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MPLAD36KP85A MPLAD36KP85A Microchip Technology MPLAD36KP14A%20-%20MPLAD36KP400CA.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD36KP85AE3 MPLAD36KP85AE3 Microchip Technology MPLAD36KP14A%20-%20MPLAD36KP400CA.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD36KP85A/TR MPLAD36KP85A/TR Microchip Technology microsemi_rf01216_transient_voltage_suppressor_datasheet_revb.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD36KP85AE3/TR MPLAD36KP85AE3/TR Microchip Technology microsemi_rf01216_transient_voltage_suppressor_datasheet_revb.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP85CA MPLAD18KP85CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 132A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATSAMC21J17A-UUT ATSAMC21J17A-UUT Microchip Technology SAM-C20-C21-Family-Data-Sheet-DS60001479J.pdf Description: IC MCU 32BIT 128KB FLASH 56WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 56-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 56-WLCSP (3.17x3.44)
Number of I/O: 44
DigiKey Programmable: Not Verified
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ATSAMC21J18A-UUT ATSAMC21J18A-UUT Microchip Technology SAM-C20-C21-Family-Data-Sheet-DS60001479J.pdf Description: IC MCU 32BIT 256KB FLASH 56WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 56-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 56-WLCSP (3.17x3.44)
Number of I/O: 44
DigiKey Programmable: Not Verified
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2N6270 2N6270 Microchip Technology Description: TRANS NPN 80V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 262 W
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DSC1001CL1-125.0000T DSC1001CL1-125.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1001CL1-125.0000 DSC1001CL1-125.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1101CL1-125.0000T DSC1101CL1-125.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1101CL1-125.0000 DSC1101CL1-125.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1103CL1-125.0000T DSC1103CL1-125.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC 125MHZ LVDS 50PPM 3.2X2
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1103CL1-125.0000 DSC1103CL1-125.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 125.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSA1223CL1-125M0000VAO DSA1223CL1-125M0000VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSA1223CL1-125M0000TVAO DSA1223CL1-125M0000TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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ATMEGA168PA-CCUR ATMEGA168PA-CCUR Microchip Technology ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf Description: IC MCU 8BIT 16KB FLASH 32UFBGA
Packaging: Cut Tape (CT)
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
на замовлення 290 шт:
термін постачання 21-31 дні (днів)
5+72.37 грн
25+64.31 грн
100+58.49 грн
Мінімальне замовлення: 5
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MASMCJ7.0A MASMCJ7.0A Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 7VWM 12VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ9.0CA MASMCJ9.0CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ9.0CAe3 MASMCJ9.0CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SM16LC05e3/TR13 SM16LC05e3/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 5VWM 11VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 500W
Power Line Protection: No
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SM16LC05e3/TR13 SM16LC05e3/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 5VWM 11VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 1144 шт:
термін постачання 21-31 дні (днів)
1+498.38 грн
100+447.30 грн
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PIC16F13113-I/MF PIC16F13113-I/MF Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
на замовлення 1070 шт:
термін постачання 21-31 дні (днів)
8+46.88 грн
25+41.63 грн
100+37.98 грн
Мінімальне замовлення: 8
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PIC16F13114-I/MF PIC16F13114-I/MF Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
на замовлення 1080 шт:
термін постачання 21-31 дні (днів)
8+46.06 грн
25+40.20 грн
100+36.87 грн
Мінімальне замовлення: 8
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PIC16F13144-I/P PIC16F13144-I/P Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
на замовлення 462 шт:
термін постачання 21-31 дні (днів)
3+131.59 грн
25+116.16 грн
100+105.20 грн
Мінімальне замовлення: 3
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PIC16F13143-E/P PIC16F13143-E/P Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
на замовлення 432 шт:
термін постачання 21-31 дні (днів)
3+141.46 грн
25+124.91 грн
100+113.23 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC16F13115-I/MF PIC16F13115-I/MF Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 14KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
на замовлення 933 шт:
термін постачання 21-31 дні (днів)
7+47.70 грн
25+42.89 грн
100+38.88 грн
Мінімальне замовлення: 7
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PIC16F13123-I/SL PIC16F13123-I/SL Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13123-I/ST PIC16F13123-I/ST Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13124-I/SL PIC16F13124-I/SL Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13124-I/ST PIC16F13124-I/ST Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13125-I/SL PIC16F13125-I/SL Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13125-I/ST PIC16F13125-I/ST Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13143-I/REB PIC16F13143-I/REB Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
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PIC16F13143-I/SS PIC16F13143-I/SS Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
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PIC16F13144-I/SS PIC16F13144-I/SS Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
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PIC16F13144-I/REB PIC16F13144-I/REB Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
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PIC16F13143-I/SO PIC16F13143-I/SO Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
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PIC16F13144-I/SO PIC16F13144-I/SO Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
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PIC32MZ0512EFF100T-E/GJX PIC32MZ0512EFF100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MZ0512EFF100T-E/GJX PIC32MZ0512EFF100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MP6KE8.2A MP6KE8.2A Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 7.02VWM 12.1VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 50A
Voltage - Reverse Standoff (Typ): 7.02V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.79V
Voltage - Clamping (Max) @ Ipp: 12.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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BZV55C12 Microchip Technology BZV55C_ser_minimelf.pdf Description: DIODE ZENER
Packaging: Bulk
на замовлення 323 шт:
термін постачання 21-31 дні (днів)
2+194.91 грн
100+173.74 грн
Мінімальне замовлення: 2
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DSC1522JI2A-33M33333T DSC1522JI2A-33M33333T Microchip Technology DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf Description: MEMS OSC, LOW JITTER, 33.33333MH
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 7.5mA
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33333 MHz
Base Resonator: MEMS
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DSC1522JI2A-33M33333 DSC1522JI2A-33M33333 Microchip Technology DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf Description: MEMS OSC XO 33.33333MHZ LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 7.5mA
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33333 MHz
Base Resonator: MEMS
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ATA6847T-5050E/NHX ATA6847T-5050E/NHX Microchip Technology Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5050E/NHX ATA6847T-5050E/NHX Microchip Technology Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
3+116.78 грн
25+93.26 грн
100+84.91 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
ATA6847T-3333E/NHX ATA6847T-3333E/NHX Microchip Technology Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-3333E/NHX ATA6847T-3333E/NHX Microchip Technology Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
3+116.78 грн
25+93.26 грн
100+84.91 грн
Мінімальне замовлення: 3
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ATA6847T-5033E/NHX ATA6847T-5033E/NHX Microchip Technology Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5033E/NHX ATA6847T-5033E/NHX Microchip Technology Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
3+116.78 грн
25+93.26 грн
100+84.91 грн
Мінімальне замовлення: 3
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DSC1001CI5-004.9152T DSC1001CI5-004.9152T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.9152MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.9152 MHz
Base Resonator: MEMS
на замовлення 785 шт:
термін постачання 21-31 дні (днів)
2+217.12 грн
10+204.40 грн
50+201.06 грн
Мінімальне замовлення: 2
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PIC24FJ256GA610-E/PT PIC24FJ256GA610-E/PT Microchip Technology Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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62CA2 62CA2 Microchip Technology Module_Adapter_Boards_Web.pdf Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ASC-12A1HP
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+8347.50 грн
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ATTINY406-MF ATTINY406-MF Microchip Technology ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf Description: 20MHZ, 4KB, VQFN20, EXT 125C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
на замовлення 1455 шт:
термін постачання 21-31 дні (днів)
6+55.92 грн
25+49.07 грн
100+44.55 грн
Мінімальне замовлення: 6
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ATTINY406-MN ATTINY406-MN Microchip Technology ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf Description: 20MHZ, 4KB, VQFN20, IND 105C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
на замовлення 1460 шт:
термін постачання 21-31 дні (днів)
6+55.92 грн
25+49.07 грн
100+44.55 грн
Мінімальне замовлення: 6
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MIC184YM-TR MIC184YM-TR Microchip Technology MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf Description: SENSOR DIGITAL -55C-125C 8SOIC
Packaging: Tape & Reel (TR)
Features: Output Switch, Shutdown Mode, Standby Mode
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-SOIC
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
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MIC184YM-TR MIC184YM-TR Microchip Technology MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf Description: SENSOR DIGITAL -55C-125C 8SOIC
Packaging: Cut Tape (CT)
Features: Output Switch, Shutdown Mode, Standby Mode
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-SOIC
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
на замовлення 160 шт:
термін постачання 21-31 дні (днів)
5+75.66 грн
25+60.79 грн
100+57.93 грн
Мінімальне замовлення: 5
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MIC184BMM MIC184BMM Microchip Technology MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf Description: SENSOR DIGITAL -55C-125C 8MSOP
Packaging: Bulk
Features: Output Switch, Shutdown Mode, Standby Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
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LT-1084 Microchip Technology Description: 6.4V .5MA +/- .1% ROUND-END TEMP
Packaging: Bulk
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MPLAD36KP85A MPLAD36KP14A%20-%20MPLAD36KP400CA.pdf
MPLAD36KP85A
Виробник: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD36KP85AE3 MPLAD36KP14A%20-%20MPLAD36KP400CA.pdf
MPLAD36KP85AE3
Виробник: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD36KP85A/TR microsemi_rf01216_transient_voltage_suppressor_datasheet_revb.pdf
MPLAD36KP85A/TR
Виробник: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD36KP85AE3/TR microsemi_rf01216_transient_voltage_suppressor_datasheet_revb.pdf
MPLAD36KP85AE3/TR
Виробник: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 263A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 36000W (36kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP85CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP85CA
Виробник: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 132A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATSAMC21J17A-UUT SAM-C20-C21-Family-Data-Sheet-DS60001479J.pdf
ATSAMC21J17A-UUT
Виробник: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 56WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 56-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 56-WLCSP (3.17x3.44)
Number of I/O: 44
DigiKey Programmable: Not Verified
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ATSAMC21J18A-UUT SAM-C20-C21-Family-Data-Sheet-DS60001479J.pdf
ATSAMC21J18A-UUT
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 56WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 56-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 56-WLCSP (3.17x3.44)
Number of I/O: 44
DigiKey Programmable: Not Verified
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2N6270
2N6270
Виробник: Microchip Technology
Description: TRANS NPN 80V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 262 W
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DSC1001CL1-125.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL1-125.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1001CL1-125.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL1-125.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1101CL1-125.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101CL1-125.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1101CL1-125.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101CL1-125.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1103CL1-125.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL1-125.0000T
Виробник: Microchip Technology
Description: MEMS OSC 125MHZ LVDS 50PPM 3.2X2
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1103CL1-125.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL1-125.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSA1223CL1-125M0000VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223CL1-125M0000VAO
Виробник: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSA1223CL1-125M0000TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223CL1-125M0000TVAO
Виробник: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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ATMEGA168PA-CCUR ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf
ATMEGA168PA-CCUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32UFBGA
Packaging: Cut Tape (CT)
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
на замовлення 290 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+72.37 грн
25+64.31 грн
100+58.49 грн
Мінімальне замовлення: 5
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MASMCJ7.0A 10561-msmc-datasheet
MASMCJ7.0A
Виробник: Microchip Technology
Description: TVS DIODE 7VWM 12VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ9.0CA 10561-msmc-datasheet
MASMCJ9.0CA
Виробник: Microchip Technology
Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ9.0CAe3 10561-msmc-datasheet
MASMCJ9.0CAe3
Виробник: Microchip Technology
Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SM16LC05e3/TR13 SM16LC.pdf
SM16LC05e3/TR13
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 11VC 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 500W
Power Line Protection: No
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SM16LC05e3/TR13 SM16LC.pdf
SM16LC05e3/TR13
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 11VC 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 25pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: 16-SO
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 500W
Power Line Protection: No
на замовлення 1144 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+498.38 грн
100+447.30 грн
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PIC16F13113-I/MF PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13113-I/MF
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
на замовлення 1070 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+46.88 грн
25+41.63 грн
100+37.98 грн
Мінімальне замовлення: 8
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PIC16F13114-I/MF PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13114-I/MF
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
на замовлення 1080 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+46.06 грн
25+40.20 грн
100+36.87 грн
Мінімальне замовлення: 8
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PIC16F13144-I/P PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/P
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
на замовлення 462 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+131.59 грн
25+116.16 грн
100+105.20 грн
Мінімальне замовлення: 3
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PIC16F13143-E/P PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-E/P
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
на замовлення 432 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+141.46 грн
25+124.91 грн
100+113.23 грн
Мінімальне замовлення: 3
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PIC16F13115-I/MF PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13115-I/MF
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
на замовлення 933 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+47.70 грн
25+42.89 грн
100+38.88 грн
Мінімальне замовлення: 7
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PIC16F13123-I/SL PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13123-I/SL
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13123-I/ST PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13123-I/ST
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13124-I/SL PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13124-I/SL
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13124-I/ST PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13124-I/ST
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13125-I/SL PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13125-I/SL
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13125-I/ST PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13125-I/ST
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13143-I/REB PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-I/REB
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
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PIC16F13143-I/SS PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-I/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
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PIC16F13144-I/SS PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
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PIC16F13144-I/REB PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/REB
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
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PIC16F13143-I/SO PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
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PIC16F13144-I/SO PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
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PIC32MZ0512EFF100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ0512EFF100T-E/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MZ0512EFF100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ0512EFF100T-E/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Grade: Automotive
Number of I/O: 78
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MP6KE8.2A 9518-mp6ke-pdf
MP6KE8.2A
Виробник: Microchip Technology
Description: TVS DIODE 7.02VWM 12.1VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 50A
Voltage - Reverse Standoff (Typ): 7.02V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.79V
Voltage - Clamping (Max) @ Ipp: 12.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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BZV55C12 BZV55C_ser_minimelf.pdf
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
на замовлення 323 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+194.91 грн
100+173.74 грн
Мінімальне замовлення: 2
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DSC1522JI2A-33M33333T DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf
DSC1522JI2A-33M33333T
Виробник: Microchip Technology
Description: MEMS OSC, LOW JITTER, 33.33333MH
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 7.5mA
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33333 MHz
Base Resonator: MEMS
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DSC1522JI2A-33M33333 DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf
DSC1522JI2A-33M33333
Виробник: Microchip Technology
Description: MEMS OSC XO 33.33333MHZ LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 7.5mA
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33.33333 MHz
Base Resonator: MEMS
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ATA6847T-5050E/NHX
ATA6847T-5050E/NHX
Виробник: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5050E/NHX
ATA6847T-5050E/NHX
Виробник: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+116.78 грн
25+93.26 грн
100+84.91 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
ATA6847T-3333E/NHX
ATA6847T-3333E/NHX
Виробник: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-3333E/NHX
ATA6847T-3333E/NHX
Виробник: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+116.78 грн
25+93.26 грн
100+84.91 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
ATA6847T-5033E/NHX
ATA6847T-5033E/NHX
Виробник: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5033E/NHX
ATA6847T-5033E/NHX
Виробник: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+116.78 грн
25+93.26 грн
100+84.91 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
DSC1001CI5-004.9152T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI5-004.9152T
Виробник: Microchip Technology
Description: MEMS OSC XO 4.9152MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.9152 MHz
Base Resonator: MEMS
на замовлення 785 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+217.12 грн
10+204.40 грн
50+201.06 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PIC24FJ256GA610-E/PT
PIC24FJ256GA610-E/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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62CA2 Module_Adapter_Boards_Web.pdf
62CA2
Виробник: Microchip Technology
Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ASC-12A1HP
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8347.50 грн
В кошику  од. на суму  грн.
ATTINY406-MF ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf
ATTINY406-MF
Виробник: Microchip Technology
Description: 20MHZ, 4KB, VQFN20, EXT 125C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
на замовлення 1455 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+55.92 грн
25+49.07 грн
100+44.55 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
ATTINY406-MN ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf
ATTINY406-MN
Виробник: Microchip Technology
Description: 20MHZ, 4KB, VQFN20, IND 105C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
на замовлення 1460 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+55.92 грн
25+49.07 грн
100+44.55 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MIC184YM-TR MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf
MIC184YM-TR
Виробник: Microchip Technology
Description: SENSOR DIGITAL -55C-125C 8SOIC
Packaging: Tape & Reel (TR)
Features: Output Switch, Shutdown Mode, Standby Mode
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-SOIC
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
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MIC184YM-TR MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf
MIC184YM-TR
Виробник: Microchip Technology
Description: SENSOR DIGITAL -55C-125C 8SOIC
Packaging: Cut Tape (CT)
Features: Output Switch, Shutdown Mode, Standby Mode
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-SOIC
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
на замовлення 160 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+75.66 грн
25+60.79 грн
100+57.93 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MIC184BMM MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf
MIC184BMM
Виробник: Microchip Technology
Description: SENSOR DIGITAL -55C-125C 8MSOP
Packaging: Bulk
Features: Output Switch, Shutdown Mode, Standby Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-MSOP
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
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LT-1084
Виробник: Microchip Technology
Description: 6.4V .5MA +/- .1% ROUND-END TEMP
Packaging: Bulk
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