Продукція > MICRON TECHNOLOGY INC. > Всі товари виробника MICRON TECHNOLOGY INC. (10955) > Сторінка 170 з 183
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MT29C1G12MAAJVAMD-5 IT TR | Micron Technology Inc. |
Description: IC FLSH NAND LPDDR 1.5G 130VFBGA Packaging: Cut Tape (CT) Package / Case: 130-VFBGA Mounting Type: Surface Mount Supplier Device Package: 130-VFBGA (8x9) DigiKey Programmable: Not Verified |
на замовлення 197 шт: термін постачання 21-31 дні (днів) |
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| MTA4ATF1G64HZ-3G2F1 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 3200 |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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| MTA4ATF1G64HZ-2G6E1 | Micron Technology Inc. |
 Description: MODULE DDR4 SDRAM 8GB 260SODIMMPackaging: Bulk Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 2666 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTA4ATF1G64HZ-3G2B2 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 3200 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTA4ATF1G64HZ-3G2B1 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 3200 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTA4ATF1G64HZ-3G2E2 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 3200 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MT46H16M32LFCM-5 IT:B | Micron Technology Inc. |
Description: IC DRAM 512MBIT PAR 90VFBGA Packaging: Tray Package / Case: 90-VFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR Clock Frequency: 200 MHz Memory Format: DRAM Supplier Device Package: 90-VFBGA (10x13) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 5 ns Memory Organization: 16M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT29F4G01ABAFDWB-IT:F TR | Micron Technology Inc. |
Description: IC FLASH 4GBIT SPI 8UPDFN Packaging: Tape & Reel (TR) Package / Case: 8-UDFN Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 8-UPDFN (8x6) (MLP8) Memory Interface: SPI Memory Organization: 4G x 1 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MT29F4G01ABAFDWB-IT:F TR | Micron Technology Inc. |
Description: IC FLASH 4GBIT SPI 8UPDFN Packaging: Cut Tape (CT) Package / Case: 8-UDFN Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 8-UPDFN (8x6) (MLP8) Memory Interface: SPI Memory Organization: 4G x 1 DigiKey Programmable: Not Verified |
на замовлення 3009 шт: термін постачання 21-31 дні (днів) |
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| MTGAAAA128GD1-AAZCTBYYES | Micron Technology Inc. |
Description: DDR4 128GBYTE/1.125TBIT HRAS E3. Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTGAAAA128GD1-AA1CTBYY | Micron Technology Inc. |
Description: DDR4 128GBYTE/1.125TBIT HRAS E3. Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTGAAAA256GD1-AA1CTBYY | Micron Technology Inc. |
Description: DDR4 256GBYTE/2.25TBIT HRAS E3.S Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTGAAAA256GD1-AAZCTBYYES | Micron Technology Inc. |
Description: DDR4 256GBYTE/2.25TBIT HRAS E3.S Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTA8ATF1G64HZ-2G3B1 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 2400 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTA8ATF1G64HZ-2G3A1 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 2400 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MTA8ATF1G64HZ-2G3E1 | Micron Technology Inc. |
Description: MODULE DDR4 SDRAM 8GB 260SODIMM Packaging: Tray Package / Case: 260-SODIMM Memory Size: 8GB Memory Type: DDR4 SDRAM Transfer Rate (Mb/s, MT/s, MHz): 2400 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MT46V128M8TG-6T:A TR | Micron Technology Inc. |
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP Packaging: Tape & Reel (TR) Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 167 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 700 ps Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M8P-6T:A TR | Micron Technology Inc. |
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP Packaging: Tape & Reel (TR) Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 167 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 700 ps Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M8P-75:A TR | Micron Technology Inc. |
Description: IC DRAM 1GBIT PARALLEL 66TSOP Packaging: Tape & Reel (TR) Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 133 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 750 ps Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M4FN-6:F TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PAR 60FBGA Packaging: Tape & Reel (TR) Package / Case: 60-TFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 167 MHz Memory Format: DRAM Supplier Device Package: 60-FBGA (10x12.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 700 ps Memory Organization: 128M x 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M4TG-6T:F TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PAR 66TSOP Packaging: Tape & Reel (TR) Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 167 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 700 ps Memory Organization: 128M x 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M4FN-75:D TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PARALLEL 60FBGA Packaging: Tape & Reel (TR) Package / Case: 60-TFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 133 MHz Memory Format: DRAM Supplier Device Package: 60-FBGA (10x12.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 750 ps Memory Organization: 128M x 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M4TG-75:D TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PARALLEL 66TSOP Packaging: Tape & Reel (TR) Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 133 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 750 ps Memory Organization: 128M x 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M8TG-75:A TR | Micron Technology Inc. |
Description: IC DRAM 1GBIT PARALLEL 66TSOP Packaging: Tape & Reel (TR) Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 133 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 750 ps Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46V128M8P-6T IT:A | Micron Technology Inc. |
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP Packaging: Tray Package / Case: 66-TSSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 2.7V Technology: SDRAM - DDR Clock Frequency: 167 MHz Memory Format: DRAM Supplier Device Package: 66-TSOP Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 700 ps Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46H128M16LFDD-48 IT:C | Micron Technology Inc. |
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA Packaging: Bulk Package / Case: 60-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR Clock Frequency: 208 MHz Memory Format: DRAM Supplier Device Package: 60-VFBGA (8x9) Write Cycle Time - Word, Page: 14.4ns Memory Interface: Parallel Access Time: 5 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
на замовлення 3046 шт: термін постачання 21-31 дні (днів) |
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MT46H128M16LFDD-48 AIT:C | Micron Technology Inc. |
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA Packaging: Bulk Package / Case: 60-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR Clock Frequency: 208 MHz Memory Format: DRAM Supplier Device Package: 60-VFBGA (8x9) Grade: Automotive Write Cycle Time - Word, Page: 14.4ns Memory Interface: Parallel Access Time: 5 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT46H128M16LFDD-48 WT:C | Micron Technology Inc. |
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA Packaging: Bulk Package / Case: 60-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR Clock Frequency: 208 MHz Memory Format: DRAM Supplier Device Package: 60-VFBGA (8x9) Write Cycle Time - Word, Page: 14.4ns Memory Interface: Parallel Access Time: 5 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 WT:A | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Bulk Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 WT:A TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 IT:A TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 IT:A | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 AIT:A TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 AIT:A | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 AAT:A TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 AAT:A | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 AUT:A TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E384M32D2FW-046 IT:E TR | Micron Technology Inc. |
Description: LPDDR4 12G 384MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 12Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 384M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E128M32D2FW-046 AUT:A | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 200TFBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E384M32D2FW-046 IT:E | Micron Technology Inc. |
Description: LPDDR4 12G 384MX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 12Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 384M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MT53E384M32D2FW-046 AIT:E TR | Micron Technology Inc. |
Description: LPDDR4 12G 384MX32 FBGA DDP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MT53E384M32D2FW-046 AIT:E | Micron Technology Inc. |
Description: LPDDR4 12G 384MX32 FBGA DDP Packaging: Box DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MT53E256M32D2FW-046 AIT:B TR | Micron Technology Inc. |
Description: LPDDR4 8G 256MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E256M32D2FW-046 AIT:B | Micron Technology Inc. |
Description: LPDDR4 8G 256MX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E256M32D2FW-046 AAT:B TR | Micron Technology Inc. |
Description: LPDDR4 8G 256MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E256M32D2FW-046 AAT:B | Micron Technology Inc. |
Description: LPDDR4 8G 256MX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E256M32D2FW-046 AUT:B TR | Micron Technology Inc. |
Description: LPDDR4 8G 256MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT53E256M32D2FW-046 AUT:B | Micron Technology Inc. |
Description: LPDDR4 8G 256MX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Grade: Automotive Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256M x 32 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MT53E1G32D2FW-046 WT:C TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Memory Size: 32Gbit Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Memory Interface: Parallel Memory Organization: 1G x 32 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MT53E1G32D2FW-046 WT:C | Micron Technology Inc. |
Description: IC DRAM 32GBIT PAR 200TFBGA Packaging: Tray Package / Case: 200-TFBGA Memory Size: 32Gbit Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Memory Interface: Parallel Memory Organization: 1G x 32 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MT53E1G32D2FW-046 IT:C TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Memory Size: 32Gbit Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Memory Interface: Parallel Memory Organization: 1G x 32 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MT53E1G32D2FW-046 IT:C | Micron Technology Inc. |
Description: IC DRAM 32GBIT PAR 200TFBGA Packaging: Tray Package / Case: 200-TFBGA Memory Size: 32Gbit Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Memory Interface: Parallel Memory Organization: 1G x 32 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MT48H32M16LFB4-6 AT:C TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PAR 54VFBGA Packaging: Tape & Reel (TR) Package / Case: 54-VFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: SDRAM - Mobile LPSDR Clock Frequency: 166 MHz Memory Format: DRAM Supplier Device Package: 54-VFBGA (8x8) Grade: Automotive Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 5 ns Memory Organization: 32M x 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
MT40A256M16GE-075E AUT:B TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PARALLEL 96FBGA Packaging: Tape & Reel (TR) Package / Case: 96-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.14V ~ 1.26V Technology: SDRAM - DDR4 Clock Frequency: 1.33 GHz Memory Format: DRAM Supplier Device Package: 96-FBGA (9x14) Grade: Automotive Memory Interface: Parallel Memory Organization: 256M x 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MTFC8GAMALBH-AIT ES TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT MMC 153TFBGA Packaging: Tape & Reel (TR) Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Grade: Automotive Memory Interface: MMC Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MTFC8GAMALNA-AAT | Micron Technology Inc. |
Description: IC FLASH 64GBIT MMC 100TBGA Packaging: Tray Package / Case: 100-TBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 100-TBGA (14x18) Grade: Automotive Memory Interface: MMC Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MTFC8GAMALNA-AAT TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT MMC 100TBGA Packaging: Tape & Reel (TR) Package / Case: 100-TBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 100-TBGA (14x18) Grade: Automotive Memory Interface: MMC Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MTFC8GAMALBH-AAT ES TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT MMC 153TFBGA Packaging: Tape & Reel (TR) Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Grade: Automotive Memory Interface: MMC Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MTFC8GAMALNA-AAT ES TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT MMC 100TBGA Packaging: Tape & Reel (TR) Package / Case: 100-TBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 100-TBGA (14x18) Grade: Automotive Memory Interface: MMC Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| N2M400GDB321A3CF TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT MMC 52MHZ Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 52 MHz Memory Format: FLASH Memory Interface: MMC Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| MT29C1G12MAAJVAMD-5 IT TR |
Виробник: Micron Technology Inc.
Description: IC FLSH NAND LPDDR 1.5G 130VFBGA
Packaging: Cut Tape (CT)
Package / Case: 130-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 130-VFBGA (8x9)
DigiKey Programmable: Not Verified
Description: IC FLSH NAND LPDDR 1.5G 130VFBGA
Packaging: Cut Tape (CT)
Package / Case: 130-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 130-VFBGA (8x9)
DigiKey Programmable: Not Verified
на замовлення 197 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 712.67 грн |
| 10+ | 635.98 грн |
| 25+ | 621.54 грн |
| 50+ | 580.18 грн |
| 100+ | 510.74 грн |
| MTA4ATF1G64HZ-3G2F1 |
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
на замовлення 46 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4388.90 грн |
| 10+ | 3919.55 грн |
| 25+ | 3779.55 грн |
| 40+ | 3458.62 грн |
| MTA4ATF1G64HZ-2G6E1 |
|
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Bulk
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2666
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Bulk
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2666
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В кошику
од. на суму грн.
| MTA4ATF1G64HZ-3G2B2 |
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
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В кошику
од. на суму грн.
| MTA4ATF1G64HZ-3G2B1 |
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
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В кошику
од. на суму грн.
| MTA4ATF1G64HZ-3G2E2 |
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 3200
товару немає в наявності
В кошику
од. на суму грн.
| MT46H16M32LFCM-5 IT:B |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PAR 90VFBGA
Packaging: Tray
Package / Case: 90-VFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 200 MHz
Memory Format: DRAM
Supplier Device Package: 90-VFBGA (10x13)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 16M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PAR 90VFBGA
Packaging: Tray
Package / Case: 90-VFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 200 MHz
Memory Format: DRAM
Supplier Device Package: 90-VFBGA (10x13)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 16M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT29F4G01ABAFDWB-IT:F TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 4GBIT SPI 8UPDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 8-UPDFN (8x6) (MLP8)
Memory Interface: SPI
Memory Organization: 4G x 1
DigiKey Programmable: Not Verified
Description: IC FLASH 4GBIT SPI 8UPDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 8-UPDFN (8x6) (MLP8)
Memory Interface: SPI
Memory Organization: 4G x 1
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2000+ | 203.05 грн |
| MT29F4G01ABAFDWB-IT:F TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 4GBIT SPI 8UPDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UDFN
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 8-UPDFN (8x6) (MLP8)
Memory Interface: SPI
Memory Organization: 4G x 1
DigiKey Programmable: Not Verified
Description: IC FLASH 4GBIT SPI 8UPDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UDFN
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 8-UPDFN (8x6) (MLP8)
Memory Interface: SPI
Memory Organization: 4G x 1
DigiKey Programmable: Not Verified
на замовлення 3009 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 242.23 грн |
| 10+ | 217.86 грн |
| 25+ | 211.45 грн |
| 50+ | 193.87 грн |
| 100+ | 189.30 грн |
| 250+ | 183.27 грн |
| 500+ | 175.83 грн |
| 1000+ | 172.86 грн |
| MTA8ATF1G64HZ-2G3B1 |
|
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2400
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2400
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В кошику
од. на суму грн.
| MTA8ATF1G64HZ-2G3A1 |
|
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2400
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2400
товару немає в наявності
В кошику
од. на суму грн.
| MTA8ATF1G64HZ-2G3E1 |
Виробник: Micron Technology Inc.
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2400
Description: MODULE DDR4 SDRAM 8GB 260SODIMM
Packaging: Tray
Package / Case: 260-SODIMM
Memory Size: 8GB
Memory Type: DDR4 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 2400
товару немає в наявності
В кошику
од. на суму грн.
| MT46V128M8TG-6T:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT46V128M8P-6T:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MT46V128M8P-75:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PARALLEL 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT PARALLEL 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
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| MT46V128M4FN-6:F TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PAR 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (10x12.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PAR 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (10x12.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
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| MT46V128M4TG-6T:F TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PAR 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PAR 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
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| MT46V128M4FN-75:D TR |
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (10x12.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PARALLEL 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (10x12.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
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| MT46V128M4TG-75:D TR |
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PARALLEL 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 4
DigiKey Programmable: Not Verified
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| MT46V128M8TG-75:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PARALLEL 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT PARALLEL 66TSOP
Packaging: Tape & Reel (TR)
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 750 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
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| MT46V128M8P-6T IT:A |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP
Packaging: Tray
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT PAR 167MHZ 66TSOP
Packaging: Tray
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V
Technology: SDRAM - DDR
Clock Frequency: 167 MHz
Memory Format: DRAM
Supplier Device Package: 66-TSOP
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 700 ps
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT46H128M16LFDD-48 IT:C |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA
Packaging: Bulk
Package / Case: 60-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 208 MHz
Memory Format: DRAM
Supplier Device Package: 60-VFBGA (8x9)
Write Cycle Time - Word, Page: 14.4ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA
Packaging: Bulk
Package / Case: 60-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 208 MHz
Memory Format: DRAM
Supplier Device Package: 60-VFBGA (8x9)
Write Cycle Time - Word, Page: 14.4ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
на замовлення 3046 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 921.12 грн |
| 10+ | 821.94 грн |
| 25+ | 803.32 грн |
| 50+ | 749.85 грн |
| 100+ | 660.09 грн |
| 250+ | 627.33 грн |
| 500+ | 610.87 грн |
| MT46H128M16LFDD-48 AIT:C |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA
Packaging: Bulk
Package / Case: 60-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 208 MHz
Memory Format: DRAM
Supplier Device Package: 60-VFBGA (8x9)
Grade: Automotive
Write Cycle Time - Word, Page: 14.4ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA
Packaging: Bulk
Package / Case: 60-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 208 MHz
Memory Format: DRAM
Supplier Device Package: 60-VFBGA (8x9)
Grade: Automotive
Write Cycle Time - Word, Page: 14.4ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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В кошику
од. на суму грн.
| MT46H128M16LFDD-48 WT:C |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA
Packaging: Bulk
Package / Case: 60-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 208 MHz
Memory Format: DRAM
Supplier Device Package: 60-VFBGA (8x9)
Write Cycle Time - Word, Page: 14.4ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 208MHZ 60VFBGA
Packaging: Bulk
Package / Case: 60-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR
Clock Frequency: 208 MHz
Memory Format: DRAM
Supplier Device Package: 60-VFBGA (8x9)
Write Cycle Time - Word, Page: 14.4ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 WT:A |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Bulk
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Bulk
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 WT:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 IT:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 IT:A |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 AIT:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 AIT:A |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 AAT:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
Qualification: AEC-Q100
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
Qualification: AEC-Q100
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 AAT:A |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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В кошику
од. на суму грн.
| MT53E128M32D2FW-046 AUT:A TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT53E384M32D2FW-046 IT:E TR |
Виробник: Micron Technology Inc.
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 12Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 384M x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 12Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 384M x 32
DigiKey Programmable: Not Verified
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| MT53E128M32D2FW-046 AUT:A |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 4GBIT PAR 200TFBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT53E384M32D2FW-046 IT:E |
Виробник: Micron Technology Inc.
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 12Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 384M x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 12Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 384M x 32
DigiKey Programmable: Not Verified
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| MT53E384M32D2FW-046 AIT:E TR |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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| MT53E384M32D2FW-046 AIT:E |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Box
DigiKey Programmable: Not Verified
Description: LPDDR4 12G 384MX32 FBGA DDP
Packaging: Box
DigiKey Programmable: Not Verified
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| MT53E256M32D2FW-046 AIT:B TR |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT53E256M32D2FW-046 AIT:B |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT53E256M32D2FW-046 AAT:B TR |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT53E256M32D2FW-046 AAT:B |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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В кошику
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| MT53E256M32D2FW-046 AUT:B TR |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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В кошику
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| MT53E256M32D2FW-046 AUT:B |
|
Виробник: Micron Technology Inc.
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: LPDDR4 8G 256MX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Grade: Automotive
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT53E1G32D2FW-046 WT:C TR |
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
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| MT53E1G32D2FW-046 WT:C |
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
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| MT53E1G32D2FW-046 IT:C TR |
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
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| MT53E1G32D2FW-046 IT:C |
Виробник: Micron Technology Inc.
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Memory Size: 32Gbit
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Interface: Parallel
Memory Organization: 1G x 32
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| MT48H32M16LFB4-6 AT:C TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 512MBIT PAR 54VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 54-VFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPSDR
Clock Frequency: 166 MHz
Memory Format: DRAM
Supplier Device Package: 54-VFBGA (8x8)
Grade: Automotive
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 512MBIT PAR 54VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 54-VFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPSDR
Clock Frequency: 166 MHz
Memory Format: DRAM
Supplier Device Package: 54-VFBGA (8x8)
Grade: Automotive
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MT40A256M16GE-075E AUT:B TR |
|
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PARALLEL 96FBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.14V ~ 1.26V
Technology: SDRAM - DDR4
Clock Frequency: 1.33 GHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (9x14)
Grade: Automotive
Memory Interface: Parallel
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 4GBIT PARALLEL 96FBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.14V ~ 1.26V
Technology: SDRAM - DDR4
Clock Frequency: 1.33 GHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (9x14)
Grade: Automotive
Memory Interface: Parallel
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| MTFC8GAMALBH-AIT ES TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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| MTFC8GAMALNA-AAT |
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT MMC 100TBGA
Packaging: Tray
Package / Case: 100-TBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-TBGA (14x18)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT MMC 100TBGA
Packaging: Tray
Package / Case: 100-TBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-TBGA (14x18)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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| MTFC8GAMALNA-AAT TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT MMC 100TBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-TBGA (14x18)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT MMC 100TBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-TBGA (14x18)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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| MTFC8GAMALBH-AAT ES TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
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| MTFC8GAMALNA-AAT ES TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT MMC 100TBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-TBGA (14x18)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT MMC 100TBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 100-TBGA (14x18)
Grade: Automotive
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| N2M400GDB321A3CF TR |
Виробник: Micron Technology Inc.
Description: IC FLASH 64GBIT MMC 52MHZ
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 52 MHz
Memory Format: FLASH
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT MMC 52MHZ
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 52 MHz
Memory Format: FLASH
Memory Interface: MMC
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.