Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (41581) > Сторінка 51 з 694
| Фото | Назва | Виробник | Інформація |
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9553-0-15-15-21-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT .015-.022 HEXSocket Depth: 0.154" (3.91mm) Tail Diameter: 0.018" (0.46mm) Pin Hole Diameter: 0.031" (0.79mm) Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm) Tail Type: Standard Tail Contact Material: Beryllium Copper Contact Finish Thickness: 30.0µin (0.76µm) Mounting Hole Diameter: 0.041" (1.04mm) Termination: Press-Fit, Hex Length - Overall: 0.352" (8.94mm) Flange Diameter: 0.055" (1.40mm) Contact Finish: Gold Packaging: Bulk |
на замовлення 103 шт: термін постачання 21-31 дні (днів) |
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| 9970-0-15-15-30-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN RECEPT PIN .015-.025" .120" |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 9976-0-00-01-00-00-03-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC .018DIA TINLEAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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9976-0-00-15-00-00-03-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC 0.018DIA GOLDPackaging: Bulk Contact Finish: Gold Mounting Type: Through Hole Insulation: Non-Insulated Terminal Type: PC Pin Flange Diameter: 0.060" (1.52mm) Length - Overall: 0.240" (6.10mm) Termination: Press-Fit Mounting Hole Diameter: 0.038" (0.97mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Brass Alloy Terminal Style: Single End Pin Size - Above Flange: 0.018" (0.46mm) Dia Pin Size - Below Flange: 0.030" (0.76mm) Dia Length - Above Flange: 0.205" (5.21mm) Part Status: Active |
на замовлення 4063 шт: термін постачання 21-31 дні (днів) |
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| 9976-0-00-21-00-00-03-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC 0.018DIA GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-306-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-308-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-314-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-316-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-318-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-320-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-324-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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101-93-422-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
на замовлення 486 шт: термін постачання 21-31 дні (днів) |
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| 101-93-624-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-628-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-632-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 101-93-640-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-210-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-210-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-304-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-304-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 4POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-306-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-306-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 6POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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104-13-308-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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| 104-13-308-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Press-Fit Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-310-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-310-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-314-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Press-Fit Number of Positions or Pins (Grid): 14 (2 x 7) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-314-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-316-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-316-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLDContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Press-Fit Number of Positions or Pins (Grid): 16 (2 x 8) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-318-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-318-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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104-13-320-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 104-13-320-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-322-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-322-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-324-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-324-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-328-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-328-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-420-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-420-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-422-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-422-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-424-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-424-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-428-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-428-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-432-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-432-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-624-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-624-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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104-13-628-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 104-13-628-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-632-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-632-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-636-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-636-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 104-13-640-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| 9553-0-15-15-21-27-04-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT .015-.022 HEX
Socket Depth: 0.154" (3.91mm)
Tail Diameter: 0.018" (0.46mm)
Pin Hole Diameter: 0.031" (0.79mm)
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Tail Type: Standard Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 30.0µin (0.76µm)
Mounting Hole Diameter: 0.041" (1.04mm)
Termination: Press-Fit, Hex
Length - Overall: 0.352" (8.94mm)
Flange Diameter: 0.055" (1.40mm)
Contact Finish: Gold
Packaging: Bulk
Description: CONN PIN RCPT .015-.022 HEX
Socket Depth: 0.154" (3.91mm)
Tail Diameter: 0.018" (0.46mm)
Pin Hole Diameter: 0.031" (0.79mm)
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Tail Type: Standard Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 30.0µin (0.76µm)
Mounting Hole Diameter: 0.041" (1.04mm)
Termination: Press-Fit, Hex
Length - Overall: 0.352" (8.94mm)
Flange Diameter: 0.055" (1.40mm)
Contact Finish: Gold
Packaging: Bulk
на замовлення 103 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 86.41 грн |
| 10+ | 67.55 грн |
| 25+ | 62.27 грн |
| 50+ | 54.95 грн |
| 100+ | 51.67 грн |
| 9970-0-15-15-30-27-04-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .015-.025" .120"
Description: CONN RECEPT PIN .015-.025" .120"
товару немає в наявності
В кошику
од. на суму грн.
| 9976-0-00-01-00-00-03-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC .018DIA TINLEAD
Description: CONN PC PIN CIRC .018DIA TINLEAD
товару немає в наявності
В кошику
од. на суму грн.
| 9976-0-00-15-00-00-03-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC 0.018DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.060" (1.52mm)
Length - Overall: 0.240" (6.10mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.038" (0.97mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.018" (0.46mm) Dia
Pin Size - Below Flange: 0.030" (0.76mm) Dia
Length - Above Flange: 0.205" (5.21mm)
Part Status: Active
Description: CONN PC PIN CIRC 0.018DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.060" (1.52mm)
Length - Overall: 0.240" (6.10mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.038" (0.97mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.018" (0.46mm) Dia
Pin Size - Below Flange: 0.030" (0.76mm) Dia
Length - Above Flange: 0.205" (5.21mm)
Part Status: Active
на замовлення 4063 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 47.13 грн |
| 10+ | 38.58 грн |
| 25+ | 36.16 грн |
| 50+ | 32.30 грн |
| 100+ | 30.76 грн |
| 250+ | 28.83 грн |
| 500+ | 27.00 грн |
| 1000+ | 25.71 грн |
| 3000+ | 23.79 грн |
| 9976-0-00-21-00-00-03-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC 0.018DIA GOLD
Description: CONN PC PIN CIRC 0.018DIA GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-306-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-308-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-314-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-316-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-318-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-320-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-324-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-422-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 486 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1083.29 грн |
| 18+ | 807.44 грн |
| 36+ | 759.30 грн |
| 54+ | 687.43 грн |
| 108+ | 646.48 грн |
| 252+ | 600.28 грн |
| 101-93-624-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-628-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-632-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 101-93-640-41-560000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-210-41-770000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-210-41-780000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-304-41-770000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-304-41-780000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-306-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-306-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-308-41-770000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1128.06 грн |
| 10+ | 941.72 грн |
| 25+ | 892.57 грн |
| 50+ | 825.50 грн |
| 104-13-308-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Press-Fit
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Press-Fit
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-310-41-770000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-310-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-314-41-770000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Press-Fit
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Press-Fit
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-314-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-316-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-316-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Press-Fit
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Press-Fit
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-318-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-318-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-320-41-770000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-320-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-322-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-322-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-324-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-324-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-328-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-328-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-420-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-420-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-422-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-422-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-424-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-424-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-428-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-428-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-432-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-432-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-624-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-624-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-628-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-628-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-632-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-632-41-780000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-636-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-636-41-780000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 104-13-640-41-770000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.


