Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (276119) > Сторінка 1916 з 4602

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LAN8870T-I/PUA LAN8870T-I/PUA Microchip Technology LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
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M5KP18A M5KP18A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 18VWM 29.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 172A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP18A/TR Microchip Technology Description: TVS DIODE 18VWM 29.2VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 171A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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AT29BV020-12JI AT29BV020-12JI Microchip Technology AT29BV020.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tube
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (13.97x11.43)
Write Cycle Time - Word, Page: 20ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
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ECC204-TFLXAUTHU-CZ-HV Microchip Technology Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU ECC204-TFLXAUTHU Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXAUTHR-HV Microchip Technology Description: 40K MOQ RBH PROVISIONED CUSTOM D
Packaging: Bulk
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ECC204-TFLXWPCU-HV Microchip Technology Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU-HV Microchip Technology Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHS ECC204-TFLXAUTHS Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXWPCU ECC204-TFLXWPCU Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS ECC204-TFLXWPCS Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXAUTHS-CZ-HV Microchip Technology Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHU-CZ ECC204-TFLXAUTHU-CZ Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS-HV Microchip Technology Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-HV Microchip Technology Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-CZ ECC204-TFLXAUTHS-CZ Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-C ATECC608C-TNGTLSU-C Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-C ATECC608C-TNGTLSS-C Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TCSMU ATECC608C-TCSMU Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST CUSTOM, PROVISIONED, 8-UDF
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-B ATECC608C-TNGTLSS-B Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-B ATECC608C-TNGTLSU-B Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TCSMS ATECC608C-TCSMS Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST CUSTOM, PROVISIONED, 8-SOI
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TFLXTLSS ATECC608C-TFLXTLSS Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST FLEX TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSS-G ATECC608C-TNGTLSS-G Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-G ATECC608C-TNGTLSU-G Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU ATECC608C-TFLXTLSU Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST FLEX TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU-HV Microchip Technology Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TNGTLSU-HV Microchip Technology Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TFLXTLSU-PROTO Microchip Technology Description: TRUST FLEX TLS, PROVISIONED PROT
Packaging: Bag
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ATECC608C-TCSMU-HV Microchip Technology Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TFLXTLSS-PROTO Microchip Technology Description: TRUST FLEX TLS, PROVISIONED PROT
Packaging: Tube
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ATECC608C-TCSMS-HV Microchip Technology Description: 32K MOQ SOIC PROVISIONED CUSTOM
Packaging: Tube
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ATECC608C-TNGTLSS-HV Microchip Technology Description: 32K MOQ SOIC PROVISIONED CUSTOM
Packaging: Tube
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ATECC608C-TFLXTLSS-HV Microchip Technology Description: 32K MOQ SOIC PROVISIONED CUSTOM
Packaging: Tube
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1N4462 1N4462 Microchip Technology 122691-lds-0183-datasheet Description: DIODE ZENER 7.5V 1.5W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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JANTX1N4462/TR JANTX1N4462/TR Microchip Technology Description: DIODE ZENER 7.5V 1.5W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 400 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JAN1N4462US/TR JAN1N4462US/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462 JANTXV1N4462 Microchip Technology Description: DIODE ZENER 7.5V 1.5W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTX1N4462US/TR JANTX1N4462US/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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1N4462C 1N4462C Microchip Technology Description: DIODE ZENER 7.5V 1.5W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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JANTXV1N4462US/TR JANTXV1N4462US/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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1N4462D 1N4462D Microchip Technology Description: DIODE ZENER 7.5V 1.5W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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JAN1N4462CUS/TR JAN1N4462CUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTX1N4462CUS/TR JANTX1N4462CUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462CUS JANTXV1N4462CUS Microchip Technology Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Bulk
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462CUS/TR JANTXV1N4462CUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JAN1N4462DUS/TR JAN1N4462DUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462DUS JANTXV1N4462DUS Microchip Technology Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462DUS/TR JANTXV1N4462DUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTX1N4462DUS/TR JANTX1N4462DUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462US JANS1N4462US Microchip Technology SG-SEMTECH-HI-REL-SPACE_2020_web.pdf Description: DIODE ZENER 7.5V 1.5W SQ-MELF
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: A, SQ-MELF
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462US/TR JANS1N4462US/TR Microchip Technology Description: DIODE ZENER 7.5V 1.5W SQ-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: A, SQ-MELF
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462C JANS1N4462C Microchip Technology Description: DIODE ZENER 7.5V 1.5W DO41
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462CUS Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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JANS1N4462CUS/TR JANS1N4462CUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462D JANS1N4462D Microchip Technology Description: DIODE ZENER 7.5V 1.5W DO41
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462DUS Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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JANS1N4462DUS/TR JANS1N4462DUS/TR Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JAN1N6466 JAN1N6466 Microchip Technology 10875-sa4-21-datasheet Description: TVS DIODE 30.5VWM 47.5V AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 63A (8/20µs)
Voltage - Reverse Standoff (Typ): 30.5V
Supplier Device Package: B, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33V
Voltage - Clamping (Max) @ Ipp: 47.5V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/551
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LAN8870T-I/PUA LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf
LAN8870T-I/PUA
Виробник: Microchip Technology
Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
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M5KP18A 9461-m5kp-pdf
M5KP18A
Виробник: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 172A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP18A/TR
Виробник: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 171A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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AT29BV020-12JI AT29BV020.pdf
AT29BV020-12JI
Виробник: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tube
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (13.97x11.43)
Write Cycle Time - Word, Page: 20ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
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ECC204-TFLXAUTHU-CZ-HV
Виробник: Microchip Technology
Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHU
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXAUTHR-HV
Виробник: Microchip Technology
Description: 40K MOQ RBH PROVISIONED CUSTOM D
Packaging: Bulk
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ECC204-TFLXWPCU-HV
Виробник: Microchip Technology
Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU-HV
Виробник: Microchip Technology
Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHS ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHS
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXWPCU ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXWPCU
Виробник: Microchip Technology
Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXWPCS
Виробник: Microchip Technology
Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXAUTHS-CZ-HV
Виробник: Microchip Technology
Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHU-CZ ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHU-CZ
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS-HV
Виробник: Microchip Technology
Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-HV
Виробник: Microchip Technology
Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-CZ ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHS-CZ
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-C ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSU-C
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-C ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSS-C
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TCSMU ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TCSMU
Виробник: Microchip Technology
Description: TRUST CUSTOM, PROVISIONED, 8-UDF
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-B ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSS-B
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-B ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSU-B
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TCSMS ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TCSMS
Виробник: Microchip Technology
Description: TRUST CUSTOM, PROVISIONED, 8-SOI
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TFLXTLSS ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TFLXTLSS
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSS-G ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSS-G
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-G ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSU-G
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TFLXTLSU
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU-HV
Виробник: Microchip Technology
Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TNGTLSU-HV
Виробник: Microchip Technology
Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TFLXTLSU-PROTO
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED PROT
Packaging: Bag
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ATECC608C-TCSMU-HV
Виробник: Microchip Technology
Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TFLXTLSS-PROTO
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED PROT
Packaging: Tube
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ATECC608C-TCSMS-HV
Виробник: Microchip Technology
Description: 32K MOQ SOIC PROVISIONED CUSTOM
Packaging: Tube
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ATECC608C-TNGTLSS-HV
Виробник: Microchip Technology
Description: 32K MOQ SOIC PROVISIONED CUSTOM
Packaging: Tube
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ATECC608C-TFLXTLSS-HV
Виробник: Microchip Technology
Description: 32K MOQ SOIC PROVISIONED CUSTOM
Packaging: Tube
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1N4462 122691-lds-0183-datasheet
1N4462
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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JANTX1N4462/TR
JANTX1N4462/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO204AL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 400 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JAN1N4462US/TR 124793-lds-0183-1-datasheet
JAN1N4462US/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462
JANTXV1N4462
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTX1N4462US/TR 124793-lds-0183-1-datasheet
JANTX1N4462US/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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1N4462C
1N4462C
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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JANTXV1N4462US/TR 124793-lds-0183-1-datasheet
JANTXV1N4462US/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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1N4462D
1N4462D
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
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JAN1N4462CUS/TR 124793-lds-0183-1-datasheet
JAN1N4462CUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTX1N4462CUS/TR 124793-lds-0183-1-datasheet
JANTX1N4462CUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462CUS
JANTXV1N4462CUS
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Bulk
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462CUS/TR 124793-lds-0183-1-datasheet
JANTXV1N4462CUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JAN1N4462DUS/TR 124793-lds-0183-1-datasheet
JAN1N4462DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462DUS
JANTXV1N4462DUS
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTXV1N4462DUS/TR 124793-lds-0183-1-datasheet
JANTXV1N4462DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANTX1N4462DUS/TR 124793-lds-0183-1-datasheet
JANTX1N4462DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462US SG-SEMTECH-HI-REL-SPACE_2020_web.pdf
JANS1N4462US
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W SQ-MELF
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: A, SQ-MELF
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462US/TR
JANS1N4462US/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W SQ-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: A, SQ-MELF
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462C
JANS1N4462C
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO41
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462CUS
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
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JANS1N4462CUS/TR 124793-lds-0183-1-datasheet
JANS1N4462CUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462D
JANS1N4462D
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W DO41
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JANS1N4462DUS
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
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JANS1N4462DUS/TR 124793-lds-0183-1-datasheet
JANS1N4462DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Qualification: MIL-PRF-19500/406
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JAN1N6466 10875-sa4-21-datasheet
JAN1N6466
Виробник: Microchip Technology
Description: TVS DIODE 30.5VWM 47.5V AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 63A (8/20µs)
Voltage - Reverse Standoff (Typ): 30.5V
Supplier Device Package: B, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33V
Voltage - Clamping (Max) @ Ipp: 47.5V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/551
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