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110-91-420-41-001000 110-91-420-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
1+1200.88 грн
20+936.12 грн
40+891.44 грн
В кошику  од. на суму  грн.
110-91-422-41-001000 110-91-422-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-424-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-428-41-001000 110-91-428-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-432-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-624-41-001000 110-91-624-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-91-628-41-001000 110-91-628-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
1+932.99 грн
10+796.38 грн
25+765.72 грн
50+689.85 грн
В кошику  од. на суму  грн.
110-91-632-41-001000 110-91-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+1297.46 грн
В кошику  од. на суму  грн.
110-91-636-41-001000 110-91-636-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-640-41-001000 110-91-640-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-642-41-001000 110-91-642-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-91-648-41-001000 110-91-648-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090M.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-91-650-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-652-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 52POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-950-41-001000 110-91-950-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-91-952-41-001000 110-91-952-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-91-964-41-001000 110-91-964-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-210-41-001000 110-93-210-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
1+1229.44 грн
10+1049.26 грн
40+968.55 грн
80+858.44 грн
В кошику  од. на суму  грн.
110-93-210-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-304-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-304-41-105000 110-93-304-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-306-41-001000 110-93-306-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
1+821.30 грн
10+671.85 грн
25+629.76 грн
В кошику  од. на суму  грн.
110-93-306-41-105000 110-93-306-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-306-41-605000 110-93-306-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-93-308-41-105000 110-93-308-41-105000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
1+1075.76 грн
10+880.00 грн
25+824.88 грн
50+737.15 грн
В кошику  од. на суму  грн.
110-93-308-41-605000 110-93-308-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
1+1166.45 грн
10+954.80 грн
25+895.04 грн
50+799.86 грн
В кошику  од. на суму  грн.
110-93-310-41-001000 110-93-310-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
1+1184.93 грн
10+1011.33 грн
40+933.54 грн
80+827.40 грн
В кошику  од. на суму  грн.
110-93-310-41-105000 110-93-310-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
1+1237.00 грн
10+1032.28 грн
40+964.21 грн
80+798.42 грн
280+745.19 грн
520+729.23 грн
1000+680.62 грн
В кошику  од. на суму  грн.
110-93-314-10-001000 110-93-314-10-001000 Mill-Max Manufacturing Corp. 090.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-314-10-002000 Mill-Max Manufacturing Corp. 134.PDF Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-314-41-105000 110-93-314-41-105000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-314-41-605000 110-93-314-41-605000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
1+1162.25 грн
10+950.68 грн
28+884.03 грн
В кошику  од. на суму  грн.
110-93-316-10-003000 110-93-316-10-003000 Mill-Max Manufacturing Corp. 2017-11%3A135.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-316-41-105000 110-93-316-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
1+1337.77 грн
10+1117.11 грн
25+1058.78 грн
50+979.22 грн
В кошику  од. на суму  грн.
110-93-316-41-605000 110-93-316-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
1+1299.98 грн
10+1020.39 грн
25+940.75 грн
В кошику  од. на суму  грн.
110-93-318-41-105000 110-93-318-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-318-41-605000 110-93-318-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-320-41-105000 110-93-320-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
1+1370.52 грн
20+1144.28 грн
40+1068.81 грн
В кошику  од. на суму  грн.
110-93-320-41-605000 110-93-320-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
1+1327.69 грн
20+1034.26 грн
40+984.89 грн
60+898.21 грн
В кошику  од. на суму  грн.
110-93-322-41-001000 110-93-322-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
1+1212.64 грн
18+952.17 грн
36+906.71 грн
54+826.90 грн
В кошику  од. на суму  грн.
110-93-322-41-105000 110-93-322-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+1404.11 грн
10+1172.18 грн
25+1110.99 грн
В кошику  од. на суму  грн.
110-93-322-41-801000 110-93-322-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-324-41-105000 110-93-324-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-324-41-605000 110-93-324-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A094.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-93-328-41-105000 110-93-328-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-420-41-001000 110-93-420-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 538 шт:
термін постачання 21-31 дні (днів)
1+1285.70 грн
20+948.82 грн
40+892.25 грн
60+807.79 грн
100+772.04 грн
260+712.33 грн
В кошику  од. на суму  грн.
110-93-420-41-105000 110-93-420-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-422-41-105000 110-93-422-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-422-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-422-41-801000 Mill-Max Manufacturing Corp. 098.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-424-41-105000 110-93-424-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
1+1415.03 грн
16+1064.93 грн
32+1001.47 грн
В кошику  од. на суму  грн.
110-93-428-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-428-41-105000 110-93-428-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-432-41-001000 110-93-432-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
1+1458.70 грн
12+1126.22 грн
36+1021.63 грн
В кошику  од. на суму  грн.
110-93-432-41-105000 110-93-432-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-624-41-105000 110-93-624-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-624-41-605000 110-93-624-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-628-41-105000 110-93-628-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-628-41-605000 110-93-628-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-632-41-105000 110-93-632-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
1+1582.14 грн
12+1320.30 грн
36+1251.43 грн
60+1157.39 грн
В кошику  од. на суму  грн.
110-91-420-41-001000 2017-11%3A090.pdf
110-91-420-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1200.88 грн
20+936.12 грн
40+891.44 грн
В кошику  од. на суму  грн.
110-91-422-41-001000 090.PDF
110-91-422-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-424-41-001000 090.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-428-41-001000 2017-11%3A090.pdf
110-91-428-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-432-41-001000 090.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-624-41-001000 2017-11%3A090.pdf
110-91-624-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-91-628-41-001000 2017-11%3A090.pdf
110-91-628-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+932.99 грн
10+796.38 грн
25+765.72 грн
50+689.85 грн
В кошику  од. на суму  грн.
110-91-632-41-001000 2017-11%3A090.pdf
110-91-632-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1297.46 грн
В кошику  од. на суму  грн.
110-91-636-41-001000 2017-11%3A090.pdf
110-91-636-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-640-41-001000 090.PDF
110-91-640-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-642-41-001000 2017-11%3A090.pdf
110-91-642-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-91-648-41-001000 2017-11%3A090M.pdf
110-91-648-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-91-650-41-001000 090.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-652-41-001000 090.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-91-950-41-001000 2017-11%3A090.pdf
110-91-950-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-91-952-41-001000 2017-11%3A090.pdf
110-91-952-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-91-964-41-001000 2017-11%3A090.pdf
110-91-964-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-210-41-001000 2017-11%3A090.pdf
110-93-210-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1229.44 грн
10+1049.26 грн
40+968.55 грн
80+858.44 грн
В кошику  од. на суму  грн.
110-93-210-41-105000 104.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-304-41-001000 090.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-304-41-105000 104.PDF
110-93-304-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-306-41-001000 2017-11%3A090.pdf
110-93-306-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+821.30 грн
10+671.85 грн
25+629.76 грн
В кошику  од. на суму  грн.
110-93-306-41-105000 104.PDF
110-93-306-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-306-41-605000 2017-11%3A094.pdf
110-93-306-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-93-308-41-105000 Mill%20Max%20catalog.pdf
110-93-308-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1075.76 грн
10+880.00 грн
25+824.88 грн
50+737.15 грн
В кошику  од. на суму  грн.
110-93-308-41-605000 2017-11%3A094.pdf
110-93-308-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1166.45 грн
10+954.80 грн
25+895.04 грн
50+799.86 грн
В кошику  од. на суму  грн.
110-93-310-41-001000 2017-11%3A090.pdf
110-93-310-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1184.93 грн
10+1011.33 грн
40+933.54 грн
80+827.40 грн
В кошику  од. на суму  грн.
110-93-310-41-105000 2017-11%3A104.pdf
110-93-310-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 1148 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1237.00 грн
10+1032.28 грн
40+964.21 грн
80+798.42 грн
280+745.19 грн
520+729.23 грн
1000+680.62 грн
В кошику  од. на суму  грн.
110-93-314-10-001000 090.pdf
110-93-314-10-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-314-10-002000 134.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-314-41-105000 Mill%20Max%20catalog.pdf
110-93-314-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-314-41-605000 Mill%20Max%20catalog.pdf
110-93-314-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1162.25 грн
10+950.68 грн
28+884.03 грн
В кошику  од. на суму  грн.
110-93-316-10-003000 2017-11%3A135.pdf
110-93-316-10-003000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-316-41-105000 2017-11%3A104.pdf
110-93-316-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1337.77 грн
10+1117.11 грн
25+1058.78 грн
50+979.22 грн
В кошику  од. на суму  грн.
110-93-316-41-605000 2017-11%3A094.pdf
110-93-316-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1299.98 грн
10+1020.39 грн
25+940.75 грн
В кошику  од. на суму  грн.
110-93-318-41-105000 2017-11%3A104.pdf
110-93-318-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-318-41-605000 2017-11%3A094.pdf
110-93-318-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-320-41-105000 2017-11%3A104.pdf
110-93-320-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1370.52 грн
20+1144.28 грн
40+1068.81 грн
В кошику  од. на суму  грн.
110-93-320-41-605000 2017-11%3A094.pdf
110-93-320-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1327.69 грн
20+1034.26 грн
40+984.89 грн
60+898.21 грн
В кошику  од. на суму  грн.
110-93-322-41-001000 2017-11%3A090.pdf
110-93-322-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1212.64 грн
18+952.17 грн
36+906.71 грн
54+826.90 грн
В кошику  од. на суму  грн.
110-93-322-41-105000 2017-11%3A104.pdf
110-93-322-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1404.11 грн
10+1172.18 грн
25+1110.99 грн
В кошику  од. на суму  грн.
110-93-322-41-801000 2017-11%3A098.pdf
110-93-322-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-324-41-105000 104.PDF
110-93-324-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-324-41-605000 2017-11%3A094.pdf
110-93-324-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-93-328-41-105000 104.PDF
110-93-328-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-420-41-001000 2017-11%3A090.pdf
110-93-420-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 538 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1285.70 грн
20+948.82 грн
40+892.25 грн
60+807.79 грн
100+772.04 грн
260+712.33 грн
В кошику  од. на суму  грн.
110-93-420-41-105000 104.pdf
110-93-420-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-422-41-105000 104.PDF
110-93-422-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-422-41-605000 094.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-422-41-801000 098.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-424-41-105000 2017-11%3A104.pdf
110-93-424-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1415.03 грн
16+1064.93 грн
32+1001.47 грн
В кошику  од. на суму  грн.
110-93-428-41-001000 090.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-428-41-105000 104.pdf
110-93-428-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-432-41-001000 2017-11%3A090.pdf
110-93-432-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1458.70 грн
12+1126.22 грн
36+1021.63 грн
В кошику  од. на суму  грн.
110-93-432-41-105000 104.PDF
110-93-432-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-624-41-105000 104.pdf
110-93-624-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-624-41-605000 094.pdf
110-93-624-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-628-41-105000 104.PDF
110-93-628-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-628-41-605000 094.PDF
110-93-628-41-605000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
110-93-632-41-105000 2017-11%3A104.pdf
110-93-632-41-105000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1582.14 грн
12+1320.30 грн
36+1251.43 грн
60+1157.39 грн
В кошику  од. на суму  грн.
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