchip Technology
Description: MEMS OSC LOW POWER 3.6864MHZ LVC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.6864 MHz
Base Resonator: MEMS
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DSC1001DL2-049.5000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-049.5000T
Виробник: Microchip Technology
Description: MEMS OSC XO 49.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.5 MHz
Base Resonator: MEMS
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DSC1001DL2-040.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-040.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC1001DL1-001.8432T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-001.8432T
Виробник: Microchip Technology
Description: MEMS OSC XO 1.8432MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.8432 MHz
Base Resonator: MEMS
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DSC1001DL2-045.1584T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-045.1584T
Виробник: Microchip Technology
Description: MEMS OSC XO 45.1584MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 45.1584 MHz
Base Resonator: MEMS
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DSC1001DL2-048.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-048.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 48.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 48 MHz
Base Resonator: MEMS
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DSC1001DL1-005.0196T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-005.0196T
Виробник: Microchip Technology
Description: MEMS OSC XO 5.0196MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5.0196 MHz
Base Resonator: MEMS
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DSC1001DL2-037.1250T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-037.1250T
Виробник: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ LVCMOS
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001DL2-049.1520T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-049.1520T
Виробник: Microchip Technology
Description: MEMS OSC XO 49.1520MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.152 MHz
Base Resonator: MEMS
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DSC1001DL1-004.0960T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-004.0960T
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0960MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.096 MHz
Base Resonator: MEMS
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DSC1001DL1-004.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-004.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC1001DL2-072.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-072.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 72.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 72 MHz
Base Resonator: MEMS
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DSC1001DL2-033.3333T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-033.3333T
Виробник: Microchip Technology
Description: MEMS OSC XO 33.3333MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.3333 MHz
Base Resonator: MEMS
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DSC1001DL1-010.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-010.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1001DL2-033.3300T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-033.3300T
Виробник: Microchip Technology
Description: MEMS OSC 33.33MHZ LVCMOS 25PPM 2
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33 MHz
Base Resonator: MEMS
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DSC1001DL1-033.3300T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-033.3300T
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33 MHz
Base Resonator: MEMS
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DSC1001DL1-007.3728T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-007.3728T
Виробник: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC1001DL3-024.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL3-024.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001DL1-012.5000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-012.5000T
Виробник: Microchip Technology
Description: MEMS OSC XO 12.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.5 MHz
Base Resonator: MEMS
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DSC1001DL1-016.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-016.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001DL1-033.3333T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-033.3333T
Виробник: Microchip Technology
Description: MEMS OSC XO 33.3333MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.3333 MHz
Base Resonator: MEMS
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DSC1001DL2-012.2880T
DSC1001DL2-012.2880T
Виробник: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
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DSC1001DL1-024.0000T
DSC1001DL1-024.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001DL2-012.5000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-012.5000T
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.5 MHz
Base Resonator: MEMS
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PIC32CM5164JH01100-I/PF-SL3 PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf
PIC32CM5164JH01100-I/PF-SL3
Виробник: Microchip Technology
Description: TQFP100, 512KB FLASH, 48MHZ, TRA
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 20x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 84
DigiKey Programmable: Not Verified
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ATSAMA5D28B-CU SAMA5D2_Series_7-24-17.pdf
ATSAMA5D28B-CU
Виробник: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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PIC18F25K40T-I/SO PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf
PIC18F25K40T-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 3200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1600+109.72 грн
Мінімальне замовлення: 1600
В кошику  од. на суму  грн.
PIC18F25K40T-I/SO PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf
PIC18F25K40T-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 4749 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+131.83 грн
25+116.46 грн
100+105.65 грн
Мінімальне замовлення: 3
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PIC18LF25K40T-I/SO PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf
PIC18LF25K40T-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF25K40T-I/SO PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf
PIC18LF25K40T-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC64GX1000-V/FCV PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-V/FCV
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-C/FCV PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-C/FCV
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-C/FCS PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-C/FCS
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2577.10 грн
25+2067.89 грн
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PIC64GX1000-V/FCS PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-V/FCS
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2863.16 грн
25+2298.25 грн
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PIC64GX1000-C/FCVP PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-C/FCVP
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-V/FCSP PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-V/FCSP
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-C/FCSP PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-C/FCSP
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 325-CSPBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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PIC64GX1000-V/FCVP PIC64GX1000-64-bit-Microprocessor-Data-Sheet-DS50003724.pdf
PIC64GX1000-V/FCVP
Виробник: Microchip Technology
Description: 64-BIT MPU, RISC-V QUAD-CORE, 4X
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Speed: 625MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: RV64GC
Voltage - I/O: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 484-FBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: RV64IMAC
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: HDMI, MIPI-CSI2
Security Features: AES, Boot Security, Cryptography, SHA, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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SY100EL16VAZG-TR sy10-100el16va-vf.pdf
SY100EL16VAZG-TR
Виробник: Microchip Technology
Description: IC RCVR DIFF 3.3/5V 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 1
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-SOIC
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SY100EL16VAZG-TR sy10-100el16va-vf.pdf
SY100EL16VAZG-TR
Виробник: Microchip Technology
Description: IC RCVR DIFF 3.3/5V 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 1
Logic Type: Differential Receiver
Operating Temperature: -40°C ~ 85°C
Supply Voltage: 3.3V, 5V
Supplier Device Package: 8-SOIC
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ATMEGA164A-MCHR ATMEGA164A%20Datasheet.PDF
ATMEGA164A-MCHR
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-QFN (5x5)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AVR16DU20-I/SS AVR32-16DU-14-20-28-32-Prelim-DataSheet-DS40002576.pdf
AVR16DU20-I/SS
Виробник: Microchip Technology
Description: 16KB, 2KB SRAM, 24MHZ, USB, 10B
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 14
на замовлення 576 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+81.85 грн
25+71.79 грн
100+65.44 грн
Мінімальне замовлення: 5
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MPLAD30KP130A/TR 9523-mplad30kp-datasheet
MPLAD30KP130A/TR
Виробник: Microchip Technology
Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130A 9523-mplad30kp-datasheet
MAPLAD30KP130A
Виробник: Microchip Technology
Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130Ae3 9523-mplad30kp-datasheet
MAPLAD30KP130Ae3
Виробник: Microchip Technology
Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130CA 9523-mplad30kp-datasheet
MAPLAD30KP130CA
Виробник: Microchip Technology
Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD30KP130CAe3 9523-mplad30kp-datasheet
MAPLAD30KP130CAe3
Виробник: Microchip Technology
Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD30KP130CAE3/TR
MXPLAD30KP130CAE3/TR
Виробник: Microchip Technology
Description: TVS DIODE 130VWM 209VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD30KP130CA/TR
MXPLAD30KP130CA/TR
Виробник: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 142A
Voltage - Reverse Standoff (Typ): 130V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 144V
Voltage - Clamping (Max) @ Ipp: 209V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ8110CA90144-I/LUX-SL3
Виробник: Microchip Technology
Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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PIC32CZ4010CA90176-I/5MX-SL3
Виробник: Microchip Technology
Description: CM7,4MB FLASH,CONNECTIVITY,176BG
Packaging: Tray
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PIC32CZ4010CA90144-I/LUX-SL3
Виробник: Microchip Technology
Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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PIC32CZ8110CA90176-I/5MX-SL3
Виробник: Microchip Technology
Description: CM7,8MB FLASH,CONNECTIVITY,176BG
Packaging: Tray
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JAN1N5809URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JAN1N5809URS/TR
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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JANTX1N5809URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JANTX1N5809URS/TR
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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JANTXV1N5809URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JANTXV1N5809URS/TR
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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1N5809URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
1N5809URS/TR
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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1N5809URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
1N5809URS/TR
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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JANS1N5809URS/TR 1N5807US%2C%201N5809US%2C%201N5811US%2CURS.pdf
JANS1N5809URS/TR
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 3A B SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Qualification: MIL-PRF-19500/477
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RNBD350UE-I100 RNBD350-Bluetooth-Low-Energy-Module-Data-Sheet-DS70005561.pdf
Виробник: Microchip Technology
Description: BLUETOOTH LE 5.2 RN MODULE, U.FL
Packaging: Tray
Package / Case: 30-SMD Module
Sensitivity: -108dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.2
Current - Receiving: 16mA ~ 20mA
Current - Transmitting: 22mA ~ 49mA
Antenna Type: Antenna Not Included, U.FL
Modulation: GFSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, UART
на замовлення 324 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+422.19 грн
100+380.98 грн
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